High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling

The failure mechanisms of Cu–Cu bumps under thermal cycling test (TCT) were investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20% after 1000 thermal cycles. Many cracks were found at the center of the bonding interface, assumed to be a result of weak grain boundaries. Finite element analysis (FEA) was performed to simulate the stress distribution under thermal cycling. The results show that the maximum stress was located close to the Cu redistribution lines (RDLs). With the TiW adhesion layer between the Cu–Cu bumps and RDLs, the bonding strength was strong enough to sustain the thermal stress. Additionally, the middle of the Cu–Cu bumps was subjected to tension. Some triple junctions with zig-zag grain boundaries after TCT were observed. From the pre-existing tiny voids at the bonding interface, cracks might initiate and propagate along the weak bonding interface. In order to avoid such failures, a postannealing bonding process was adopted to completely eliminate the bonding interface of Cu–Cu bumps. This study delivers a deep understanding of the thermal cycling reliability of Cu–Cu hybrid joints.

Polymerization of Meldrum's Acid and Diisocyanate: An Effective Approach for Preparation of Reactive Polyamides and Polyurethanes

Meldrum's acid (MA) is utilized as a monomer to polymerize with diisocyanates to result in polyamides, containing MA moieties at polymer chains. This reaction is also employed to prepare isocyanate-terminated polyamide segments which are utilized as a precursor for preparation of MA-containing polyurethanes. Based on the thermolysis reaction of MA groups, followed by ketene dimerization reaction, the reactive polyamides and polyurethanes show self-cross-linkable features. The cross-linked polyurethanes exhibit good film formability, thermal stability, and mechanical properties. A new MA-based polymerization method and a novel synthesis route for preparation of reactive polyamides and polyurethanes are demonstrated.