Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

Effect of Interfacial Interaction on the Demolding Deformation of Injection Molded Microfluidic Chips

During the demolding process, the interfacial interaction between the polymer and the metal mold insert will lead to the deformation of the micro-structure, which will directly affect the molding quality and performance of injection molded microfluidic chips. In this study, the demolding quality of micro-channels and micro-mixing structures of polycarbonate (PC), polymethyl methacrylate (PMMA), cyclic olefin copolymer (COC), and polystyrene (PS) microfluidic chips for heavy metal detection were investigated by molding experiments. The experimental results showed that the structures of microfluidic chips could be completely replicated. However, tensile deformation and fracture defects were observed at the edges of the micro-structures after demolding. Compared to the Ni mold insert, the calculation of the relative deviation percentages showed that the width of the micro-channel became larger and the depth became smaller, while the dimensions of the micro-mixing structure changes in the opposite direction. Subsequently, a molecular dynamics (MD) simulation model of polymer/nickel (Ni) mold insert for injection molding was established. The changes of adhesion work, demolding resistance and potential energy during demolding were analyzed. The simulation results showed that the polymer structures had some deformations such as necking, molecular chain stretching and voids under the action of adhesion work and demolding resistance. The difference in the contact area with the mold insert directly brought different interfacial interactions. In addition, the potential energy change of the polymer system could be used to quantitatively characterize the demolding deformation of the structure. Overall, the MD method is able to effectively explain the internal mechanisms of interfacial interactions, leading to the demolding deformation of polymer structures from the molecular/atomic scale.

Experimental Investigation and Molecular Dynamics Simulation on the Anti-Adhesion Behavior of Alkanethiols on Nickel Insert in Micro Injection Molding

Due to the adhesion between the polymer melt and nickel (Ni) mold insert in the micro injection molding process, deformation defects frequently occur when the microstructures are demolded from the insert. In this study, self-assembled alkanethiols were applied to modify the surface of Ni mold insert to reduce its surface energy. Experimental trials were undertaken to explore the effect of alkanethiols coating on the replication quality. After that, molecular dynamics (MD) simulation was then used to investigate the adhesion behavior between the self-assembled coating and polypropylene (PP) by establishing three different types of alkanethiol material. The interaction energy, the potential energy change and radial distribution function were calculated to study the anti-adhesion mechanism. Experimental results show that all the three coatings can effectively decrease the adhesion and therefore promote the replication fidelity. It is demonstrated in MD simulation that the adhesion mainly comes from the van der Waals (vdW) force at the interface. The arrangement of sulfur atom on the Ni surface results in different absorbing behaviors. Compared with that of the PP–Ni interface, the interfacial energy and adhesion work after surface treatment is significantly reduced.

Influence of Diamond-Like Carbon Coating on the Channel Deformation of Injection-Molded Microfluidic Chips during the Demolding Process

Injection molding is one of the main techniques for manufacturing microfluidic chips. As an important stage, the demolding process in injection molding will directly affect the quality of the functional unit of microfluidic chips (polymer microchannels), thus limiting the realization of its functions. In this study, molecular dynamics (MD) simulations on the demolding process were carried out to investigate the influence of diamond-like carbon (DLC) coating on the channel deformation. The channel qualities of polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copolymer (COC) and polycarbonate (PC) were analyzed after demolding with nickel (Ni) and DLC-coated mold inserts, respectively. In particular, the non-bonded interfacial interaction energy, elastic recovery and gyration radius of polymer molecular chains were further studied. The results showed that the non-bonded interfacial interaction energies could be significantly reduced by DLC-coating treatment on the mold insert. Moreover, common channel defects such as molecular chain separation, surface burrs and necking did not occur. The treatment of DLC coating could also significantly reduce the change in the gyration radius of polymer molecular chains, so the morphology of the polymer channel could be maintained well. However, the change in the elastic recovery of the polymer channel was increased, and the opening width became larger. In a word, DLC-coating treatment on the mold insert has great application potential for improving the demolding quality of injection-molded microfluidic chips.

Investigation of Interface Thermal Resistance between Polymer and Mold Insert in Micro-Injection Molding by Non-Equilibrium Molecular Dynamics

Micro-injection molding has attracted a wide range of research interests to fabricate polymer products with nanostructures for its advantages of cheap and fast production. The heat transfer between the polymer and the mold insert is important to the performance of products. In this study, the interface thermal resistance (ITR) between the polypropylene (PP) layer and the nickel (Ni) mold insert layer in micro-injection molding was studied by using the method of non-equilibrium molecular dynamics (NEMD) simulation. The relationships among the ITR, the temperature, the packing pressure, the interface morphology, and the interface interaction were investigated. The simulation results showed that the ITR decreased obviously with the increase of the temperature, the packing pressure and the interface interaction. Both rectangle and triangle interface morphologies could enhance the heat transfer compared with the smooth interface. Moreover, the ITR of triangle interface was higher than that of rectangle interface. Based on the analysis of phonon density of states (DOS) for PP-Ni system, it was found that the mismatch between the phonon DOS of the PP atoms and Ni atoms was the main cause of the interface resistance. The frequency distribution of phonon DOS also affected the interface resistance.

Atomistic Investigation on the Wetting Behavior and Interfacial Joining of Polymer-Metal Interface

Polymer-metal hybrid structures can reduce the weight of components while ensuring the structural strength, which in turn save cost and subsequently fuel consumption. The interface strength of polymer-metal hybrid structure is mainly determined by the synergistic effects of interfacial interaction and mechanical interlocking. In this study, the wetting behavior of polypropylene (PP) melt on metal surface was studied by molecular dynamics simulation. Atomistic models with smooth surface and nano-column arrays on Al substrate were constructed. Influences of melt temperature, surface roughness and metal material on the wetting behavior and interfacial joining were analyzed. Afterwards the separation process of injection-molded PP-metal hybrid structure was simulated to analyze joining strength. Results show that the initially sphere-like PP model gradually collapses in the wetting simulation. With a higher temperature, it is easier for molecule chains to spread along the surface. For substrate with rough surface, high density is observed at the bottom or on the upper surface of the column. The contact state is transitioning from Wenzel state to Cassie–Baxter state with the decrease of void fraction. The inner force of injection-molded PP-Fe hybrid structure during the separation process is obviously higher, demonstrating a greater joining strength.