Study on Rheological Properties of Bituminous Binders and Mixtures Containing Waste Printed Circuit Boards (PCBs) and SBR Compound Modified Bitumen

High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites

The reutilization non-metallic components from a waste-printed circuit board (WPCB) has become one of the most significant bottlenecks in the comprehensive reuse of electronic wastes due to its low value and complex compositions, and it has received great attention from scientific and industrial researchers. To effectively address the environmental pollution caused by inappropriate recycling methods, such as incineration and landfill, extensive efforts have been dedicated to achieving the high value-added reutilization of WPCB non-metals in sustainable polymer composites. In this review, recent progress in developing sustainable polymer composites based on WPCB non-metallic components was systematically summarized. It has been demonstrated that the WPCB non-metals can serve as a promising reinforcing and functional fillers to significantly ameliorate some of the physical and chemical properties of polymer composites, such as excellent mechanical properties, enhanced thermal stability, and flame retardancy. The recovery strategies and composition of WPCB non-metals were also briefly discussed. Finally, the future potentials and remaining challenges regarding the reutilization of WPCB non-metallic components are outlined. This work provides readers with a comprehensive understanding of the preparation, structure, and properties of the polymer composites based on WPCB non-metals, providing significant insights regarding the high value-added reutilization of WPCB non-metals of electronic wastes.

Recycling Non-Metallic Powder of Waste Printed Circuit Boards to Improve the Performance of Asphalt Material

Non-metallic fractions (NMFs) from waste printed circuit boards (PCBs) are mostly composed of cured resin and fiber. In this study, NMF material from a PCB was ground into powder and added into matrix asphalt to produce PCB-NMF-modified asphalt. To improve the compatibility of PCB-NMF and asphalt, a compatibilizer consisting of tung oil and glycerol was also developed. The optimum compatibilizer content was determined to be 8% by weight of the PCB-NMF through a series of laboratory tests, including the softening point, penetration, ductility, and softening point difference (SPD). The micro-mechanism of NMF powder-modified asphalt was analyzed through Fourier transform infrared spectroscopy (FTIR) and a scanning electron microscope test (SEM). The performances of PCB-NMF-modified asphalt were evaluated by the dynamic shear rheology (DSR) test and the low-temperature bending beam rheometer (BBR) test. The optimum compatibilizer content was 8% by weight of the NMF powder and the optimum content of NMF powder was determined to be 30% by weight of the asphalt based on a comprehensive evaluation. The results show that PCB-NMF can significantly improve stiffness, rutting resistance, high-temperature stability, and temperature sensitivity of asphalt material at an appropriate content. The BBR tests revealed that PCB-NMF slightly weakened the cracking resistance of asphalt at low temperatures. The SEM test showed that the addition of a compatibilizer can increase the compatibility by making the NMF powder evenly dispersed. The FTIR test results implied that a chemical reaction may not have happened between PCB-NMF, compatibilizer, and the matrix asphalt. Overall, it is a promising and sustainable way to utilize PCB-NMF as a modifier for asphalt material and reduce electronic waste treatment at a low cost.