Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

Editorial for the Special Issue on Wearable and Implantable Bio-MEMS Devices and Applications

Wearable and implantable bio-MEMS sensors and actuators have attracted tremendous attention in the fields of health monitoring, disease treatment, and human-machine interaction, to name but a few [...].

Flexible high-density microelectrode arrays for closed-loop brain-machine interfaces: a review

Flexible high-density microelectrode arrays (HDMEAs) are emerging as a key component in closed-loop brain-machine interfaces (BMIs), providing high-resolution functionality for recording, stimulation, or both. The flexibility of these arrays provides advantages over rigid ones, such as reduced mismatch between interface and tissue, resilience to micromotion, and sustained long-term performance. This review summarizes the recent developments and applications of flexible HDMEAs in closed-loop BMI systems. It delves into the various challenges encountered in the development of ideal flexible HDMEAs for closed-loop BMI systems and highlights the latest methodologies and breakthroughs to address these challenges. These insights could be instrumental in guiding the creation of future generations of flexible HDMEAs, specifically tailored for use in closed-loop BMIs. The review thoroughly explores both the current state and prospects of these advanced arrays, emphasizing their potential in enhancing BMI technology.

Investigating Immunomodulatory Biomaterials for Preventing the Foreign Body Response

Implantable biomaterials represent the forefront of regenerative medicine, providing platforms and vessels for delivering a creative range of therapeutic benefits in diverse disease contexts. However, the chronic damage resulting from implant rejection tends to outweigh the intended healing benefits, presenting a considerable challenge when implementing treatment-based biomaterials. In response to implant rejection, proinflammatory macrophages and activated fibroblasts contribute to a synergistically destructive process of uncontrolled inflammation and excessive fibrosis. Understanding the complex biomaterial-host cell interactions that occur within the tissue microenvironment is crucial for the development of therapeutic biomaterials that promote tissue integration and minimize the foreign body response. Recent modifications of specific material properties enhance the immunomodulatory capabilities of the biomaterial and actively aid in taming the immune response by tuning interactions with the surrounding microenvironment either directly or indirectly. By incorporating modifications that amplify anti-inflammatory and pro-regenerative mechanisms, biomaterials can be optimized to maximize their healing benefits in harmony with the host immune system.

High-detection-efficiency stereo microscope system based on a mobile phone

Most stereoscopic microscopes used for industrial component detection are large and have low detection efficiencies. The use of mobile phones as imaging systems (rather than conventional sensors) in industrial fields would make industrial testing more convenient. In this study, an external stereo microscope for mobile phones is designed. The proposed system can resolve details up to 0.01 mm with an 11 mm object field of view, -6.34× angular magnification, and quantitative 3D feature measurement. The combined system proposed in this paper is suitable for the microscopic observation of industrial components, with its low cost, high detection efficiency, and short installation steps.

Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating

The research of novel implantable medical devices is one of the most attractive, yet complex areas in the biomedical field. The design and development of sufficiently small devices working in an in vivo environment is challenging but successful encapsulation of such devices is even more so. Industry-standard methods using glass and titanium are too expensive and tedious, and epoxy or silicone encapsulation is prone to water ingress with cable feedthroughs being the most frequent point of failure. This paper describes a universal and straightforward method for reliable encapsulation of circuit boards that achieves ISO10993 compliance. A two-part PVDF mold was machined using a conventional 3-axis machining center. Then, the circuit board with a hermetic feedthrough was placed in the mold and epoxy resin was injected into the mold under pressure to fill the cavity. Finally, the biocompatibility was further enhanced with an inert P3HT polymer coating which can be easily formulated into an ink. The biocompatibility of the encapsulants was assessed according to ISO10993. The endurance of the presented solution compared to silicone potting and epoxy potting was assessed by submersion in phosphate-buffered saline solution at 37 °C. The proposed method showed superior results to PDMS and simple epoxy potting.

Research on the Factors Damaging Hydrogen Peroxide Low-Temperature Plasma Sterile Packaging Bags and the Control of Link Quality

Objective. After discussing the factors damaging hydrogen peroxide low-temperature plasma sterile packaging bags (hereinafter referred to as Tyvek packaging bags), the damage rate of Tyvek packaging bags is lowered through the control of link quality, so as to guarantee the quality of sterile packaging bags and the safety of patients. Methods. Design questionnaire and registration form by investigating 8606 instrument packaging bags sterilized by hydrogen peroxide low-temperature plasma from January 2019 to December 2019, the controllable factors damaging Tyvek packaging bags are analyzed from four aspects: instrument packaging, sterilization, transfer, and storage. By taking targeted interventions on 8155 instrument packaging bags sterilized from January 2020 to December 2020, the intervention effects of the key links and the damage rate are evaluated. Results. The main factors damaging Tyvek packaging bags mainly include improper transfer, storage, and management of instrument packing bags; improper use of instrument boxes; improper loading and uploading operations of sterilization; and the wrong size of packaging bags. For these factors, related intervention measures shall be adopted to control the link quality so as to lower the damage rate from 3.54% in the control group to 0.20% in the experimental group. The differences in damage rate are of statistical significance ( $P<0.01$ ). Conclusion. Tyvek packaging bags are influenced by controllable factors. Through reasonable link control and standard operations, the sterile packaging bags can be kept sterile from the end of sterilization to the usage by patients, which guarantees the safety of patients and is worthy of reference.

Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polymer material, with input/output feedthroughs for electrical interconnections. The feedthroughs are regarded as essential elements of the reliability of the package since they create inevitable interfaces with the encapsulation materials. Flexible materials are frequently used for feedthroughs owing to their ease of manufacturing; thus, their mechanical properties are crucial as they directly interact with parts of the human body, such as the brain and neurons. For this purpose, tensile tests were performed to characterize the mechanical properties of flexible PCBs (FPCBs) and photosensitive polyimides (PSPIs). Commercial FPCBs and homemade PSPIs of two different thicknesses were subjected to tensile tests for mechanical characterization. The FPCBs showed typical stress-strain curves, while the PSPIs showed brittleness or strain hardening depending on the thickness. The material properties extracted from the tensile tests were used for explicit modeling using the finite element method (FEM) and simulations to assess mechanical behaviors, such as necking and strain hardening.

Development of nano- and microdevices for the next generation of biotechnology, wearables and miniaturized instrumentation

This is a short communication based on recent high-impact publications related to how various chemical materials and substrate modifications could be tuned for nano- and microdevices, where their application for high point-of-care bioanalysis and further applications in life science is discussed. Hence, they have allowed different high-impact research topics in a variety of fields, from the control of nanoscale to functional microarchitectures embedded in various support materials to obtain a device for a given application or use. Thus, their incorporation in standard instrumentation is shown, as well as in new optical setups to record different classical and non-classical light, signaling, and energy modes at a variety of wavelengths and energy levels. Moreover, the development of miniaturized instrumentation was also contemplated. In order to develop these different levels of technology, the chemistry, physics and engineering of materials were discussed. In this manner, a number of subjects that allowed the design and manufacture of devices could be found. The following could be mentioned by way of example: (i) nanophotonics; (ii) design, synthesis and tuning of advanced nanomaterials; (iii) classical and non-classical light generation within the near field; (iv) microfluidics and nanofluidics; (v) signal waveguiding; (vi) quantum-, nano- and microcircuits; (vii) materials for nano- and microplatforms, and support substrates and their respective modifications for targeted functionalities. Moreover, nano-optics in in-flow devices and chips for biosensing were discussed, and perspectives on biosensing and single molecule detection (SMD) applications. In this perspective, new insights about precision nanomedicine based on genomics and drug delivery systems were obtained, incorporating new advanced diagnosis methods based on lab-on-particles, labs-on-a-chip, gene therapies, implantable devices, portable miniaturized instrumentation, single molecule detection for biophotonics, and neurophotonics. In this manner, this communication intends to highlight recent reports and developments of nano- and microdevices and further approaches towards the incorporation of developments in nanophotonics and biophotonics in the design of new materials based on different strategies and enhanced techniques and methods. Recent proofs of concept are discussed that could allow new substrates for device manufacturing. Thus, physical phenomena and materials chemistry with accurate control within the nanoscale were introduced into the discussion. In this manner, new potential sources of ideas and strategies for the next generation of technology in many research and development fields are showcased.

A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation

This paper proposed and verified the use of polymer-based packaging to implement the chronic implantation of neural interfaces using a combination of a commercial thermal epoxy and a thin parylene film. The packaging’s characteristics and the performance of the vulnerable interface between the thermal epoxy layer and polyimide layer, which is mainly used for neural electrodes and an FPCB, were evaluated through in vitro, in vivo, and acceleration experiments. The performance of neural interfaces—composed of the combination of the thermal epoxy and thin parylene film deposition as encapsulation packaging—was evaluated by using signal acquisition experiments based on artificial stimulation signal transmissions through in vitro and in vivo experiments. It has been found that, when commercial thermal epoxy normally cured at room temperature was cured at higher temperatures of 45 °C and 65 °C, not only is its lifetime increased with about twice the room-temperature-based curing conditions but also an interfacial adhesion is higher with more than twice the room-temperature-based curing conditions. In addition, through in vivo experiments using rats, it was confirmed that bodily fluids did not flow into the interface between the thermal epoxy and FPCB for up to 18 months, and it was verified that the rats maintained healthy conditions without occurring an immune response in the body to the thin parylene film deposition on the packaging’s surface.