Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability

The in-line control of curing during the molding process significantly improves product quality and ensures the reliability of packaging materials with the required thermo-mechanical and adhesion properties. The choice of the morphological and thermo-mechanical properties of the molded material, and the accuracy of their determination through carefully selected thermo-analytical methods, play a crucial role in the qualitative prediction of trends in packaging product properties as process parameters are varied. This work aimed to verify the quality of the models and their validation using a highly filled molding resin with an identical chemical composition but 10 wt% difference in silica particles (SPs). Morphological and mechanical material properties were determined by dielectric analysis (DEA), differential scanning calorimetry (DSC), warpage analysis and dynamic mechanical analysis (DMA). The effects of temperature and injection speed on the morphological properties were analyzed through the design of experiments (DoE) and illustrated by response surface plots. A comprehensive approach to monitor the evolution of ionic viscosity (IV), residual enthalpy (dHrest), glass transition temperature (Tg), and storage modulus (E) as a function of the transfer-mold process parameters and post-mold-cure (PMC) conditions of the material was established. The reliability of Tg estimation was tested using two methods: warpage analysis and DMA. The noticeable deterioration in the quality of the analytical signal for highly filled materials at high cure rates is discussed. Controlling the temperature by increasing the injection speed leads to the formation of a polymer network with a lower Tg and an increased storage modulus, indicating a lower density and a more heterogeneous structure due to the high heating rate and shear heating effect.

Process Optimization of the Morphological Properties of Epoxy Resin Molding Compounds Using Response Surface Design

An epoxy compound's polymer structure can be characterized by the glass transition temperature (Tg) which is often seen as the primary morphological characteristic. Determining the Tg after manufacturing thermoset-molded parts is an important objective in material characterization. To characterize quantitatively the dependence of Tg on the degree of cure, the DiBenedetto equation is usually used. Monitoring polymer network formation during molding processes is therefore one of the most challenging tasks in polymer processing and can be achieved using dielectric analysis (DEA). In this study, the morphological properties of an epoxy resin-based molding compounds (EMC) were optimized for the molding process using response surface analysis. Processing parameters such as curing temperature, curing time, and injection rate were investigated according to a DoE strategy and analyzed as the main factors affecting Tg as well as the degree of cure. A new method to measure the Tg at a certain degree of cure was developed based on warpage analysis. The degree of cure was determined inline via dielectric analysis (DEA) and offline using differential scanning calorimetry (DSC). The results were used as the response in the DoE models. The use of the DiBenedetto equation to refine the response characteristics for a wide range of process parameters has significantly improved the quality of response surface models based on the DoE approach.

In Situ Monitoring of the Curing of Highly Filled Epoxy Molding Compounds: The Influence of Reaction Type and Silica Content on Cure Kinetic Models

Monitoring of molding processes is one of the most challenging future tasks in polymer processing. In this work, the in situ monitoring of the curing behavior of highly filled EMCs (silica filler content ranging from 73 to 83 wt%) and the effect of filler load on curing kinetics are investigated. Kinetic modelling using the Friedman approach was applied using real-time process data obtained from in situ DEA measurements, and these online kinetic models were compared with curing analysis data obtained from offline DSC measurements. For an autocatalytic fast-reacting material to be processed above the glass transition temperature Tg and for an autocatalytic slow-reacting material to be processed below Tg, time-temperature-transformation (TTT) diagrams were generated to investigate the reaction behavior regarding Tg progression. Incorporating a material containing a lower silica filler content of 10 wt% enabled analysis of the effects of filler content on sensor sensitivity and curing kinetics. Lower silica particle content (and a larger fraction of organic resin, respectively) favored reaction kinetics, resulting in a faster reaction towards Tg1. Kinetic analysis using DEA and DSC facilitated the development of highly accurate prediction models using the Friedman model-free approach. Lower silica particle content resulted in enhanced sensitivity of the analytical method, leading, in turn, to more precise prediction models for the degree of cure.

In situ Thermoset Cure Sensing: A Review of Correlation Methods

Thermoset polymer composites have increased in use across multiple industries, with recent applications consisting of high-complexity and large-scale parts. As applications expand, the emphasis on accurate process-monitoring techniques has increased, with a variety of in situ cure-monitoring sensors being investigated by various research teams. To date, a wide range of data analysis techniques have been used to correlate data collected from thermocouple, dielectric, ultrasonic, and fibre-optic sensors to information on the material cure state. The methods used in existing publications have not been explicitly differentiated between, nor have they been directly compared. This paper provides a critical review of the different data collection and cure state correlation methods for these sensor types. The review includes details of the relevant sensor configurations and governing equations, material combinations, data verification techniques, identified potential research gaps, and areas of improvement. A wide range of both qualitative and quantitative analysis methods are discussed for each sensing technology. Critical analysis is provided on the capability and limitations of these methods to directly identify cure state information for the materials under investigation. This paper aims to provide the reader with sufficient background on available analysis techniques to assist in selecting the most appropriate method for the application.

Effectiveness and Productivity Improvement of Conventional Pultrusion Processes

Pultrusion is a technological process in which fibers impregnated with resin move through the heated die and solidify into a composite profile with a constant cross section, as in the metallic die. The effectiveness and productivity of conventional pultrusion processes, preserving the quality of pultruded profiles, could be improved by process optimization or by the application of new, effective heating sources instead of electrical resistances with high heat losses. Due to the large dimension of the numerical problem and multiple iterations applied for the solution of government equations, an optimization methodology was developed, using the method of experimental design and the response surface technique. To develop microwave-assisted pultrusion processes, as well as pultrusion tooling design and process control, new effective electromagnetic-thermo-chemical finite element models and algorithms were developed by using general-purpose finite element software that results in considerable savings in development time and costs and makes available various modeling features of the finite element packages. The effectiveness and productivity of the optimized conventional pultrusion processes and the developed microwave-assisted pultrusion processes are estimated in comparison with the real pultrusion processes used in laboratory and industrial shops.