Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

The low intrinsic thermal conduction and high dielectric properties of epoxy resins have significantly limited their applications in electrical and electronic devices with high integration, high frequency, high power, and miniaturization. Herein, a liquid crystalline epoxy (LCE) monomer with a biphenyl mesogenic unit was first synthesized through an efficient one-step reaction. Subsequently, bisphenol AF (BPAF) containing low-polarizable -CF3 groups and 4,4'-diaminodiphenylmethane (DDM) were applied to cure the LCE and commercial diglycidyl ether of bisphenol A-type epoxy (E-51), respectively, to afford four kinds of epoxy resins with various intrinsic thermal conductivity and dielectricity values. Owing to the dual effect of microscopically stacking of mesogens and the contribution of fluorine to the formation of liquid crystallinity, ordered microstructures of the nematic liquid crystal phase were formed within the cross-linking network of LCE as confirmed by polarized optical microscopy and X-ray diffraction. Consequently, phonon scattering was suppressed, and the intrinsic thermal conductivity was improved considerably to 0.38 W/(m·K), nearly twice as high as that of E-51 cured with DDM (0.20 W/(m·K)). Additionally, the ordered microstructure and ultralow polar -CF3 groups within LCE cured with BPAF enabled the epoxy resin to exhibit a remarkably lower and stable dielectric constant (ε) and dielectric loss tangent (tan δ) over both low and high frequencies compared to E-51 cured with DDM. The ε decreased from 3.40 to 2.72 while the tan δ decreased from 0.044 to 0.038 at 10 GHz. This work presents a scalable and facile strategy for breaking the bottleneck of making epoxy resins simultaneously with high inherent thermal conduction and low dielectric performance.

Liquid Crystal Materials for Biomedical Applications

Liquid crystal is a state of matter being intermediate between solid and liquid. Liquid crystal materials exhibit both orientational order and fluidity. While liquid crystals have long been highly recognized in the display industry, in recent decades, liquid crystals provide new opportunities into the cross-field of material science and biomedicine due to their biocompatibility, multifunctionality, and responsiveness. In this review, the latest achievements of liquid crystal materials applied in biomedical fields are summarized. The start is made by introducing the basic concepts of liquid crystals, and then shifting to the components of liquid crystals as well as functional materials derived therefrom. After that, the ongoing and foreseeable applications of liquid crystal materials in the biomedical field with emphasis put on several cutting-edge aspects, including drug delivery, bioimaging, tissue engineering, implantable devices, biosensing, and wearable devices are discussed. It is hoped that this review will stimulate ingenious ideas for the future generation of liquid crystal-based drug development, artificial implants, disease diagnosis, health status monitoring, and beyond.

Comparison of the Properties of Epoxy Resins Containing Various Trifluoromethyl Groups with Low Dielectric Constant

A series of epoxy resins containing various trifluoromethyl groups were synthesized and thermally cured with diaminodiphenylmethane (DDM) and aminophenyl sulfone (DDS). All epoxy resins exhibited excellent thermal stability with the glass transition temperatures of above 128 °C and 5% weight loss temperatures of above 300 °C. DDS-cured epoxy resins possessed higher thermal stability than that of DDM-cured epoxy resins, while DDM-cured epoxy resins showed better mechanical, dielectric, and hydrophobic properties. Additionally, DDM-cured epoxy resins with different locations and numbers of trifluoromethyl groups showed flexural strength in the range of 95.55~152.36 MPa, flexural modulus in the range of 1.71~2.65 GPa, dielectric constant in the range of 2.55~3.05, and water absorption in the range of 0.49~0.95%. These results indicate that the incorporation of trifluoromethyl pendant groups into epoxy resins can be a valid strategy to improve the dielectric and hydrophobic performance.

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

Induced Smectic E Phase in a Binary Blend of Side-Chain Liquid Crystalline Polymers

Two liquid crystalline polymers containing an azobenzene or cyanobiphenyl mesogenic side chain that adopt smectic A phases are mechanically mixed at 1:1 mesogen molar ratio at an isotropic phase temperature and then cooled. The resultant binary polymer mixture behaves like a single component as revealed by polarized microscopy observation and differential scanning calorimetry, indicating that the binary mixture forms a fully compatible polymer blend. Moreover, the simple polymer blend unexpectedly leads to a higher-ordered smectic E phase where a herringbone structure is formed with restricted mesogen axis rotation. These results suggest a specific intermolecular interaction between the two mesogens, thereby inducing unusual compatibilized polymer blends and the most ordered liquid crystal (LC) phase.

Characteristic and Synthesis of High-Temperature Resistant Liquid Crystal Epoxy Resin Containing Boron Nitride Composite

Five liquid crystal epoxy resins and composites containing flat boron nitride (f-BN) and spherical boron nitride (s-BN) were successfully synthesized. The chemical structures, crystal diffraction, and thermal conductivity of the liquid crystal (LC) epoxy composites were measured using Nuclear Magnetic Resonance (NMR), Differential Scanning Calorimetry (DSC), X-ray, and Discovery Xenon Flash. In this study, the molecular arrangement of five LC epoxy resins and the thermal conductivity of their composites were carefully discussed. Several different amounts of flat boron nitride and spherical boron nitride were added to the five LC epoxy resins. The influence of nano-scale ceramic materials, f-BN, and s-BN, on the thermal conductivity of the LC epoxy resins, was studied. It is worth noting that the thermal conductivity of the spherical boron nitride composite demonstrated a better result than that of the flat boron nitride composite. In simpler terms, the thermal conductivity of the composites is closely related to the molecular arrangement of the LC resin and the amount of BN added. The results demonstrate that the SBPDAE/s-BN (60%) composite shows the highest thermal conductivity of 9.36 W/mK in the vertical direction. These data prove that the LC alignment of the matrix will greatly enhance the thermal conductivity of the composites.