|
1
|
Mba JC, Mitomo H, Yonamine Y, Wang G, Matsuo Y, Ijiro K. Hysteresis in the Thermo-Responsive Assembly of Hexa(ethylene glycol) Derivative-Modified Gold Nanodiscs as an Effect of Shape. NANOMATERIALS (BASEL, SWITZERLAND) 2022; 12:1421. [PMID: 35564130 PMCID: PMC9102705 DOI: 10.3390/nano12091421] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/30/2022] [Revised: 04/14/2022] [Accepted: 04/19/2022] [Indexed: 01/27/2023]
Abstract
Anisotropic gold nanodiscs (AuNDs) possess unique properties, such as large flat surfaces and dipolar plasmon modes, which are ideal constituents for the fabrication of plasmonic assemblies for novel and emergent functions. In this report, we present the thermo-responsive assembly and thermo-dynamic behavior of AuNDs functionalized with methyl-hexa(ethylene glycol) undecane-thiol as a thermo-responsive ligand. Upon heating, the temperature stimulus caused a blue shift of the plasmon peak to form a face-to-face assembly of AuNDs due to the strong hydrophobic and van der Waals interactions between their large flat surfaces. Importantly, AuNDs allowed for the incorporation of the carboxylic acid-terminated ligand while maintaining their thermo-responsive assembly ability. With regard to their reversible assembly/disassembly behavior in the thermal cycling process, significant rate-independent hysteresis, which is related to their thermo-dynamics, was observed and was shown to be dependent on the carboxylic acid content of the surface ligands. As AuNDs have not only unique plasmonic properties but also high potential for attachment due to the fact of their flat surfaces, this study paves the way for the exploitation of AuNDs in the development of novel functional materials with a wide range of applications.
Collapse
Affiliation(s)
- Joshua Chidiebere Mba
- Graduate School of Life Science, Hokkaido University, Kita 10, Nishi 8, Kita-Ku, Sapporo 060-0810, Hokkaido, Japan;
| | - Hideyuki Mitomo
- Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-Ku, Sapporo 001-0021, Hokkaido, Japan; (Y.Y.); (Y.M.)
| | - Yusuke Yonamine
- Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-Ku, Sapporo 001-0021, Hokkaido, Japan; (Y.Y.); (Y.M.)
| | - Guoqing Wang
- College of Food Science and Engineering, Ocean University of China, 5 Yushan Road, Qingdao 266003, China;
| | - Yasutaka Matsuo
- Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-Ku, Sapporo 001-0021, Hokkaido, Japan; (Y.Y.); (Y.M.)
| | - Kuniharu Ijiro
- Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-Ku, Sapporo 001-0021, Hokkaido, Japan; (Y.Y.); (Y.M.)
| |
Collapse
|