Optically Transparent and Highly Conductive Electrodes for Acousto-Optical Devices

Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coating

Silver nanoparticle photoreduction synthesis by direct laser writing is a process that enables copper micro-track production on very specific polymers. However, some important 3D printing polymers, such as acrylonitrile butadiene styrene (ABS) and acrylates, do not accept this treatment on their surface. This work presents an approach to produce copper microcircuitry on 3D substrates from these materials by using direct laser writing at low power (32 mW CW diode laser). We show that by coating a thin layer of polyimide (PI) on a 3D-printed geometry, followed by a sequence of chemical treatments and low-power laser-induced photoreduction, copper tracks can be produced using silver as catalyst. The surface chemistry of the layer through the different stages of the process is monitored by FTIR and X-ray photoelectron spectroscopy. The copper tracks are selectively grown on the laser-patterned areas by electroless copper deposition, with conductivity (1.2 ± 0.7) × 10⁷ S m^-1 and a width as small as 28 μm. The patterns can be written on 3D structures and even inside cavities. The technique is demonstrated by integrating different circuits, including a LED circuit on 3D printed photopolymer acrylate and a perovskite solar cell on an ABS 3D curved geometry.

Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurable resin layer. The influence of the mesh size on the optoelectric characteristics and the electromagnetic shielding efficiency in a wide frequency range is considered. In optimizing the coating properties, a shielding efficiency of 49.38 dB at a frequency of 1 GHz, with integral optical transparency in the visible range of 84.3%, was obtained. Embedded Cu meshes have been shown to be highly bending stable and have excellent adhesion strength. The combination of properties and economic costs for the formation of coatings indicates their high prospects for practical use in shielding transparent objects, such as windows and computer monitors.