Rheological and Electrical Study of a Composite Material Based on an Epoxy Polymer Containing Cyclotriphosphazene

Hexakis-2-(β-carboxyethenylphenoxy)cyclotriphosphazene: Synthesis, Properties, Modeling Structure

Condensation of hexakis-2-(formylphenoxy)cyclotriphosphazene with malonic acid yielded hexakis-2-(β-carboxyethenylphenoxy)cyclotriphosphazene (2-CEPP), whose structure was confirmed by 31P, 1H, 13C NMR spectroscopy and MALDI-TOF mass spectrometry. A quantum-chemical calculation for the 2-CEPP molecule using the ab initio methods in the 6-311G** basis set and the DFT-PBE0/6-311g** method was performed with geometry optimization of all parameters by the standard gradient method. The acid strength of 2-CEPP was theoretically estimated. Using the small-angle X-ray scattering method, it was found that 2-CEPP is an amorphous substance, which, when heated, can transform into a crystalline state. However, when heated at 370 °C, 2-CEPP undergoes decarboxylation and polymerization to form an insoluble heat-resistant product. The occurrence of decarboxylation and polymerization reactions in the formed styrene fragments was confirmed by thermal (differential-scanning calorimetry) and spectral (solid-state 13C NMR spectroscopy) analysis.

Fire Retardancy and Dielectric Strength of Cyclotriphosphazene Compounds with Schiff Base and Ester Linking Units Attached to the Electron-Withdrawing Side Arm

A series of compounds with Schiff base and ester linking units attached to the electron-withdrawing side arm (Cl, NO₂, and OH) have been successfully synthesized through four schemes of the chemical route. These compounds were characterized using Fourier Transform Infrared spectroscopy (FTIR), Nuclear Magnetic Resonance spectroscopy (NMR), and Carbon, Hydrogen and Nitrogen (CHN) elemental analysis. The epoxy resin was used as a matrix of molding to observe the refinement of fire-retardant properties of the modified cyclotriphosphazene compounds. The fire-retardant testing was done using Limiting Oxygen Index (LOI). The LOI value of pure epoxy resin was increased from 22.75% to 24.71% when incorporated with 1 wt.% of hexasubstituted cyclotriphosphazene (HCCP). Interestingly, all the final compounds gave a positive increment in the LOI value and the highest LOI value was obtained from the compound containing a nitro side arm with LOI value of 26.90%. In order to understand the thermal stability of these compounds, Thermogravimetric Analysis (TGA) was carried out. The compound with the nitro group at the terminal end has the highest char residue which is 34.2% at 700 °C. This indicated that the presence of the nitro withdrawing group was able to enhance the fire retardancy of the materials. Based on SEM observation, the shape of the final compound’s char residue demonstrated the formation of a porous protective layer with a dense surface. The dielectric property was conducted according to ASTM D149 AC breakdown voltage to determine its dielectric strength. The results showed that the highest dielectric strength value belonged to the compound containing a nitro group side arm with 24.41 kV/mm⁻¹ due to the π electron delocalization.