Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

Polymer and Composite Materials in Two-Phase Passive Thermal Management Systems: A Review

The application of polymeric and composite materials in two-phase passive heat transfer devices is reviewed critically, with a focus on advantages and disadvantages of these materials in thermal management systems. Recent technology developments led to an increase of the power density in several applications including portable electronics, space and deployable systems, etc., which require high-performance and compact thermal management systems. In this context, passive two-phase systems are the most promising heat transfer devices to dissipate large heat fluxes without external power supply. Usually, heat transfer systems are built with metals due to their excellent thermal properties. However, there is an increasing interest in replacing metallic materials with polymers and composites that can offer cost-effectiveness, light weight and high mechanical flexibility. The present work reviews state-of the-art applications of polymers and composites in two-phase passive thermal management systems, with an analysis of their limitations and technical challenges.

Cadmium Sulfide-Reinforced Double-Shell Microencapsulated Phase Change Materials for Advanced Thermal Energy Storage

Phase change materials (PCMs) are widely used to improve energy utilization efficiency due to their high energy storage capacity. In this study, double-shell microencapsulated PCMs were constructed to resolve the liquid leakage issue and low thermal conductivity of organic PCMs, which also possess high thermal stability and multifunctionality. We used assembly to construct an inorganic-organic double shell for microencapsulate PCMs, which possessed the unprecedented synergetic properties of a cadmium sulfide (CdS) shell and melamine-formaldehyde polymeric shell. The scanning electron microscopy (SEM) and transmission electron microscopy (TEM) images confirmed the well-designed double-shell structure of the microcapsules, and the CdS was successfully assembled as the second shell on the surface of the polymer shell. The differential scanning calorimeter (DSC) showed that the double-shell microcapsules had a high enthalpy of 114.58 J/g, which indicated almost no changes after experiencing 100 thermal cycles, indicating good thermal reliability. The microcapsules also showed good shape stability and antileakage performance, which displayed no shape change and leakage after heating at 60 °C for 30 min. In addition, the photothermal conversion efficiency of the double-shell microcapsules reached 91.3%. Thus, this study may promote the development of microencapsulated PCMs with multifunctionality, offering considerable application prospects in intelligent temperature management for smart textiles and wearable electronic devices in combination with their solar thermal energy conversion and storage performance.

Organic–Inorganic Double-Gel System Thermally Insulating and Hydrophobic Polyimide Aerogel

Aerogel materials are used in various fields, but there is a shortage of aerogel materials with an excellent combination of mechanical properties, thermal stability, and easy preparation. In this study, polyimide aerogel materials with superior mechanical properties, thermal stability, and low thermal conductivity were prepared by forming a double-gel system in the liquid phase. The amino-modified gel, prepared by coating SiO₂ nano-microspheres with GO through a modified sol-gel method (SiO₂@GO-NH₂), was subsequently homogeneously dispersed with PAA wet gel in water to form a double-gel system. The construction of a double-gel system enabled the PI aerogel to shape a unique honeycomb porous structure and a multi-layered interface of PI/SiO₂/GO. The final obtained PI aerogel possessed effective thermal conductivity (0.0309 W/m·K) and a high specific modulus (46.19 m²/s²). In addition, the high thermal stability (543.80 °C in Ar atmosphere) and the ability to retain properties under heat treatment proved its durability in high thermal environments. The hydrophobicity (131.55°) proves its resistance to water from the environment. The excellent performance of this PI aerogel and its durability in thermal working environments make it possible to be applied in varied industrial and research fields, such as construction and energy, where heat and thermal insulation are required.

State-of-the-Art, Opportunities, and Challenges in Bottom-up Synthesis of Polymers with High Thermal Conductivity

In contrast to metals, polymers are predominantly thermal and electrical insulators. With their unparalleled advantages such as light weight, turning polymer insulators into heat conductors with metal-like thermal conductivity is...

A Novel Branched Al2O3/Silicon Rubber Composite with Improved Thermal Conductivity and Excellent Electrical Insulation Performance

In this paper, we report a thermal conductive polymer composite that consists of silicone rubber (SR) and branched Al₂O₃ (B-Al₂O₃). Owing to the unique two-dimensional branched structure, B-Al₂O₃ particles form a continuous three-dimensional network structure by overlapping each other in the matrix, serving as a continuous heat conductive pathway. As a result, the polymer composite with a 70 wt% filler achieves a maximum thermal conductivity of 1.242 Wm⁻¹ K⁻¹, which is equivalent to a significant enhancement of 521% compared to that of a pure matrix. In addition, the composite maintains a high volume resistivity of 7.94 × 10¹⁴ Ω·cm with the loading of 70 wt%, indicating that it meets the requirements in the field of electrical insulation. Moreover, B-Al₂O₃ fillers are well dispersed (no large agglomerates) and form a strong interfacial adhesion with the matrix. Therefore, the thermal decomposition temperature, residual mass, tensile strength, modulus and modulus of toughness of composites are significantly improved simultaneously. This strategy provides new insights for the design of high-performance polymer composites with potential application in advanced thermal management in modern electronics.

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.