1
|
Research on the Compound Optimization Method of the Electrical and Thermal Properties of SiC/EP Composite Insulating Material. Polymers (Basel) 2021; 13:polym13193369. [PMID: 34641181 PMCID: PMC8512577 DOI: 10.3390/polym13193369] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/26/2021] [Revised: 09/15/2021] [Accepted: 09/21/2021] [Indexed: 12/03/2022] Open
Abstract
In this paper, in order to improve the electrical and thermal properties of SiC/EP composites, the methods of compounding different crystalline SiC and micro-nano SiC particles are used to optimize them. Under different compound ratios, the thermal conductivity and breakdown voltage parameters of the composite material were investigated. It was found that for the SiC/EP composite materials of different crystal types of SiC, when the ratio of α and β silicon carbide is 1:1, the electrical performance of the composite material is the best, and the breakdown strength can be increased by more than 10% compared with the composite material filled with single crystal particles. For micro-nano compound SiC/EP composites, different total filling amounts of SiC correspond to different optimal ratios of micro/nano particles. At the optimal ratio, the introduction of nanoparticles can increase the breakdown strength of the composite material by more than 10%. Compared with the compound of different crystalline SiC, the advantage is that the introduction of a small amount of nanoparticles can play a strong role in enhancing the break-down field strength. For the filled composite materials, the thermal conductivity mainly depends on whether an effective heat conduction channel can be constructed. Through experiments and finite element simulation calculations, it is found that the filler shape and particle size have a greater impact on the thermal conductivity of the composite material, when the filler shape is rounder, the composite material can more effectively construct the heat conduction channel.
Collapse
|
2
|
Wang Y, Tang B, Gao Y, Wu X, Chen J, Shan L, Sun K, Zhao Y, Yang K, Yu J, Li W. Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method. ACS OMEGA 2021; 6:19238-19251. [PMID: 34337262 PMCID: PMC8320143 DOI: 10.1021/acsomega.1c02694] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/23/2021] [Accepted: 07/06/2021] [Indexed: 05/24/2023]
Abstract
Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones). Therefore, the research on improving the thermal conductivity of materials has a very important theoretical value and a practical application value. Whether the thermally conductive filler in polymer composites can form a highly thermal conductive pathway is a key issue at this stage. The carbon fiber/carbon felt (CF/C felt) prepared in the study has a three-dimensional continuous network structure. The nickel-coated carbon fiber/carbon felt (CF/C/Ni felt) was fabricated by an electroplating deposition method. Three-dimensional CF/C/Ni/epoxy composites were manufactured by vacuum-assisted liquid-phase impregnation. By forming connection points between the adjacent carbon fibers, the thermal conduction path inside the felt can be improved so as to improve the thermal conductivity of the CF/C/Ni/epoxy composite. The thermal conductivity of the CF/C/Ni/epoxy composite (in-plane K∥) is up to 2.13 W/(m K) with 14.0 wt % CF/C and 3.70 wt % Ni particles (60 min electroplating deposition). This paper provides a theoretical basis for the development of high thermal conductivity and high-performance composite materials urgently needed in industrial production and high-tech fields.
Collapse
Affiliation(s)
- Ying Wang
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Bo Tang
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Yuan Gao
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
- Purchasing
and Supplying Logistics Center Department, COMAC Shanghai Aircraft Manufacturing Co., Ltd, Shanghai 201324, China
| | - Xinfeng Wu
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Jin Chen
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
- Electronics
Materials and Systems Laboratory, Department of Microtechnology and
Nanoscience (MC2), Chalmers University of
Technology, SE-412 58 Göteborg, Sweden
| | - Liming Shan
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Kai Sun
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Yuantao Zhao
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Ke Yang
- School
of Materials Science and Engineering, Central
South University, Changsha 410083, China
| | - Jinhong Yu
- Key
Laboratory of Marine Materials and Related Technologies, Zhejiang
Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology & Engineering,
Chinese Academy of Sciences, Ningbo 315201, China
| | - Wenge Li
- Merchant
Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| |
Collapse
|