Silicon-Based Microfabrication of Free-Floating Neural Probes and Insertion Tool for Chronic Applications

Understanding Electrical Failure of Polyimide-Based Flexible Neural Implants: The Role of Thin Film Adhesion

The lack of long-term stability of polymeric neural interfaces remains one of the most important and less tackled issues in this research field. To address this issue, we fabricated two test structures based on interdigitated electrodes (IDEs) encapsulated with polyimide (PI). One of the test samples was pretreated with barrel oxygen plasma prior to spin coating of the second PI layer. The second test structure was pretreated using a reactive ion etching (RIE) process. The test samples were immersed in an electrolyte solution at elevated temperatures to mimic the conditions inside the human brain. The samples were then electrically and mechanically stressed to accelerate their degradation. Real-time monitoring of the electrical insulation stability was used to compare the impact of the pretreatment on the long-term stability. Barrel-plasma-activated test samples showed a mean lifetime of 1.5 days, whereas RIE pretreatment increased the mean lifetime to 24 days. Therefore, RIE-pretreated test samples exhibited 16 times longer mean stability compared to purely chemically activated test samples. Furthermore, the electrical measurements were correlated with mechanical adhesion tests. Chemically activated test samples showed significant delamination, whereas RIE pretreatment enhanced the adhesion, and no delamination could be observed. The correlation of these investigations suggests that the adhesion between different layers is higher following RIE pretreatment compared to pretreatment with chemical barrel plasma. In conclusion, the adhesion between the two PI foils seems to play a key role in the long-term stability of such devices.

Towards Long-Term Stable Polyimide-Based Flexible Electrical Insulation for Chronically Implanted Neural Electrodes

For chronic applications of flexible neural implants, e.g., intracortical probes, the flexible substrate material has to encapsulate the electrical conductors with a long-term stability against the saline environment of the neural tissue. The biocompatible polymer polyimide is often used for this purpose. Due to its chemical inertness, the adhesion between two polyimide layers is, however, a challenge, which can lead to delamination and, finally, to short circuits. The state-of-the-art method to improve the adhesion strength is activating the polyimide surface using oxygen reactive ion etching (O₂ RIE). However, the influence of the process variations (etching time, bias power) on the long-term stability is still unclear. Therefore, we establish a test method, where the aging of a gold interdigital structure embedded in two polyimide layers and immersed in saline solution is accelerated using an elevated temperature, mechanical stress and an electrical field. A continuous measurement of a leakage current is used to define the failure state. The results show that the variation of the O₂ RIE plasma process has a significant effect on the long-term stability of the test samples. Comparing the two different plasma treatments 0.5 min at 25 W and 1 min at 50 W, the long-term stability could be increased from 20.9 ± 19.1 days to 44.9 ± 18.9 days. This corresponds to more than a doubled lifetime. An ideal solution for the delamination problem is still not available; however, the study shows that the fine-tuning of the fabrication processes can improve the long-term stability of chronically implanted neural electrodes.

An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Hybrid Multisite Silicon Neural Probe with Integrated Flexible Connector for Interchangeable Packaging

Multisite neural probes are a fundamental tool to study brain function. Hybrid silicon/polymer neural probes combine rigid silicon and flexible polymer parts into one single device and allow, for example, the precise integration of complex probe geometries, such as multishank designs, with flexible biocompatible cabling. Despite these advantages and benefiting from highly reproducible fabrication methods on both silicon and polymer substrates, they have not been widely available. This paper presents the development, fabrication, characterization, and in vivo electrophysiological assessment of a hybrid multisite multishank silicon probe with a monolithically integrated polyimide flexible interconnect cable. The fabrication process was optimized at wafer level, and several neural probes with 64 gold electrode sites equally distributed along 8 shanks with an integrated 8 µm thick highly flexible polyimide interconnect cable were produced. The monolithic integration of the polyimide cable in the same fabrication process removed the necessity of the postfabrication bonding of the cable to the probe. This is the highest electrode site density and thinnest flexible cable ever reported for a hybrid silicon/polymer probe. Additionally, to avoid the time-consuming bonding of the probe to definitive packaging, the flexible cable was designed to terminate in a connector pad that can mate with commercial zero-insertion force (ZIF) connectors for electronics interfacing. This allows great experimental flexibility because interchangeable packaging can be used according to experimental demands. High-density distributed in vivo electrophysiological recordings were obtained from the hybrid neural probes with low intrinsic noise and high signal-to-noise ratio (SNR).

Multimaterial and multifunctional neural interfaces: from surface-type and implantable electrodes to fiber-based devices

Development of neural interfaces from surface electrodes to fibers with various type, functionality, and materials.

CMOS-Compatible, Flexible, Intracortical Neural Probes

Flexible intracortical neural probes elicit a lower foreign body response when compared to rigid implants. However, by incorporating complementary metal-oxide-semiconductor (CMOS) circuitry, silicon-based neural probes can offer an improved scalability and more functionalities than any other currently available technology.

OBJECTIVE

Our goal is the development of a novel neural probe that combines flexibility with the functionalities of active CMOS-based probes.

METHODS

We interface CMOS-based probe tips of only a few millimeters in length with flexible polyimide cables, which enable the complete implantation of the tips into brain tissue. The multilayer platinum metallization of the cables is patterned using a novel combination of ion beam and plasma etching. Implantation of the flexible probes is verified in brain models using stiff insertion shuttles.

RESULT

We assembled neural probes from passive and active tips as short as 1.5 mm and less than 180 μm in width. Active probes feature electrode arrays with 72 recording sites and multiplexing to 16 parallel output lines. We reliably patterned cables with signal lines of 2 μm in width and 3 μm in spacing. Ion beam etching deteriorated the composition of the polyimide substrate and its resistance to around 1 kΩ. An additional plasma treatment re-established high insulation resistances and recovered the chemical composition. Probes were successfully implanted to a depth of 7 mm using insertion shuttles and withstood forces of 63 mN.

CONCLUSIONS

This study presents the methods required for the fabrication and application of a new generation of neural probes.

SIGNIFICANCE

The synergetic approach surpasses the limitation of each individual probe technology and should be considered in future developments.

Silicon-Based Sensors for Biomedical Applications: A Review

The paper highlights some of the significant works done in the field of medical and biomedical sensing using silicon-based technology. The use of silicon sensors is one of the pivotal and prolonged techniques employed in a range of healthcare, industrial and environmental applications by virtue of its distinct advantages over other counterparts in Microelectromechanical systems (MEMS) technology. Among them, the sensors for biomedical applications are one of the most significant ones, which not only assist in improving the quality of human life but also help in the field of microfabrication by imparting knowledge about how to develop enhanced multifunctional sensing prototypes. The paper emphasises the use of silicon, in different forms, to fabricate electrodes and substrates for the sensors that are to be used for biomedical sensing. The electrical conductivity and the mechanical flexibility of silicon vary to a large extent depending on its use in developing prototypes. The article also explains some of the bottlenecks that need to be dealt with in the current scenario, along with some possible remedies. Finally, a brief market survey is given to estimate a probable increase in the usage of silicon in developing a variety of biomedical prototypes in the upcoming years.