High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Enhanced Heat Dissipation Performance of Automotive LED Lamps Using Graphene Coatings

Graphene heat-dissipating coating (GNHC) of 0.6 wt % GN concentration is utilized to promote the cooling performance of automotive light-emitting diode (LED) lamps. Three cases are studied as follows: Case 0 is the original automotive LED lamp as the baseline. Case 1 is to apply GNHC to reduce the thermal resistance of the junction surfaces between the components of automotive LED lamps. The aluminum fin radiator of Case 1 is further coated with GNHC on the surface that becomes Case 2. The spectrum, illuminance, power consumption, and surface temperature are measured at different ambient temperatures (T_a) to fully evaluate the feasibility of applying GNHC to improve cooling performance and the impacts on the related characteristics of automotive LED lamps. The results show that the maximum illuminance efficacy of Case 1 and Case 2 with high beam, irradiation angle of 0 degrees, and T_a of 80 °C is 11.03% and 8.70% higher than that of Case 0, respectively. The minimum temperature difference of heat dissipation path of Case 1 and Case 2 with high beam, irradiation angle of 90 degrees, and T_a of 80 °C is 6.41% and 5.33% lower than that of Case 0, respectively, indicating GNHC as a promising coating material for improving the cooling performance of automotive LED lamps.

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced thermal conductivity and the dielectric properties of nanocomposite films. The thermal conductivity of (CuNPs-CuNWs)@BN/PI composite comprising 10 wt % filler loading rose to 4.32 W/mK, indicating a nearly 24.1-fold increase relative to the value obtained for pure PI matrix. The relative permittivity and dielectric loss approximated 4.92 and 0.026 at 1 MHz, respectively. The results indicated that the surface modification of CuNPs and CuNWs by introducing a ceramic insulating layer BN effectively promoted the formation of thermal conductive networks of nanofillers in the PI matrix. This study enabled the identification of appropriate modifier fillers for polymer matrix nanocomposites to improve electronic applications.