Micro-Structure and Thermomechanical Properties of Crosslinked Epoxy Composite Modified by Nano-SiO₂: A Molecular Dynamics Simulation

Molecular dynamics study on the influence of thermal aging on the mechanical properties of epoxy resins for high voltage bushing

CONTEXT

Thermal aging significantly deteriorates the mechanical properties and service performance of epoxy resins used for the high-voltage bushing. Current studies on the thermal aging behavior of epoxy resins mainly focus on experimental observations. However, an in-depth understanding of the mechanism of thermal aging of epoxy resins requires the monitoring of structural evolution of epoxy resins during thermal aging at the molecular level. To thoroughly analyze the intrinsic factors affecting structural evolution and the effect of thermal aging on the mechanical properties of epoxy resin for high-voltage bushing, epoxy resin models with different crosslinking degrees were established and thermal aging treatments at various temperatures and time periods were carried out by molecular dynamics simulation. It was found that the tensile strength of the epoxy resin was enhanced with the increase of the crosslinking degree, which was related to the elevation of the proportion of C-N and O-H bonds in its structure. With the increase of thermal aging temperature, the tensile strength of the epoxy resin decreased, which was related to the formation of weak bonds. At the early stage of thermal aging and after a period of high-temperature thermal aging, the strength of epoxy resin significantly decreases. The thermal aging of the epoxy resin is accelerated under external loading. In addition, the crosslinking degree and curing agent also affect the thermal aging resistance of epoxy resins. The results of this study can provide guidance for predicting and improving the thermal aging resistance of epoxy resins.

METHODS

Materials Studio was used to construct molecular models and complete crosslinking reactions. DGEBA and 44DDS (or 33DDS) were mixed at a ratio of 2:1, followed by crosslinking reaction. During this process, the Nose method was used to control temperature, the Berendsen method was used to control pressure, and the polymer consistent force field (PCFF) was used to control the motion and force of atoms. Isobaric-isothermal ensemble (NPT ensemble) was used to heat up epoxy resin models to various thermal aging temperatures of 400 K, 500 K, 600 K and 700 K. The models were maintained at these temperatures for different thermal aging times of 100 ps, 200 ps, 300 ps, 400 ps, 500 ps, 600 ps, 700 ps and 800 ps. Afterwards, the models were cooled down to 300 K and subjected to uniaxial tensile testing at this temperature with a strain rate of 1 × 109 s-1. The structural configurations and stress-strain data during the tensile process were recorded. The flow stress of the material was derived by counting the average stress in the 20-50% strain interval.

Effects of Y-nodes in DGEBA/TDE-85/MTHPA blends on their thermal and mechanical properties: MD simulation and experimental study

With the development of alternate electrical power system and the improvement of voltage level, the operation conditions faced by epoxy resin (ER) insulation materials are becoming more and more complex. The traditional ER materials have been difficult to meet the increasingly stringent requirements. In this paper, the thermal and mechanical properties of DGEBA/TDE-85/MTHPA blend system were studied by molecular dynamics (MD) simulation and experiment. The results show that the addition of TDE-85 can significantly improve the thermal and mechanical properties, and the comprehensive improvement effect is the best when the molar ratio of DGEBA and TDE-85 is about 8:2. The experimental results are consistent with the simulation results. Further analysis of the micro-parameters of the monomer and the cross-linking network found that the torsional energy barrier of TDE-85 is higher than DGEBA. And the compatibility of the two ER is better when the ratio is 8:2. In addition, TDE-85 can introduce high-stability Y-nodes into the system, making the cross-linked network more stable, which has a significant effect on improving the thermal and mechanical properties. The research provide a reference for the blending modification of high-performance ER for high-voltage insulation.

Molecular dynamics simulation of the effect of the thermal and mechanical properties of addition liquid silicone rubber modified by carbon nanotubes with different radii

For microscopic analysis of the effect of doping with carbon nanotubes (CNTs) of different radii on the thermal and mechanical properties of addition liquid silicone rubber (ALSR) composites, models of pure silicone rubber and silicone rubber composites containing CNTs of different radii were constructed based on a molecular dynamics approach using vinyl-capped polydimethylsiloxane (VPDMS) as the base polymer and polyhydroxymethylsiloxane (PHMS) as the cross-linker. The thermal and mechanical properties and microstructures of the different models were analyzed and compared. It was found that the doping of CNTs could change the thermomechanical properties of the composites, and the doping of CNTs with small radius had a more positive effect on the material, the thermal conductivity, glass transition temperature, and mechanical properties of the composites are improved. Due to the doping of CNTs, the free volume percentage and the mean square displacement of the composites are reduced. It is noteworthy that during the modeling and optimization process, there are molecular chains that pass through the large radius CNTs, and the structural properties of the composite CNTs themselves play a more critical role in the enhancement effect of the thermodynamic properties of the composites compared to the binding energy and free volume.

Molecular Dynamics Study of the Influence of Nano SiO2 on the Thermodynamic Properties of PMIA Composites

The poly-m-phenyleneisophthalamide (PMIA) is widely used in the electrical field due to its numerous favorable characteristics, but its poor thermal conductivity limits its application. In this study, PMIA was modified with nano-silica (SiO2) to improve its thermal and mechanical properties. Using iso-phthalic acid and m-phenylenediamine as monomers, the changes in the thermodynamic properties and microstructure parameters of SiO2-modified PMIA were analyzed using molecular dynamics before and after modification in the temperature range of 250~450 K. It was found that adding SiO2 improves the Young’s modulus and Shear modulus of PMIA, and the mechanical properties of PMIA, and SiO2/PMIA composites deteriorate with increasing temperature, but the mechanical properties of SiO2/PMIA composites are always better than those of pure PMIA in the temperature range of electrical equipment. Meanwhile, after doping SiO2 with the radius of 8 Å, the glass transition temperature of PMIA increases by 27.11 K, and its thermal conductivity increases from 0.249 W m−1 K−1 to 0.396 W m−1 K−1. When SiO2 is added to PMIA, the thermal expansion coefficient of PMIA will decrease in both glass and rubber states, and its thermal stability will improve. In terms of microstructure parameters, the free volume distribution of the SiO2/PMIA model is less easily dispersed than that of the PMIA model, indicating that the addition of SiO2 can improve the related properties of PMIA by hindering the movement of molecular chains.

Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride

To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature.

Effect of Terminal Groups on Thermomechanical and Dielectric Properties of Silica-Epoxy Composite Modified by Hyperbranched Polyester

To study the effect of hyperbranched polyester with different kinds of terminal groups on the thermomechanical and dielectric properties of silica-epoxy resin composite, a molecular dynamics simulation method was utilized. Pure epoxy resin and four groups of silica-epoxy resin composites were established, where the silica surface was hydrogenated, grafted with silane coupling agents, and grafted with hyperbranched polyester with terminal carboxyl and terminal hydroxyl, respectively. Then the thermal conductivity, glass transition temperature, elastic modulus, dielectric constant, free volume fraction, mean square displacement, hydrogen bonds, and binding energy of the five models were calculated. The results showed that the hyperbranched polyester significantly improved the thermomechanical and dielectric properties of the silica-epoxy composites compared with other surface treatments, and the terminal groups had an obvious effect on the enhancement effect. Among them, epoxy composite modified by the hyperbranched polyester with terminal carboxy exhibited the best thermomechanical properties and lowest dielectric constant. Our analysis of the microstructure found that the two systems grafted with hyperbranched polyester had a smaller free volume fraction (FFV) and mean square displacement (MSD), and the larger number of hydrogen bonds and greater binding energy, indicating that weaker strength of molecular segments motion and stronger interfacial bonding between silica and epoxy resin matrix were the reasons for the enhancement of the thermomechanical and dielectric properties.

Thermomechanical properties of silica–epoxy nanocomposite modified by hyperbranched polyester: A molecular dynamics simulation

In this article, pure epoxy resin and silica–epoxy nanocomposite models were established to investigate the effects of hyperbranched polyester on microstructure and thermomechanical properties of epoxy resin through molecular dynamics simulation. Results revealed that the composite of silica can improve the thermomechanical properties of nanocomposites, including the glass transition temperature, thermal conductivity, and elastic modulus. Moreover, the thermomechanical properties were further enhanced through chemical modification on the silica surface, where the effectiveness was the best through grafting hyperbranched polyester on the silica surface. Compared with pure epoxy resin, the glass transition temperature of silica–epoxy composite modified by silica grafted with hyperbranched polyester increased by 38 K. The thermal conductivity increased with the increase of temperature and thermal conductivity at room temperature increased to 0.4171 W/(m·K)−1 with an increase ratio of 94.3%. Young’s modulus, volume modulus, and shear modulus all fluctuated as temperature rise with a down overall trend. They increased by 44.68%, 29.52%, and 36.65%, respectively, when compared with pure epoxy resin. At the same time, the thermomechanical properties were closely related to the microstructure such as fractional free volume (FFV), mean square displacement (MSD), and binding energy. Silica surface modification by grafting hyperbranched polyester reduced the FFV value and MSD value most and strengthened the combination of silica and epoxy resin matrix the best, resulting in the best thermomechanical properties.

Molecular simulation of nano polyhedral oligomeric silsesquioxane doping effect on the properties of two-component crosslinked epoxy resin

Epoxy resin (EP) has been extensively used in the field of insulation for its excellent electrical strength, mechanical property, chemical stability, and low cost. In this paper, computer molecular simulation is used to analyze the influence of nano-POSS (Nano-Polyhedral Oligomericsils Esquioxane) doping on the properties of epoxy composite from the micro point of view, which can provide a scientific basis for the optimization of the epoxy system. Two kinds of nano-POSS fillers with different mass fractions were doped into the base material of diglycidyl ether of bisphenol A (DGEBA) and 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecar (OSC). By molecular dynamics (MD) simulation the influence of nanofillers on the microstructure, thermal and mechanical properties of the composite were analyzed. Simulation results show that the doping of nano-POSS can improve the thermal and mechanical properties of the epoxy composite. Different nano-POSS has little effect on the glass transition temperature (T_g), coefficient of thermal expansion (CTE), and mechanical properties of the epoxy system, while the filling amount has an obvious improvement effect. Compared with EP/methyl-POSS system, the thermal and mechanical properties of the EP/phenyl-POSS system are better. At the same time, the doping of nano-POSS changed the microstructure parameters of epoxy composite. With the increase of nano-POSS filler content, fractional free volume (FFV) and mean square displacement (MSD) of both EP/POSS systems increased after the first drop. Besides, when the content of nano-POSS exceeded a certain range, the aggregation of filler itself hindered the accumulation of epoxy molecular chain segments.

Molecular Dynamics Simulation for the Effect of Fluorinated Graphene Oxide Layer Spacing on the Thermal and Mechanical Properties of Fluorinated Epoxy Resin

Traditional epoxy resin (EP) materials have difficulty to meet the performance requirements in the increasingly complex operating environment of the electrical and electronic industry. Therefore, it is necessary to study the design and development of new epoxy composites. At present, fluorinated epoxy resin (F-EP) is widely used, but its thermal and mechanical properties cannot meet the demand. In this paper, fluorinated epoxy resin was modified by ordered filling of fluorinated graphene oxide (FGO). The effect of FGO interlayer spacing on the thermal and mechanical properties of the composite was studied by molecular dynamics (MD) simulation. It is found that FGO with ordered filling can significantly improve the thermal and mechanical properties of F-EP, and the modification effect is better than that of FGO with disordered filling. When the interlayer spacing of FGO is about 9 Å, the elastic modulus, glass transition temperature, thermal expansion coefficient, and thermal conductivity of FGO are improved with best effect. Furthermore, we calculated the micro parameters of different systems, and analyzed the influencing mechanism of ordered filling and FGO layer spacing on the properties of F-EP. It is considered that FGO can bind the F-EP molecules on both sides of the nanosheets, reducing the movement ability of the molecular segments of the materials, so as to achieve the enhancement effect. The results can provide new ideas for the development of high-performance epoxy nanocomposites.

Molecular Simulation of Improved Mechanical Properties and Thermal Stability of Insulation Paper Cellulose by Modification with Silane-Coupling-Agent-Grafted Nano-SiO2

Cellulose is an important part of transformer insulation paper. Thermal aging of cellulose occurs in long-term operation of transformers, which deteriorates the mechanical properties and thermal stability of cellulose, resulting in a decrease in the transformer life. Therefore, improvement of the mechanical properties and thermal stability of cellulose has become a research hotspot. In this study, the effects of different silane coupling agents on the mechanical properties and thermal stability of modified cellulose were studied. The simulation results showed that the mechanical parameters of cellulose are only slightly improved by KH560 (γ-glycidyl ether oxypropyl trimethoxysilane) and KH570 (γ-methylacrylloxy propyl trimethoxy silane) modified nano-SiO2, while the mechanical parameters of cellulose are greatly improved by KH550 (γ-aminopropyl triethoxy silane) and KH792 (N-(2-aminoethyl)-3-amino propyl trimethoxy silane) modified nano-SiO2. The glass-transition temperature of the composite model is 24 K higher than that of the unmodified model. The mechanism of the change of the glass-transition temperature was analyzed from the point of view of free-volume theory. The main reason for the change of the glass-transition temperature is that the free volume abruptly changes, which increases the space for movement of the cellulose chain and accelerates the whole movement of the molecular chain. Therefore, modifying cellulose with KH792-modified nano-SiO2 can significantly enhance the thermal stability of cellulose.

Molecular Dynamics Simulation and Experimental Studies on the Thermomechanical Properties of Epoxy Resin with Different Anhydride Curing Agents

An investigation of the relationship between the microstructure parameters and thermomechanical properties of epoxy resin can provide a scientific basis for the optimization of epoxy systems. In this paper, the thermomechanical properties of diglycidyl ether of bisphenol A (DGEBA)/methyl tetrahydrophthalic anhydride (MTHPA) and DGEBA/nadic anhydride (NA) were calculated and tested by the method of molecular dynamics (MD) simulation combined with experimental verification. The effects of anhydride curing agents on the thermomechanical properties of epoxy resin were investigated. The results of the simulation and experiment showed that the thermomechanical parameters (glass transition temperature (T_g) and Young’s modulus) of the DGEBA/NA system were higher than those of the DGEBA/MTHPA system. The simulation results had a good agreement with the experimental data, which verified the accuracy of the crosslinking model of epoxy resin cured with anhydride curing agents. The microstructure parameters of the anhydride-epoxy system were analyzed by MD simulation, including bond-length distribution, synergy rotational energy barrier, cohesive energy density (CED) and fraction free volume (FFV). The results indicated that the bond-length distribution of the MTHPA and NA was the same except for C–C bonds. Compared with the DGEBA/MTHPA system, the DGEBA/NA system had a higher synergy rotational energy barrier and CED, and lower FFV. It can be seen that the slight change of curing agent structure has a significant effect on the synergy rotational energy barrier, CED and FFV, thus affecting the T_g and modulus of the system.

Surface Tracking of MgO/Epoxy Nanocomposites: Effect of Surface Hydrophobicity

Surface tracking has been one of the challenges for outdoor organic insulations, in electronic and electrical devices. In this paper, surface tracking behavior of nano-MgO/epoxy composite samples were measured according to the standard IEC 60112. Improved tracking resistance was obtained in nanocomposites with an 18.75% uplift in the comparative tracking index, and a decrease of 58.20% in the surface ablation area at a fixed 425 V. It was observed that the tracking resistance and surface hydrophobicity shared the same tendency—both, the comparative tracking index and surface contact angle increased with an increase of the nanofiller content. Samples with better hydrophobicity exhibited a higher tracking resistance. It could be the case that the conductive pathway of contamination was harder to form, as a result there were fewer discharging processes. With the development of surface tracking, the surface contact angle abruptly decreased, at first, and tended to be constant, which was also accomplished with the failure of samples. In addition, reduced surface resistivity was also found in the nanocomposites, which was beneficial for releasing surface charges and inhibiting distortions in the electric fields.