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Xu Z, Zhang C, Li Y, Zou J, Li Y, Yang B, Hu R, Qian Q. Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin. PLoS One 2023; 18:e0292878. [PMID: 37831678 PMCID: PMC10575537 DOI: 10.1371/journal.pone.0292878] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/10/2023] [Accepted: 10/02/2023] [Indexed: 10/15/2023] Open
Abstract
Epoxy thermal conductive adhesives with high thermal conductivity and dynamic mechanical properties are important thermally conductive materials for fabricating highly integrated electronic devices. In this paper, micro-Al2O3 is used as a thermally conductive filler for the epoxy resin composite and investigated the effect of micron-sized alumina particle size on the thermal conductivity and dynamic mechanical property of epoxy resin by the transient planar hot plate method and DMA (Dynamic mechanical analysis). The experimental results show that with the same amount of alumina filling, the thermal conductivity and Tg (glass transition temperature) of epoxy/Al2O3 composite material decrease with the increase of alumina particle size. The maximum thermal conductivity of the composite material is 0.679 (W/mK), while the energy storage modulus of epoxy/Al2O3 composite material increases with the increase of alumina particle size, and the maximum energy storage modulus of the composite material is 160MPa. Compared with pure epoxy resin, the thermal conductivity and energy storage modulus have increased by 2.7 and 3.2 times, respectively. The epoxy/Al2O3 composite was applied to the COB (Chips On Board) type LED package, and the substrate temperature of the LED dropped to the lowest after 1.5 hours of operation using EP-A5 composite, and the temperature was stabilized at 38.2°C, indicating that the addition of 5-micron alumina composite has the best heat dissipation in the COB type LED package. These results are critical for the implementation of particulate-filled polymer composites in practical applications because relaxed material specifications and handling procedures can be incorporated in production environments to improve efficiency.
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Affiliation(s)
- Zhe Xu
- School of Materials Science and Engineering, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Cheng Zhang
- School of Science, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Yang Li
- School of Materials Science and Engineering, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Jun Zou
- School of Science, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Yuefeng Li
- School of Science, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Bobo Yang
- School of Science, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Rongrong Hu
- School of Science, Shanghai Institute of Technology, Fengxian District, Shanghai, China
| | - Qi Qian
- Zhejiang Silanex Technology (Taizhou) Co., Ltd, Luqiao District, Taizhou City, Zhejiang, China
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Long Y, Shi L, Wang Q, Qu H, Hao C, Lei Q. Effect of branched alumina on thermal conductivity of epoxy resin. J IND ENG CHEM 2022. [DOI: 10.1016/j.jiec.2022.12.027] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/23/2022]
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Lang M, Hirner S, Wiesbrock F, Fuchs P. A Review on Modeling Cure Kinetics and Mechanisms of Photopolymerization. Polymers (Basel) 2022; 14:polym14102074. [PMID: 35631956 PMCID: PMC9145830 DOI: 10.3390/polym14102074] [Citation(s) in RCA: 17] [Impact Index Per Article: 8.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/27/2022] [Revised: 05/10/2022] [Accepted: 05/17/2022] [Indexed: 02/01/2023] Open
Abstract
Photopolymerizations, in which the initiation of a chemical-physical reaction occurs by the exposure of photosensitive monomers to a high-intensity light source, have become a well-accepted technology for manufacturing polymers. Providing significant advantages over thermal-initiated polymerizations, including fast and controllable reaction rates, as well as spatial and temporal control over the formation of material, this technology has found a large variety of industrial applications. The reaction mechanisms and kinetics are quite complex as the system moves quickly from a liquid monomer mixture to a solid polymer. Therefore, the study of curing kinetics is of utmost importance for industrial applications, providing both the understanding of the process development and the improvement of the quality of parts manufactured via photopolymerization. Consequently, this review aims at presenting the materials and curing chemistry of such ultrafast crosslinking polymerization reactions as well as the research efforts on theoretical models to reproduce cure kinetics and mechanisms for free-radical and cationic photopolymerizations including diffusion-controlled phenomena and oxygen inhibition reactions in free-radical systems.
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Affiliation(s)
- Margit Lang
- Polymer Competence Center Leoben, 8700 Leoben, Austria;
- Correspondence: ; Tel.: +43-384-242-962-753
| | - Stefan Hirner
- Institute for Chemistry and Technology of Materials, University of Technology Graz, NAWI Graz, 8010 Graz, Austria; (S.H.); (F.W.)
| | - Frank Wiesbrock
- Institute for Chemistry and Technology of Materials, University of Technology Graz, NAWI Graz, 8010 Graz, Austria; (S.H.); (F.W.)
| | - Peter Fuchs
- Polymer Competence Center Leoben, 8700 Leoben, Austria;
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Kandpal C, Pandey J, Dey R, Singh AK, Singh VK. Comparative study of viscosity, diffusion coefficient, thermal conductivity and Gibbs free energy for binary liquid mixtures at varying temperatures. J Mol Liq 2021. [DOI: 10.1016/j.molliq.2021.115858] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/06/2023]
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Wu X, Gao Y, Jiang T, Zheng L, Wang Y, Tang B, Sun K, Zhao Y, Li W, Yang K, Yu J. 3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites. Polymers (Basel) 2021; 13:polym13060980. [PMID: 33806844 PMCID: PMC8004691 DOI: 10.3390/polym13060980] [Citation(s) in RCA: 10] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/14/2021] [Revised: 03/17/2021] [Accepted: 03/17/2021] [Indexed: 01/13/2023] Open
Abstract
The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.
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Affiliation(s)
- Xinfeng Wu
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
- Correspondence: (X.W.); (K.Y.); (J.Y.)
| | - Yuan Gao
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Tao Jiang
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Lingyu Zheng
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Ying Wang
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Bo Tang
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Kai Sun
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Yuantao Zhao
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Wenge Li
- College of Ocean Science and Engineering and Merchant Marine College, Shanghai Maritime University, Shanghai 201306, China; (Y.G.); (T.J.); (L.Z.); (Y.W.); (B.T.); (K.S.); (Y.Z.); (W.L.)
| | - Ke Yang
- School of Materials Science and Engineering, Central South University, Changsha 410083, China
- Correspondence: (X.W.); (K.Y.); (J.Y.)
| | - Jinhong Yu
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- Correspondence: (X.W.); (K.Y.); (J.Y.)
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