3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

Efficient Approach for Direct Robust Surface Grafting of Polyethyleneimine onto a Polyester Surface during Moulding

This paper uses a very effective way for surface modification of thermoplastic polymers during moulding. It is based on a grafting reaction between a thin layer of a functional polymer, deposited on a substrate in advance, and a polymer melt. In this paper, a glycol-modified polyethylene terephthalate (PETG) that was brought in contact with a polyethyleneimine layer during fused filament fabrication is investigated. The focus of this paper is the investigation of the reaction product. Grafting was realised by the formation of stable amide bonds by amidation of ester groups in the main chain of a PETG. XPS investigations revealed that the conversion of amino groups was very high, the distribution was even, and the quantity of amino groups per polyester surface area was still very high. The surface properties of the produced polyester part were mainly characterised by polyethyleneimine. The grafting was able to resist several cycles of extraction in alkaline solutions. The stability was only limited by saponification of the polyester. The degree of surface modification was dependent on the molar mass of polyethyleneimine. This could be rationalised, because grafting only occurred with the one polyethyleneimine molecule that is in close vicinity to the polyester surface when both components come in contact. Fused deposition modelling was chosen as the model process with control over each processing step. However, any other moulding process may be applied, particularly injection moulding for mass production.

New Metal-Plastic Hybrid Additive Manufacturing for Precise Fabrication of Arbitrary Metal Patterns on External and Even Internal Surfaces of 3D Plastic Structures

Constructing precise metal patterns on complex three-dimensional (3D) plastic parts allows the fabrication of functional devices for advanced applications. However, it is currently expensive and requires complex processes. This study demonstrates a process for the fabrication of 3D metal-plastic composite structures with arbitrarily complex shapes. A light-cured resin is modified to prepare the active precursor allowing subsequent electroless plating (ELP). A multimaterial digital light processing 3D printer was newly developed to fabricate the parts containing regions made of either standard resin or active precursor nested within each other. Selective 3D ELP processing of such parts provided various metal-plastic composite parts having complicated hollow structures with specific topological relationships with the resolution of 40 μm. Using this technique, 3D devices that cannot be manufactured by traditional methods are possible, and metal patterns can be produced inside plastic parts as a means of further miniaturizing electronics. The proposed method can also generate metal coatings exhibiting improved adhesion of metal to substrate. Finally, several sensors composed of different functional materials and specific metal patterns were designed and fabricated. The present results demonstrate the viability of the proposed method and suggest potential applications in the fields of 3D electronics, wearable devices, and sensors.

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

In laser-induced selective metallization (LISM), conventional laser activators only work at a single laser wavelength. This study reported a new laser activator (MoO₃) very suitable for both 355 nm UV and 1064 nm near-infrared (NIR) lasers for the first time. When applying MoO₃ to polymers, the prepared Cu layer on laser-activated polymers showed a good conductivity (2.63 × 10⁶ Ω^-1·m^-1) and excellent adhesion. Scanning electron microscopy, optical microscopy, and resistance analysis revealed the excellent LISM performance of the polymer/MoO₃ composites, and the quality of the Cu layer prepared using the UV laser is much better than that using the NIR laser. The limit width of the copper wire prepared by the UV laser is as narrow as 30.1 μm. We also confirmed the mechanism of MoO₃ initiating electroless copper plating after laser activation to be the autocatalytic mechanism, which is very different from the conventional reduction mechanism. The effect of laser activation was only to expose the MoO₃ active species to the polymer surface. X-ray diffraction and tube experiments revealed that the activity of α·h-MoO₃ was higher than that of α-MoO₃. X-ray photoelectron spectroscopy indicated that a part of Mo⁶⁺ was reduced to Mo⁵⁺ during laser activations, leading to the increase of the oxygen vacancies in MoO₃ and possibly further enhancing the activity of MoO₃. Besides, the micro-rough structures caused by the laser on the polymer surface provided riveting points for successfully depositing the copper layer. The Ni-Cu, Ag-Cu, and Au-Ni-Cu layers were obtained via the continued deposit of other metals on the Cu layer. The resistances of these metal layers had much better stability than that of the neat Cu layer. Furthermore, the Au layer further enhanced the conductivity of the circuit. The proposed strategy is easy for large-scale industrial applications, which will greatly expand the application scenarios of the LISM field.

Laser Direct Structured 3D Circuits on Silicone

Silicone rubber is a biocompatible elastomeric polymer, with great potential for mechanical and biologic sensing applications, if electrical circuits can be reliably integrated. Laser direct structuring is a bottom-up circuit fabrication process, whereby copper is chemically grown on laser exposed regions of a modified substrate, promoting adhesion by laser roughening the circuit tracks. In this Research Article, we successfully demonstrate this process using superflexible biocompatible silicone (30 hardness on Shore 00) with copper chromite additive, cast into both 2D planar and 3D contour substrates. A horseshoe pattern circuit, meander and Hilbert fractal inductors, and a 3D hemispherical helix trace are fabricated and tested. The range of laser power and copper chromite concentration are explored. Mechanical testing is performed to determine breakage strain and elastic modulus. Material stiffness and trace peel strength are shown to increase with copper chromite concentration. Peel strength is measured to be very high, from approximately 1 to 5 kN/m, depending on dopant loading. With high adhesion and conductivity, the simple laser-writing process presented here enables high-quality circuit integration into elastomeric silicone.