Effective Heat Transfer Pathways of Thermally Conductive Networks Formed by One-Dimensional Carbon Materials with Different Sizes

Research on the Compound Optimization Method of the Electrical and Thermal Properties of SiC/EP Composite Insulating Material

In this paper, in order to improve the electrical and thermal properties of SiC/EP composites, the methods of compounding different crystalline SiC and micro-nano SiC particles are used to optimize them. Under different compound ratios, the thermal conductivity and breakdown voltage parameters of the composite material were investigated. It was found that for the SiC/EP composite materials of different crystal types of SiC, when the ratio of α and β silicon carbide is 1:1, the electrical performance of the composite material is the best, and the breakdown strength can be increased by more than 10% compared with the composite material filled with single crystal particles. For micro-nano compound SiC/EP composites, different total filling amounts of SiC correspond to different optimal ratios of micro/nano particles. At the optimal ratio, the introduction of nanoparticles can increase the breakdown strength of the composite material by more than 10%. Compared with the compound of different crystalline SiC, the advantage is that the introduction of a small amount of nanoparticles can play a strong role in enhancing the break-down field strength. For the filled composite materials, the thermal conductivity mainly depends on whether an effective heat conduction channel can be constructed. Through experiments and finite element simulation calculations, it is found that the filler shape and particle size have a greater impact on the thermal conductivity of the composite material, when the filler shape is rounder, the composite material can more effectively construct the heat conduction channel.

Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications

With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively, the efficiency of the devices will be decreased and their lifetime will be shortened. In addition, the development of the aerospace, automobiles, light emitting diode (LED{ TA \1 "LED; lightemitting diode" \s "LED" \c 1 }) and energy harvesting and conversion has gradually increased the demand for low-density and high thermal conductive materials. In recent years, carbon fiber (CF{ TA \1 "CF; carbon fiber" \c 1 }) has been widely used for the preparation of polymer composites due to its good mechanical property and ultra-high thermal conductivity. CF materials easily form thermal conduction paths through polymer composites to improve the thermal conductivity. This paper describes the research progress, thermal conductivity mechanisms, preparation methods, factors influencing thermal conductivity and provides relevant suggestions for the development of CF composites for thermal management.

Synergistic Effects of Hybrid Carbonaceous Fillers of Carbon Fibers and Reduced Graphene Oxides on Enhanced Heat-Dissipation Capability of Polymer Composites

In this study, we investigated the synergistic effects of thermally conductive hybrid carbonaceous fillers of mesophase pitch-based carbon fibers (MPCFs) and reduced graphene oxides (rGOs) on the thermal conductivity of polymer matrix composites. Micro-sized MPCFs with different lengths (50 μm, 200 μm, and 6 mm) and nano-sized rGOs were used as the thermally conductive fillers used for the preparation of the heat-dissipation polymer composites. For all MPCF fillers with a different length, the thermal conductivity values of the MPCF/epoxy composites were proportional to the MPCF length and loading amount (0–50 wt%) of MPCFs. For an MPCF:rGO weight ratio of 49:1 (total loading amount of 50 wt%), the thermal conductivity values of MPCF-rGO/epoxy composites loaded with MPCFs of 50 μm, 200 μm, and 6 mm increased from 5.56 to 7.98 W/mK (approximately 44% increase), from 7.36 to 9.80 W/mK (approximately 33% increase), and from 11.53 to 12.58 W/mK (approximately 9% increase) compared to the MPCF/epoxy composites, respectively, indicating the synergistic effect on the thermal conductivity enhancement. The rGOs in the MPCF-rGO/epoxy composites acted as thermal bridges between neighboring MPCFs, resulting in the formation of effective heat transfer pathways. In contrast, the MPCF-rGO/epoxy composites with MPCF:rGO weight ratios of 48:2 and 47:3 decreased the synergistic effect more significantly compared to rGO content of 1 wt%, which is associated with the agglomeration of rGO nanoparticles. The synergistic effect was inversely proportional to the MPCF length. A theoretical approach, the modified Mori-Tanaka model, was used to estimate the thermal conductivity values of the MPCF-rGO/epoxy composites, which were in agreement with the experimentally measured values for MPCF-rGO/epoxy composites loaded with short MPCF lengths of 50 and 200 μm.

Preparation and Characterization of UV-LED Curable Acrylic Films Containing Biochar and/or Multiwalled Carbon Nanotubes: Effect of the Filler Loading on the Rheological, Thermal and Optical Properties

UV-LED curable coatings represent an up-to-date attractive field due to the high curing efficiency even in the presence of high filler loadings, as well as to the absence of infrared wavelengths that may negatively impact on heat-sensitive substrates. The addition of carbonaceous materials, such as biochar (BC) and/or multiwalled carbon nanotubes (MWCNTs) could positively improve both the rheological and thermal properties. In this study we report on the synthesis and characterization of carbon-reinforced films containing nanometric (MWCNTs) and micrometric (BC) carbon-based materials. We analyze the rheological properties of the UV-LED curable dispersions, as well as the thermal and optical properties of the resulting films, establishing some correlations between filler dispersion/loading with the main observed properties.