Review of Recent Development of MEMS Speakers

Capillary effect-based selective sealing strategy for increasing piezoelectric MEMS speaker performance

To address the serious acoustic performance deterioration induced by air leakage in the low-frequency range and the asynchronous vibration in electroacoustic transduction structures near the resonant frequency, a novel sealing strategy is proposed that targets one of the most widely reported piezoelectric MEMS speaker designs. This design consists of multiple cantilever beams, in which the air gaps between cantilevers are automatically and selectively filled with liquid polydimethylsiloxane (PDMS) via the capillary effect, followed by curing. In the proof-of-concept demonstration, the sound pressure level (SPL) within the frequency range lower than 100 Hz markedly increased after sealing in an experiment using an IEC ear simulator. Specifically, the SPL is increased by 4.9 dB at 20 Hz for a 40 Vpp driving voltage. Moreover, the deteriorated SPL response near the resonant frequencies of the cantilever beams (18 kHz-19 kHz) caused by their asynchronous vibration induced by the fabrication process nonuniformity also significantly improved, which successfully increased the SPL to approximately 17.5 dB. Moreover, sealed devices feature nearly the same SPL response as the initial counterpart in the frequency band from 100 Hz to 16 kHz and a total harmonic distortion (THD) of 0.728% at 1 kHz for a 40 Vpp driving voltage. Compared with existing sealing methods, the current approach offers easy operation, low damage risk, excellent repeatability/reliability and excellent robustness advantages and provides a promising technical solution for MEMS acoustic devices.

Single Layer Silk and Cotton Woven Fabrics for Acoustic Emission and Active Sound Suppression

Whether intentionally generating acoustic waves or attempting to mitigate unwanted noise, sound control is an area of challenge and opportunity. This study investigates traditional fabrics as emitters and suppressors of sound. When attached to a single strand of a piezoelectric fiber actuator, a silk fabric emits up to 70 dB of sound. Despite the complex fabric structure, vibrometer measurements reveal behavior reminiscent of a classical thin plate. Fabric pore size relative to the viscous boundary layer thickness is found-through comparative fabric analysis-to influence acoustic-emission efficiency. Sound suppression is demonstrated using two distinct mechanisms. In the first, direct acoustic interference is shown to reduce sound by up to 37 dB. The second relies on pacifying the fabric vibrations by the piezoelectric fiber, reducing the amplitude of vibration waves by 95% and attenuating the transmitted sound by up to 75%. Interestingly, this vibration-mediated suppression in principle reduces sound in an unlimited volume. It also allows the acoustic reflectivity of the fabric to be dynamically controlled, increasing by up to 68%. The sound emission and suppression efficiency of a 130 µm silk fabric presents opportunities for sound control in a variety of applications ranging from apparel to transportation to architecture.

A reduced-order-model-based equivalent circuit for piezoelectric micro-electro-mechanical-system loudspeakers modeling

Piezoelectric micro-electro-mechanical-system (MEMS) speakers are emerging as promising implementations of loudspeakers at the microscale, as they are able to meet the ever-increasing requirements for modern audio devices to become smaller, lighter, and integrable into digital systems. In this work, we propose a finite element model (FEM)-assisted lumped-parameters equivalent circuit for a fast and accurate modeling of these types of devices. The electro-mechanical parameters are derived from a pre-stressed FEM eigenfrequency analysis, to account for arbitrarily complex geometries and for the shift of the speaker resonance frequency due to an initial non-null pre-deflected configuration. The parameters of the acoustical circuit are instead computed through analytical formulas. The acoustic short-circuit between the speaker front and rear sides is taken into account through a proper air-gaps modeling. The very good matching in terms of radiated sound pressure level among the equivalent circuit predictions, FEM simulations, and experimental data proves the ability of the proposed method to accurately simulate the speaker performance. Moreover, due to its generality, it represents a versatile tool for designing piezoelectric MEMS speakers.

What MEMS Research and Development Can Learn from a Production Environment

The intricate interdependency of device design and fabrication process complicates the development of microelectromechanical systems (MEMS). Commercial pressure has motivated industry to implement various tools and methods to overcome challenges and facilitate volume production. By now, these are only hesitantly being picked up and implemented in academic research. In this perspective, the applicability of these methods to research-focused MEMS development is investigated. It is found that even in the dynamics of a research endeavor, it is beneficial to adapt and apply tools and methods deduced from volume production. The key step is to change the perspective from fabricating devices to developing, maintaining and advancing the fabrication process. Tools and methods are introduced and discussed, using the development of magnetoelectric MEMS sensors within a collaborative research project as an illustrative example. This perspective provides both guidance to newcomers as well as inspiration to the well-versed experts.

Recent Trends in Structures and Interfaces of MEMS Transducers for Audio Applications: A Review

In recent years, Micro-Electro-Mechanical Systems (MEMS) technology has had an impressive impact in the field of acoustic transducers, allowing the development of smart, low-cost, and compact audio systems that are employed in a wide variety of highly topical applications (consumer devices, medical equipment, automotive systems, and many more). This review, besides analyzing the main integrated sound transduction principles typically exploited, surveys the current State-of-the-Art scenario, presenting the recent performance advances and trends of MEMS microphones and speakers. In addition, the interface Integrated Circuits (ICs) needed to properly read the sensed signals or, on the other hand, to drive the actuation structures are addressed with the aim of offering a complete overview of the currently adopted solutions.

A Piezoelectric MEMS Speaker with a Combined Function of a Silent Alarm

To explore the versatility of speakers, a piezoelectric micro-electro-mechanical system (MEMS) speaker combining the function of a silent alarm is proposed, which mainly comprises a lead zirconate titanate (PZT) actuation layer and a rigid-flexible coupling supporting layer. Measurements performed on encapsulated prototypes mounted to an artificial ear simulator have revealed that, compared to a speaker with a rigid supporting layer, the sound pressure level (SPL) of the proposed piezoelectric MEMS speaker with a rigid-flexible coupling supporting layer is significantly higher and is especially higher by 4.1-20.1 dB in the frequency range from 20 Hz to 4.2 kHz, indicating that the rigid-flexible coupling supporting layer can improve the SPL significantly in low frequency. Moreover, the spectral distribution characteristic of its playback audio is similar to that of the commercial electromagnetic type. The device can also function as a silent alarm based on oral airflows in dangerous situations, as it performs well at recognizing words according to their unique voltage-signal characteristics, and can avoid the effects of external sound noise, body movement, long distance, and occlusion. This strategy provides inspiration for functional diversification of piezoelectric MEMS speakers.

Acoustic Performance of Stress Gradient-Induced Deflection of Triangular Unimorphic/Bimorphic Cantilevers for MEMS Applications

This paper reports two piezoelectric materials of lead zirconium titanate (PZT) and aluminum nitride (AlN) used to simulate microelectromechanical system (MEMS) speakers, which inevitably suffered deflections as induced via the stress gradient during the fabrication processes. The main issue is the vibrated deflection from the diaphragm that influences the sound pressure level (SPL) of MEMS speakers. To comprehend the correlation between the geometry of the diaphragm and vibration deflection in cantilevers with the same condition of activated voltage and frequency, we compared four types of geometries of cantilevers including square, hexagon, octagon, and decagon in triangular membranes with unimorphic and bimorphic composition by utilizing finite element method (FEM) for physical and structural analyses. The size of different geometric speakers did not exceed 10.39 mm²; the simulation results reveal that under the same condition of activated voltage, the associated acoustic performance, such as SPL for AlN, is in good comparison with the simulation results of the published literature. These FEM simulation results of different types of cantilever geometries provide a methodology design toward practical applications of piezoelectric MEMS speakers in the acoustic performance of stress gradient-induced deflection in triangular bimorphic membranes.

Review of Piezoelectric Micromachined Ultrasonic Transducers for Rangefinders

Piezoelectric micromachined ultrasonic transducer (pMUT) rangefinders have been rapidly developed in the last decade. With high output pressure to enable long-range detection and low power consumption (16 μW for over 1 m range detection has been reported), pMUT rangefinders have drawn extensive attention to mobile range-finding. pMUT rangefinders with different strategies to enhance range-finding performance have been developed, including the utilization of pMUT arrays, advanced device structures, and novel piezoelectric materials, and the improvements of range-finding methods. This work briefly introduces the working principle of pMUT rangefinders and then provides an extensive overview of recent advancements that improve the performance of pMUT rangefinders, including advanced pMUT devices and range-finding methods used in pMUT rangefinder systems. Finally, several derivative systems of pMUT rangefinders enabling pMUT rangefinders for broader applications are presented.

The push-pull principle: an electrostatic actuator concept for low distortion acoustic transducers

Electrostatic actuators are of particular interest for microsystems (MEMS), and in particular for MEMS audio transducers for use in advanced true wireless applications. They are attractive because of their typically low electrical capacitance and because they can be fabricated from materials that are compatible with standard complementary metal-oxide semiconductor (CMOS) technology. For high audio performance and in particular low harmonic distortion (THD) the implementation of the push-pull principle provides strong benefits. With an arrangement of three electrodes in a conjunct moving configuration on a beam, we demonstrate here for the first time a balanced bending actuator incarnating the push-pull principle operating at low voltages. Our first design already exhibits a harmonic distortion as low as 1.2% at 79 dB using a signal voltage of only 6 V_p and a constant voltage of only ±10 V_dc in a standard acoustic measurement setup. Thus, exceeding our previously reported approach in all three key performance indications at the same time. We expect that our novel electrode configurations will stimulate innovative electrostatic actuator developments for a broad range of applications. In this paper we report the basic theory, the fabrication and the performance of our novel actuator design acting as an audio transducer.

Enhancement of the Transmission Performance of Piezoelectric Micromachined Ultrasound Transducers by Vibration Mode Optimization

Ultrasound is widely used in industry and the agricultural, biomedical, military, and other fields. As key components in ultrasonic applications, the characteristic parameters of ultrasonic transducers fundamentally determine the performance of ultrasonic systems. High-frequency ultrasonic transducers are small in size and require high precision, which puts forward higher requirements for sensor design, material selection, and processing methods. In this paper, a three-dimensional model of a high-frequency piezoelectric micromachined ultrasonic transducer (PMUT) is established based on the finite element method (FEM). This 3D model consists of a substrate, a silicon device layer, and a molybdenum-aluminum nitride-molybdenum (Mo-AlN-Mo) sandwich piezoelectric layer. The effect of the shape of the transducer’s vibrating membrane on the transmission performance was studied. Through a discussion of the parametric scanning of the key dimensions of the diaphragms of the three structures, it was concluded that the fundamental resonance frequency of the hexagonal diaphragm was higher than that of the circle and the square under the same size. Compared with the circular diaphragm, the sensitivity of the square diaphragm increased by 8.5%, and the sensitivity of the hexagonal diaphragm increased by 10.7%. The maximum emission sound-pressure level of the hexagonal diaphragm was 6.6 times higher than that of the circular diaphragm. The finite element results show that the hexagonal diaphragm design has great advantages for improving the transmission performance of the high-frequency PMUT.

Novel Fabrication Technology for Clamped Micron-Thick Titanium Diaphragms Used for the Packaging of an Implantable MEMS Acoustic Transducer

Micro-Electro-Mechanical Systems (MEMS) acoustic transducers are highly sophisticated devices with high sensing performance, small size, and low power consumption. To be applied in an implantable medical device, they require a customized packaging solution with a protecting shell, usually made from titanium (Ti), to fulfill biocompatibility and hermeticity requirements. To allow acoustic sound to be transferred between the surroundings and the hermetically sealed MEMS transducer, a compliant diaphragm element needs to be integrated into the protecting enclosure. In this paper, we present a novel fabrication technology for clamped micron-thick Ti diaphragms that can be applied on arbitrary 3D substrate geometry and hence directly integrated into the packaging structure. Stiffness measurements on various diaphragm samples illustrate that the technology enables a significant reduction of residual stress in the diaphragm developed during its deposition on a polymer sacrificial material.