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Huang JH, Shih PS, Renganathan V, Gräfner SJ, Lin YC, Kao CL, Lin YS, Hung YC, Kao CR. A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. MATERIALS (BASEL, SWITZERLAND) 2024; 17:1638. [PMID: 38612152 PMCID: PMC11012947 DOI: 10.3390/ma17071638] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/23/2024] [Revised: 03/29/2024] [Accepted: 04/01/2024] [Indexed: 04/14/2024]
Abstract
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper-quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa.
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Affiliation(s)
- Jeng-Hau Huang
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
| | - Po-Shao Shih
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
| | - Vengudusamy Renganathan
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
| | - Simon Johannes Gräfner
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
| | - Yu-Chun Lin
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
| | - Chin-Li Kao
- Advanced Semiconductor Engineering Group, Kaohsiung 811, Taiwan; (C.-L.K.); (Y.-S.L.); (Y.-C.H.)
| | - Yung-Sheng Lin
- Advanced Semiconductor Engineering Group, Kaohsiung 811, Taiwan; (C.-L.K.); (Y.-S.L.); (Y.-C.H.)
| | - Yun-Ching Hung
- Advanced Semiconductor Engineering Group, Kaohsiung 811, Taiwan; (C.-L.K.); (Y.-S.L.); (Y.-C.H.)
| | - Chengheng Robert Kao
- Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan; (J.-H.H.); (P.-S.S.); (V.R.); (S.J.G.); (Y.-C.L.)
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Buylov NS, Sotskaya NV, Kozaderov OA, Shikhaliev KS, Potapov AY, Polikarchuk VA, Rodivilov SV, Pobedinskiy VV, Grechkina MV, Seredin PV. Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications. MICROMACHINES 2023; 14:1151. [PMID: 37374736 DOI: 10.3390/mi14061151] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/30/2023] [Revised: 05/24/2023] [Accepted: 05/28/2023] [Indexed: 06/29/2023]
Abstract
In our work, we studied thin nickel films deposited by electroless plating for use as a barrier and seed layer in the through-silicon vias (TSV) technology. El-Ni coatings were deposited on a copper substrate from the original electrolyte and with the use of various concentrations of organic additives in the composition of the electrolyte. The surface morphology, crystal state, and phase composition of the deposited coatings were studied by SEM, AFM, and XRD methods. The El-Ni coating deposited without the use of an organic additive has an irregular topography with rare phenocrysts of globular formations of hemispherical shape and a root mean square roughness value of 13.62 nm. The phosphorus concentration in the coating is 9.78 wt.%. According to the results of the X-ray diffraction studies of El-Ni, the coating deposited without the use of an organic additive has a nanocrystalline structure with an average nickel crystallite size of 2.76 nm. The influence of the organic additive is seen in the smoothening of the samples surface. The root mean square roughness values of the El-Ni sample coatings vary within 2.09-2.70 nm. According to microanalysis data the phosphorus concentration in the developed coatings is ~4.7-6.2 wt.%. The study of the crystalline state of the deposited coatings by X-ray diffraction made it possible to detect two arrays of nanocrystallites in their structure, with average sizes of 4.8-10.3 nm and 1.3-2.6 nm.
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Affiliation(s)
- Nikita S Buylov
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
- Department of Solid-State Physics and Nanostructures, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Nadezhda V Sotskaya
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Oleg A Kozaderov
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Khidmet S Shikhaliev
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Andrey Yu Potapov
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Vladimir A Polikarchuk
- Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Sergey V Rodivilov
- Research Institute of Electronic Technology, St. Staryh Bolshevikov, 5, Voronezh 394033, Russia
| | - Vitaly V Pobedinskiy
- Research Institute of Electronic Technology, St. Staryh Bolshevikov, 5, Voronezh 394033, Russia
| | - Margaryta V Grechkina
- Department of Semiconductor and Microelectronics Physics, Voronezh State University, University sq. 1, Voronezh 394018, Russia
| | - Pavel V Seredin
- Department of Solid-State Physics and Nanostructures, Voronezh State University, University sq. 1, Voronezh 394018, Russia
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Huang J, Shih P, Renganathan V, Grӓfner S, Chen Y, Huang C, Kao C, Lin Y, Hung Y, Kao C. Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140710] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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