Synergistic Enhanced Thermal Conductivity and Crack Resistance of Reactor Epoxy Insulation with Boron Nitride Nanosheets and Multiwalled Carbon Nanotubes

Synergistic Improvement in the Thermal Conductivity of Hybrid Boron Nitride Nanotube/Nanosheet Epoxy Composites

Epoxy composites with excellent thermal properties are highly promising for thermal management applications in modern electronic devices. In this work, we report the enhancement of the thermal conductivity of two different nanocomposites, using epoxy resins LY564 (epoxy 1) and LY5052 (epoxy 2), by incorporating multiwalled boron nitride nanotubes (BNNT) and boron nitride nanosheets (BNNS) as fillers. The synergistic interaction between the 1D BNNT and 2D BNNS allows for improved thermal conductivity via several different mechanisms. The highest thermal conductivity was measured at a loading of 1/30 wt % of BNNT/BNNS, resulting in values of 2.6 and 3.4 Wm-1 K-1, respectively, for each epoxy matrix. This improvement is attributed to the formation of a three-dimensional heat flow path formed through intercalation of the nanotubes between the BNNS. The thermal conductivity of the epoxy 1 and 2 nanocomposites improved by 940 and 1500%, respectively, making them suitable as thermal interface materials in electronic applications requiring electrical resistivity.

Enhanced Thermal Conductivity and Dielectric Properties of Epoxy Composites with Fluorinated Graphene Nanofillers

The demand for high-performance dielectrics has increased due to the rapid development of modern electric power and electronic technology. Composite dielectrics, which can overcome the limitations of traditional single polymers in thermal conductivity, dielectric properties and mechanical performance, have received considerable attention. In this study, we report a multifunctional nanocomposite material fabricated by blending fluorinated graphene (F-graphene) with epoxy resin. The F-graphene/epoxy composite exhibited a high thermal conductivity of 0.3304 W·m-1·K-1 at a low filler loading of 1.0 wt.%, which was 67.63% higher than that of pure epoxy. The composite dielectric also showed high breakdown strength (78.60 kV/mm), high dielectric constant (8.23), low dielectric loss (<0.015) and low AC conductivity (<10-11 S·m-1). Moreover, the composite demonstrated high thermal stability and strong mechanical strength. It is believed that the F-graphene/epoxy composite has outstanding performance in various aspects and can enable the development and manufacturing of advanced electric power and electronic equipment devices.

The Influence of the Size of BN NSs on Silkworm Development and Tissue Microstructure

Boron nitride nanosheets (BN NSs) have emerged as promising materials in a wide range of biomedical applications. Despite the extensive studies on these bio-nano interfacial systems, one critical concern is their toxicity, which is affected by a variety of factors, including size. This study aimed at assessing the relationship between BN NSs size and toxicity. Two silkworm strains (qiufeng × baiyu and Nistari 7019) were used as model organisms to investigate the effect of different sizes of BN NSs (BN NSs-1, thickness of 41.5 nm and diameter of 270.7 nm; BN NSs-2, thickness of 48.2 nm and diameter of 562.2 nm) on silkworm mortality, growth, cocoon weight, and tissue microstructure. The findings show that exposure to BN NSs in this work has no lethal adverse effects on silkworm growth or tissue microstructure. BN NSs have a higher effect on the growth rate of qiufeng × baiyu compared to Nistari 7019, demonstrating that the same treatment does not favorably affect the Nistari 7019 strain, as there is no significant increase in cocoon weight. Overall, the study suggests that the sizes of BN NSs employed in this study are relatively safe and have less negative impact on silkworms. This offers significant insights into the effect of BN NSs size, a crucial factor to consider for their safe use in biomedical applications.

Dopamine-Mediated Graphene Bridging Hexagonal Boron Nitride for Large-Scale Composite Films with Enhanced Thermal Conductivity and Electrical Insulation

Heat accumulation generated from confined space poses a threat to the service reliability and lifetime of electronic devices. To quickly remove the excess heat from the hot spot, it is highly desirable to enhance the heat dissipation in a specific direction. Herein, we report a facile route to fabricate the large-scale composite film with enhanced thermal conductivity and electrical insulation. The well-stacked composite films were constructed by the assembly of polydopamine (PDA)-modified graphene nanosheets (GNS_PDA) and hexagonal boron nitride (BN_PDA), as well as bacterial cellulose (BC). The introduction of the PDA layer greatly improves the interface compatibility between hybrid fillers and BC matrix, and the presence of GNS_PDA-bridging significantly increases the probability of effective contact with BN_PDA fillers, which is beneficial to form a denser and complete "BN-GNS-BN" heat conduction pathway and tight filler-matrix network, as supported by the Foygel model fitting and numerical simulation. The resulting BC/BN_PDA/GNS_PDA film shows the thermal conductivity and tensile strength of 34.9 W·m^-1·K^-1 and 30.9 MPa, which separately increases to 161% and 155% relative to the BC/BN_PDA film. It was found that the low electrically conductive and high thermal conductive properties can be well balanced by tuning the mass ratio of GNS_PDA at 5 wt%, and the electrical conductivity caused by GNS_PDA can be effectively blocked by the BN_PDA filler network, giving the low electrical conductivity of 1.8 × 10^-10 S·cm^-1. Meanwhile, the BC/BN_PDA/GNS_PDA composite films effectively transfer the heat and diminish the hot-spot temperature in cooling LED chip module application. Thus, the present study may pave the way to promoting the industrialization of scalable thermal management devices.

Effect of Ambient Plasma Treatments on Thermal Conductivity and Fracture Toughness of Boron Nitride Nanosheets/Epoxy Nanocomposites

With the rapid growth in the miniaturization and integration of modern electronics, the dissipation of heat that would otherwise degrade the device efficiency and lifetime is a continuing challenge. In this respect, boron nitride nanosheets (BNNS) are of significant attraction as fillers for high thermal conductivity nanocomposites due to their high thermal stability, electrical insulation, and relatively high coefficient of thermal conductivity. Herein, the ambient plasma treatment of BNNS (PBNNS) for various treatment times is described for use as a reinforcement in epoxy nanocomposites. The PBNNS-loaded epoxy nanocomposites are successfully manufactured in order to investigate the thermal conductivity and fracture toughness. The results indicate that the PBNNS/epoxy nanocomposites subjected to 7 min plasma treatment exhibit the highest thermal conductivity and fracture toughness, with enhancements of 44 and 110%, respectively, compared to the neat nanocomposites. With these enhancements, the increases in surface free energy and wettability of the PBNNS/epoxy nanocomposites are shown to be attributable to the enhanced interfacial adhesion between the filler and matrix. It is demonstrated that the ambient plasma treatments enable the development of highly dispersed conductive networks in the PBNNS epoxy system.