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Liu Y, Zhu H, Xing L, Bu Q, Ren D, Sun B. Recent advances in inkjet-printing technologies for flexible/wearable electronics. NANOSCALE 2023; 15:6025-6051. [PMID: 36892458 DOI: 10.1039/d2nr05649f] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
The rapid development of flexible/wearable electronics requires novel fabricating strategies. Among the state-of-the-art techniques, inkjet printing has aroused considerable interest due to the possibility of large-scale fabricating flexible electronic devices with good reliability, high time efficiency, a low manufacturing cost, and so on. In this review, based on the working principle, recent advances in the inkjet printing technology in the field of flexible/wearable electronics are summarized, including flexible supercapacitors, transistors, sensors, thermoelectric generators, wearable fabric, and for radio frequency identification. In addition, some current challenges and future opportunities in this area are also addressed. We hope this review article can give positive suggestions to the researchers in the area of flexible electronics.
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Affiliation(s)
- Yu Liu
- College of Electronics and Information, Qingdao University, Qingdao 266071, PR. China.
| | - Hongze Zhu
- College of Physics, Qingdao University, Qingdao 266071, PR China
| | - Lei Xing
- College of Electronics and Information, Qingdao University, Qingdao 266071, PR. China.
| | - Qingkai Bu
- College of Computer Science and Technology, Qingdao University, Qingdao 266071, PR. China
- Weihai Innovation Research Institute of Qingdao University, Weihai 264200, PR. China
| | - Dayong Ren
- State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, PR. China.
| | - Bin Sun
- College of Electronics and Information, Qingdao University, Qingdao 266071, PR. China.
- Weihai Innovation Research Institute of Qingdao University, Weihai 264200, PR. China
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2
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Zheng W, Saiz F, Shen Y, Zhu K, Liu Y, McAleese C, Conran B, Wang X, Lanza M. Defect-Free Metal Deposition on 2D Materials via Inkjet Printing Technology. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2104138. [PMID: 34734445 DOI: 10.1002/adma.202104138] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/31/2021] [Revised: 10/30/2021] [Indexed: 06/13/2023]
Abstract
2D materials have many outstanding properties that make them attractive for the fabrication of electronic devices, such as high conductivity, flexibility, and transparency. However, integrating 2D materials in commercial devices and circuits is challenging because their structure and properties can be damaged during the fabrication process. Recent studies have demonstrated that standard metal deposition techniques (like electron beam evaporation and sputtering) significantly damage the atomic structure of 2D materials. Here it is shown that the deposition of metal via inkjet printing technology does not produce any observable damage in the atomic structure of ultrathin 2D materials, and it can keep a sharp interface. These conclusions are supported by abundant data obtained via atomistic simulations, transmission electron microscopy, nanochemical metrology, and device characterization in a probe station. The results are important for the understanding of inkjet printing technology applied to 2D materials, and they could contribute to the better design and optimization of electronic devices and circuits.
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Affiliation(s)
- Wenwen Zheng
- Institute of Functional Nano and Soft Materials (FUNSOM), Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, 199 Ren-Ai Road, Suzhou, 215123, China
| | - Fernan Saiz
- Institute of Material Science and Engineering, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955-6900, Saudi Arabia
| | - Yaqing Shen
- Institute of Functional Nano and Soft Materials (FUNSOM), Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, 199 Ren-Ai Road, Suzhou, 215123, China
| | - Kaichen Zhu
- MIND, Department of Electronic and Biomedical Engineering, Universitat de Barcelona, Martí i Franquès 1, Barcelona, E-08028, Spain
| | - Yingwen Liu
- Institute of Functional Nano and Soft Materials (FUNSOM), Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, 199 Ren-Ai Road, Suzhou, 215123, China
| | - Clifford McAleese
- Aixtron Ltd, Anderson Road, Buckingway Business Park, Swavesy, CB24 4FQ, UK
| | - Ben Conran
- Aixtron Ltd, Anderson Road, Buckingway Business Park, Swavesy, CB24 4FQ, UK
| | - Xiaochen Wang
- Aixtron Ltd, Anderson Road, Buckingway Business Park, Swavesy, CB24 4FQ, UK
| | - Mario Lanza
- Institute of Material Science and Engineering, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955-6900, Saudi Arabia
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Jäger J, Schwenck A, Walter D, Bülau A, Gläser K, Zimmermann A. Inkjet-Printed Temperature Sensors Characterized according to Standards. SENSORS (BASEL, SWITZERLAND) 2022; 22:8145. [PMID: 36365843 PMCID: PMC9654304 DOI: 10.3390/s22218145] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 09/20/2022] [Revised: 10/14/2022] [Accepted: 10/20/2022] [Indexed: 06/16/2023]
Abstract
This paper describes the characterization of inkjet-printed resistive temperature sensors according to the international standard IEC 61928-2. The goal is to evaluate such sensors comprehensively, to identify important manufacturing processes, and to generate data for inkjet-printed temperature sensors according to the mentioned standard for the first time, which will enable future comparisons across different publications. Temperature sensors were printed with a silver nanoparticle ink on injection-molded parts. After printing, the sensors were sintered with different parameters to investigate their influences on the performance. Temperature sensors were characterized in a temperature range from 10 °C to 85 °C at 60% RH. It turned out that the highest tested sintering temperature of 200 °C, the longest dwell time of 24 h, and a coating with fluoropolymer resulted in the best sensor properties, which are a high temperature coefficient of resistance, low hysteresis, low non-repeatability, and low maximum error. The determined hysteresis, non-repeatability, and maximum error are below 1.4% of the full-scale output (FSO), and the temperature coefficient of resistance is 1.23-1.31 × 10-3 K-1. These results show that inkjet printing is a capable technology for the manufacturing of temperature sensors for applications up to 85 °C, such as lab-on-a-chip devices.
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Affiliation(s)
- Jonas Jäger
- Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
| | | | - Daniela Walter
- Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
| | - André Bülau
- Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
| | - Kerstin Gläser
- Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
| | - André Zimmermann
- Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
- Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9b, 70569 Stuttgart, Germany
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Zhong H, Fu R, Chen S, Zhou Z, Zhang Y, Yin X, He B. Large-area flexible MWCNT/PDMS pressure sensor for ergonomic design with aid of deep learning learning. NANOTECHNOLOGY 2022; 33:345502. [PMID: 35417891 DOI: 10.1088/1361-6528/ac66ec] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/31/2022] [Accepted: 04/13/2022] [Indexed: 06/14/2023]
Abstract
The achievement of well-performing pressure sensors with low pressure detection, high sensitivity, large-scale integration, and effective analysis of the subsequent data remains a major challenge in the development of flexible piezoresistive sensors. In this study, a simple and extendable sensor preparation strategy was proposed to fabricate flexible sensors on the basis of multiwalled carbon nanotube/polydimethylsiloxane (MWCNT/PDMS) composites. A dispersant of tetrahydrofuran (THF) was added to solve the agglomeration of MWCNTs in PDMS, and the resistance of the obtained MWCNT/PDMS conductive unit with 7.5 wt.% MWCNTs were as low as 180 Ω/hemisphere. Sensitivity (0.004 kPa-1), excellent response stability, fast response time (36 ms), and excellent electromechanical properties were demonstrated within the pressure range from 0 to 100 kPa. A large-area flexible sensor with 8 × 10 pixels was successfully adopted to detect the pressure distribution on the human back and to verify its applicability. Combining the sensor array with deep learning, inclination of human sitting was easily recognized with high accuracy, indicating that the combined technology can be used to guide ergonomic design.
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Affiliation(s)
- Hongchuan Zhong
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
| | - Rongda Fu
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
| | - Shiqi Chen
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
| | - Zaiwei Zhou
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
| | - Yue Zhang
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
- Fujian Engineering Research Center of Joint Intelligent Medical Engineering, Fuzhou 350108, People's Republic of China
| | - Xiangyu Yin
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
- Fujian Engineering Research Center of Joint Intelligent Medical Engineering, Fuzhou 350108, People's Republic of China
| | - Bingwei He
- College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, People's Republic of China
- Fujian Engineering Research Center of Joint Intelligent Medical Engineering, Fuzhou 350108, People's Republic of China
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Qiu Y, Xu X, Cheng X. The Recognition of Microscopic Images of Ceramics Incorporating Blockchain Technology. INTERNATIONAL JOURNAL OF COGNITIVE INFORMATICS AND NATURAL INTELLIGENCE 2022. [DOI: 10.4018/ijcini.296728] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
Abstract
Having summarized the previous research on ceramic identification and the anti-counterfeiting, the authors propose a ceramic identification system that combines computer vision algorithms with blockchain technology. The system uses irregular pores on microscopic images of ceramic surfaces as image features, and it applies the SIFT(Scale-invariant feature transform) algorithm to extract feature. The images and feature vector sets are then stored by IPFS(Inter-planetary File System). When a consumer needs to authenticate a ceramic product, it is only necessary to take a microscopic image of the specified location, and then the SIFT algorithm will compare the picture with the data stored in the IPFS network, and was previously obtained through the records on a blockchain network, the matching result then determines whether the photographed ceramic is one of those already recorded. Experimental show that the matching results can be used as a strong basis for identifying the origin of ceramic products.
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Affiliation(s)
| | - Xing Xu
- School of Physics and Information Engineering, Minnan Normal University, China
| | - Xien Cheng
- School of Information Engineering, Jingdezhen Ceramic Institute, China
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Hermawan A, Amrillah T, Riapanitra A, Ong W, Yin S. Prospects and Challenges of MXenes as Emerging Sensing Materials for Flexible and Wearable Breath-Based Biomarker Diagnosis. Adv Healthc Mater 2021; 10:e2100970. [PMID: 34318999 DOI: 10.1002/adhm.202100970] [Citation(s) in RCA: 13] [Impact Index Per Article: 4.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/18/2021] [Revised: 06/21/2021] [Indexed: 12/20/2022]
Abstract
A fully integrated, flexible, and functional sensing device for exhaled breath analysis drastically transforms conventional medical diagnosis to non-invasive, low-cost, real-time, and personalized health care. 2D materials based on MXenes offer multiple advantages for accurately detecting various breath biomarkers compared to conventional semiconducting oxides. High surface sensitivity, large surface-to-weight ratio, room temperature detection, and easy-to-assemble structures are vital parameters for such sensing devices in which MXenes have demonstrated all these properties both experimentally and theoretically. So far, MXenes-based flexible sensor is successfully fabricated at a lab-scale and is predicted to be translated into clinical practice within the next few years. This review presents a potential application of MXenes as emerging materials for flexible and wearable sensor devices. The biomarkers from exhaled breath are described first, with emphasis on metabolic processes and diseases indicated by abnormal biomarkers. Then, biomarkers sensing performances provided by MXenes families and the enhancement strategies are discussed. The method of fabrications toward MXenes integration into various flexible substrates is summarized. Finally, the fundamental challenges and prospects, including portable integration with Internet-of-Thing (IoT) and Artificial Intelligence (AI), are addressed to realize marketization.
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Affiliation(s)
- Angga Hermawan
- Faculty of Textile Science and Technology Shinshu University 3‐15‐1 Tokida Ueda Nagano 386‐8567 Japan
- Institute of Multidisciplinary Research for Advanced Material (IMRAM) Tohoku University 2‐1‐1 Katahira, Aoba‐ku Sendai Miyagi 980‐8577 Japan
| | - Tahta Amrillah
- Department of Nanotechnology Faculty of Advanced Technology and Multidiscipline Universitas Airlangga Surabaya 60115 Indonesia
| | - Anung Riapanitra
- Department of Chemistry Faculty of Mathematics and Natural Science Jenderal Soedirman University Purwokerto 53122 Indonesia
| | - Wee‐Jun Ong
- School of Energy and Chemical Engineering Xiamen University Malaysia Selangor Darul Ehsan 43900 Malaysia
- Center of Excellence for NaNo Energy & Catalysis Technology (CONNECT) Xiamen University Malaysia Sepang Selangor Darul Ehsan 43900 Malaysia
| | - Shu Yin
- Institute of Multidisciplinary Research for Advanced Material (IMRAM) Tohoku University 2‐1‐1 Katahira, Aoba‐ku Sendai Miyagi 980‐8577 Japan
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Integrated Fabrication of Novel Inkjet-Printed Silver Nanoparticle Sensors on Carbon Fiber Reinforced Nylon Composites. MICROMACHINES 2021; 12:mi12101185. [PMID: 34683236 PMCID: PMC8541134 DOI: 10.3390/mi12101185] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/02/2021] [Revised: 09/26/2021] [Accepted: 09/29/2021] [Indexed: 11/17/2022]
Abstract
Inkjet-printing technology enables the contactless deposition of functional materials such as conductive inks on surfaces, hence reducing contamination and the risk of substrate damage. In printed electronics, inkjet technology offers the significant advantage of controlling the volume of material deposited, and therefore the fine-tuning of the printed geometry, which is crucial for the performance of the final printed electronics. Inkjet printing of functional inks can be used to produce sensors to detect failure of mechanical structures such as carbon fiber reinforced composite (CFRC) components, instead of using attached sensors, which are subject to delamination. Here, silver nanoparticle-based strain sensors were embedded directly in an insulated carbon-fiber laminate by using inkjet printing to achieve an optimized conductive and adhesive geometry, forming a piezoresistive strain sensor. Following the inkjet-printing optimization process, the sensor conductivity and adhesion performance were evaluated. Finally, the sensor was quantified by using a bending rig which applied a pre-determined strain, with the response indicating an accurate sensitivity as the resistance increased with an increased strain. The ability to embed the sensor directly on the CFRC prevents the use of interfacial adhesives which is the main source of failure due to delamination.
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CPW-Fed Flexible Ultra-Wideband Antenna for IoT Applications. MICROMACHINES 2021; 12:mi12040453. [PMID: 33920716 PMCID: PMC8073834 DOI: 10.3390/mi12040453] [Citation(s) in RCA: 16] [Impact Index Per Article: 5.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/18/2021] [Revised: 04/02/2021] [Accepted: 04/14/2021] [Indexed: 11/28/2022]
Abstract
In this article, an inkjet-printed circular-shaped monopole ultra-wideband (UWB) antenna with an inside-cut feed structure was implemented on a flexible polyethylene terephthalate (PET) substrate. The coplanar waveguide (CPW)-fed antenna was designed using ANSYS high-frequency structural simulator (HFSS), which operates at 3.04–10.70 GHz and 15.18–18 GHz (upper Ku band) with a return loss < −10 dB and a VSWR < 2. The antenna, with the dimensions of 47 mm × 25 mm × 0.135 mm, exhibited omnidirectional radiation characteristics over the entire impedance bandwidth, with an average peak gain of 3.94 dBi. The simulated antenna structure was in good agreement with the experiment’s measured results under flat and bending conditions, making it conducive for flexible and wearable Internet of things (IoT) applications.
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Kirtania SG, Elger AW, Hasan MR, Wisniewska A, Sekhar K, Karacolak T, Sekhar PK. Flexible Antennas: A Review. MICROMACHINES 2020; 11:E847. [PMID: 32933077 PMCID: PMC7570180 DOI: 10.3390/mi11090847] [Citation(s) in RCA: 32] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 07/30/2020] [Revised: 08/25/2020] [Accepted: 09/04/2020] [Indexed: 11/25/2022]
Abstract
The field of flexible antennas is witnessing an exponential growth due to the demand for wearable devices, Internet of Things (IoT) framework, point of care devices, personalized medicine platform, 5G technology, wireless sensor networks, and communication devices with a smaller form factor to name a few. The choice of non-rigid antennas is application specific and depends on the type of substrate, materials used, processing techniques, antenna performance, and the surrounding environment. There are numerous design innovations, new materials and material properties, intriguing fabrication methods, and niche applications. This review article focuses on the need for flexible antennas, materials, and processes used for fabricating the antennas, various material properties influencing antenna performance, and specific biomedical applications accompanied by the design considerations. After a comprehensive treatment of the above-mentioned topics, the article will focus on inherent challenges and future prospects of flexible antennas. Finally, an insight into the application of flexible antenna on future wireless solutions is discussed.
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Affiliation(s)
- Sharadindu Gopal Kirtania
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
| | - Alan Wesley Elger
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
| | - Md. Rabiul Hasan
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
| | - Anna Wisniewska
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
| | - Karthik Sekhar
- Department of ECE, Faculty of Engineering and Technology, SRM Institute of Science and Technology, Vadapalani Campus, No.1, Jawaharlal Nehru Road, Vadapalani, Chennai, TN 600026, India;
| | - Tutku Karacolak
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
| | - Praveen Kumar Sekhar
- School of Engineering and Computer Science, Washington State University Vancouver, Vancouver, WA 98686, USA; (S.G.K.); (A.W.E.); (M.R.H.); (A.W.); (T.K.)
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