Hsu SLC, Chen YT, Chen ML, Chen IG. Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate.
MATERIALS 2021;
14:ma14205941. [PMID:
34683538 PMCID:
PMC8537409 DOI:
10.3390/ma14205941]
[Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/21/2021] [Revised: 10/05/2021] [Accepted: 10/05/2021] [Indexed: 11/16/2022]
Abstract
A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10-7 Ω∙m, and the shear strength was 57.48 MPa.
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