A Multiscale Topographical Analysis Based on Morphological Information: The HEVC Multiscale Decomposition

Wafer defect recognition method based on multi-scale feature fusion

Wafer defect recognition is an important process of chip manufacturing. As different process flows can lead to different defect types, the correct identification of defect patterns is important for recognizing manufacturing problems and fixing them in good time. To achieve high precision identification of wafer defects and improve the quality and production yield of wafers, this paper proposes a Multi-Feature Fusion Perceptual Network (MFFP-Net) inspired by human visual perception mechanisms. The MFFP-Net can process information at various scales and then aggregate it so that the next stage can abstract features from the different scales simultaneously. The proposed feature fusion module can obtain higher fine-grained and richer features to capture key texture details and avoid important information loss. The final experiments show that MFFP-Net achieves good generalized ability and state-of-the-art results on real-world dataset WM-811K, with an accuracy of 96.71%, this provides an effective way for the chip manufacturing industry to improve the yield rate.

Surface Inspection and Description in Metrology and Tribology-Vol.1

The primary goal of this Special Issue was to present recent trends in surface inspection and description, from both metrological and tribological points of view [...].

Effects of Heat Treatment of Selective Laser Melting Printed Ti-6Al-4V Specimens on Surface Texture Parameters and Cell Attachment

Selective laser melting (SLM) is extensively used for fabricating metallic biomedical products. After 3D printing, it is almost always advisable to apply a heat treatment to release the internal tensions or optimize the mechanical properties of the printed parts. The aim of this paper is to investigate the effects of heat treatment of SLM printed Ti-6Al-4V (Ti64) circular specimens on the areal surface texture parameters and cell attachment. Areal surface texture parameters, including the arithmetic mean height (Sa), root-mean-square height (Sq), skewness (Ssk), and kurtosis (Sku) were characterized. In addition, wavelet-based multi-resolution analysis was applied to investigate the characteristic length scales of untreated and heat-treated Ti64 specimens. In this study, the vertical distance between the highest and lowest position of cell attachment for each sampling area was defined as ΔH. Results showed that an increase in the periodic characteristic length scale was primarily due to the formation of large-scale aggregations of Ti64 metal powder particles on the heat-treated surface. In addition, MG-63 cells preferred lying in concave hollows; in heat-treated specimens, values of ΔH statistically significantly decreased from 31.6 ± 4.2 to 8.8 ± 2.8 μm, while Sku decreased from 3.3 ± 1.4 to 2.6 ± 0.6, indicating a strong influence of Sku on cell attachment.