Frequency-Stable Ionic-Type Hybrid Gate Dielectrics for High Mobility Solution-Processed Metal-Oxide Thin-Film Transistors

Role of Fluoride Doping in Low-Temperature Combustion-Synthesized ZrOx Dielectric Films

Zirconium oxide (ZrO_x) is an attractive metal oxide dielectric material for low-voltage, optically transparent, and mechanically flexible electronic applications due to the high dielectric constant (κ ∼ 14-30), negligible visible light absorption, and, as a thin film, good mechanical flexibility. In this contribution, we explore the effect of fluoride doping on structure-property-function relationships in low-temperature solution-processed amorphous ZrO_x. Fluoride-doped zirconium oxide (F:ZrO_x) films with a fluoride content between 1.7 and 3.2 in atomic (at) % were synthesized by a combustion synthesis procedure. Irrespective of the fluoride content, grazing incidence X-ray diffraction, atomic-force microscopy, and UV-vis spectroscopy data indicate that all F:ZrO_x films are amorphous, atomically smooth, and transparent in visible light. Impedance spectroscopy measurements reveal that unlike solution-processed fluoride-doped aluminum oxide (F:AlO_x), fluoride doping minimally affects the frequency-dependent capacitance instability of solution-processed F:ZrO_x films. This result can be rationalized by the relatively weak Zr-F versus Zr-O bonds and the large ionic radius of Zr⁺⁴, as corroborated by EXAFS analysis and MD simulations. Nevertheless, the performance of pentacene thin-film transistors (TFTs) with F:ZrO_x gate dielectrics indicates that fluoride incorporation reduces I-V hysteresis in the transfer curves and enhances bias stress stability versus TFTs fabricated with analogous, but undoped ZrO_x films as gate dielectrics, due to reduced trap density.

Enhanced Interfacial Integrity of Amorphous Oxide Thin-Film Transistors by Elemental Diffusion of Ternary Oxide Semiconductors

Low-temperature solution-processed oxide semiconductor and dielectric films typically possess a substantial number of defects and impurities due to incomplete metal-oxygen bond formation, causing poor electrical performance and stability. Here, we exploit a facile route to improve the film quality and the interfacial property of low-temperature solution-processed oxide thin films via elemental diffusion between metallic ion-doped InO_x (M:InO_x) ternary oxide semiconductor and AlO_x gate dielectric layers. Particularly, it was revealed that metallic dopants such as magnesium (Mg) and hafnium (Hf) having a small ionic radius, a high Gibbs energy of oxidation, and bonding dissociation energy could successfully diffuse into the low-quality AlO_x gate dielectric layer and effectively reduce the structural defects and residual impurities present in the bulk and at the semiconductor/dielectric interface. Through an extensive investigation on the compositional, structural, and electrical properties of M:InO_x/AlO_x thin-film transistors (TFTs), we provide direct evidences of elemental diffusion occurred between M:InO_x and AlO_x layers as well as its contribution to the electrical performance and operational stability. Using the elemental diffusion process, we demonstrate solution-processed Hf:InO_x TFTs using a low-temperature (180 °C) AlO_x gate dielectric having a field-effect mobility of 2.83 cm² V^-1·s^-1 and improved bias stability. Based on these results, it is concluded that the elemental diffusion between oxide semiconductor and gate dielectric layers can play a crucial role in realizing oxide TFTs with enhanced structural and interfacial integrity.

Frequency-Agile Low-Temperature Solution-Processed Alumina Dielectrics for Inorganic and Organic Electronics Enhanced by Fluoride Doping

The frequency-dependent capacitance of low-temperature solution-processed metal oxide (MO) dielectrics typically yields unreliable and unstable thin-film transistor (TFT) performance metrics, which hinders the development of next-generation roll-to-roll MO electronics and obscures intercomparisons between processing methodologies. Here, capacitance values stable over a wide frequency range are achieved in low-temperature combustion-synthesized aluminum oxide (AlO_x) dielectric films by fluoride doping. For an optimal F incorporation of ∼3.7 atomic % F, the F:AlO_x film capacitance of 166 ± 11 nF/cm² is stable over a 10^-1-10⁴ Hz frequency range, far more stable than that of neat AlO_x films (capacitance = 336 ± 201 nF/cm²) which falls from 781 ± 85 nF/cm² to 104 ± 4 nF/cm² over this frequency range. Importantly, both n-type/inorganic and p-type/organic TFTs exhibit reliable electrical characteristics with minimum hysteresis when employing the F:AlO_x dielectric with ∼3.7 atomic % F. Systematic characterization of film microstructural/compositional and electronic/dielectric properties by X-ray photoelectron spectroscopy, time-of-fight secondary ion mass spectrometry, cross-section transmission electron microscopy, solid-state nuclear magnetic resonance, and UV-vis absorption spectroscopy reveal that fluoride doping generates AlOF, which strongly reduces the mobile hydrogen content, suppressing polarization mechanisms at low frequencies. Thus, this work provides a broadly applicable anion doping strategy for the realization of high-performance solution-processed metal oxide dielectrics for both organic and inorganic electronics applications.

Evidence for Pseudocapacitance and Faradaic Charge Transfer in High-Mobility Thin-Film Transistors with Solution-Processed Oxide Dielectrics

In developing low-power electronics, low-voltage transistors have been intensively investigated. One of the most important findings is that some high-k oxide gate dielectrics can lead to remarkable enhancement of apparent mobility in thin-film transistors (TFTs), which is not clearly understood. Here, we investigate InO_x TFTs with solution-processed AlO_x dielectrics. At very low frequencies (<1 Hz), the AlO_x films feature strong voltage-dependent capacitance. Also, cyclic voltammograms show clear features of surface-controlled Faradaic charge transfer. The two independent experiments both point to the formation of pseudocapacitance, which is similar to the mechanism behind some supercapacitors. A physical model including charge transfer is established to describe ion distribution. The charge transfer is probably related to residual hydrogens, as revealed by secondary-ion mass spectroscopy. The results provide direct evidence of the formation of pseudocapacitance in TFTs with high apparent mobilities and advance the understanding of mechanisms, measurements, and applications of such TFTs for low-power electronics.

Suppression of Interfacial Disorders in Solution-Processed Metal Oxide Thin-Film Transistors by Mg Doping

The fabrication of high-performance metal oxide thin-film transistors (TFTs) using a low-temperature solution process may facilitate the realization of ultraflexible and wearable electronic devices. However, the development of highly stable oxide gate dielectrics at a low temperature has been a challenging issue since a considerable amount of residual impurities and defective bonding states is present in low-temperature-processed gate dielectrics causing a large counterclockwise hysteresis and a significant instability. Here, we report a new approach to effectively remove the residual impurities and suppress the relevant dipole disorder in a low-temperature-processed (180 °C) AlO_x gate dielectric layer by magnesium (Mg) doping. Mg is well known as a promising material for suppression of oxygen vacancy defects and improvement of operational stability due to a high oxygen vacancy formation energy (E_vo = 9.8 eV) and a low standard reduction potential (E⁰ = -2.38 V). Therefore, with an adequate control of Mg concentration in metal oxide (MO) films, oxygen-related defects could be easily suppressed without additional treatments and then stable metal-oxygen-metal (M-O-M) network formation could be achieved, causing excellent operational stability. By optimal Mg doping (10%) in the InO_x channel layer, Mg:InO_x TFTs exhibited negligible clockwise hysteresis and a field-effect mobility of >4 cm² V^-1 s^-1. Furthermore, the electric characteristics of the low-temperature-processed AlO_x gate dielectric with high impurities were improved by Mg diffusion originating in Mg doping, resulting in stable threshold voltage shift in the bias stability test.