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Ji D, Zhu Y, Li M, Fan X, Zhang T, Li Y. Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin. MATERIALS (BASEL, SWITZERLAND) 2024; 17:2920. [PMID: 38930289 PMCID: PMC11204911 DOI: 10.3390/ma17122920] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/12/2024] [Revised: 04/30/2024] [Accepted: 05/20/2024] [Indexed: 06/28/2024]
Abstract
The field of electronic skin has received considerable attention due to its extensive potential applications in areas including tactile sensing and health monitoring. With the development of electronic skin devices, electronic skin can be attached to the surface of human skin for long-term health monitoring, which makes comfort an essential factor that cannot be ignored in the design of electronic skin. Therefore, this paper proposes an assessment method for evaluating the comfort of electronic skin based on neurodynamic analysis. The holistic analysis framework encompasses the mechanical model of the skin, the modified Hodgkin-Huxley model for the transduction of stimuli, and the gate control theory for the modulation and perception of pain sensation. The complete process, from mechanical stimulus to the generation of pain perception, is demonstrated. Furthermore, the influence of different factors on pain perception is investigated. Sensation and comfort diagrams are provided to assess the mechanical comfort of electronic skin. The comfort assessment method proposed in this paper provides a theoretical basis when assessing the comfort of electronic skin.
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Affiliation(s)
- Dongcan Ji
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
| | - Yunfan Zhu
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
| | - Min Li
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
- International Innovation Institute, Beihang University (BUAA), Yuhang District, Hangzhou 311115, China
| | - Xuanqing Fan
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
- International Innovation Institute, Beihang University (BUAA), Yuhang District, Hangzhou 311115, China
| | - Taihua Zhang
- Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100094, China
| | - Yuhang Li
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
- Aircraft and Propulsion Laboratory, Ningbo Institute of Technology, Beihang University (BUAA), Ningbo 315100, China
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Zhao C, Wang Y, Gao L, Xu Y, Fan Z, Liu X, Ni Y, Xuan S, Deng H, Gong X. High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications. ACS APPLIED MATERIALS & INTERFACES 2022; 14:21564-21576. [PMID: 35475337 DOI: 10.1021/acsami.2c04994] [Citation(s) in RCA: 8] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/11/2023]
Abstract
With the combination of high flexibility and thermal property, thermally conductive elastomers have played an important role in daily life. However, traditional thermally conductive elastomers display limited stretchability and toughness, seriously restricting their further development in practical applications. Herein, a high-performance composite is fabricated by dispersing room-temperature liquid metal microdroplets (LM) into a polyborosiloxane elastomer (PBSE). Due to the unique solid-liquid coupling mechanism, the LM can deform with the PBSE matrix, achieving higher fracture strain (401%) and fracture toughness (2164 J/m2). Meanwhile, the existence of LM microdroplets improves the thermal conductivity of the composite. Interestingly, the LM/PBSE also exhibits remarkable anti-impact, adhesion capacities under complex loading environments. As a novel stretchable elastomer with enhanced mechanical and thermal behavior, the LM/PBSE shows good application prospects in the fields of thermal camouflages, stretchable heat-dissipation matrixes, and multifunctional shells for electronic devices.
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Affiliation(s)
- Chunyu Zhao
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Yu Wang
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Liang Gao
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Yunqi Xu
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Ziyang Fan
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Xujing Liu
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Yong Ni
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Shouhu Xuan
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Huaxia Deng
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
| | - Xinglong Gong
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China
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