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Liu Q, Qi L, Wang A, Liu X, Yue Q. High-Temperature Resistance of Anchorage System for Carbon Fiber-Reinforced Polymer Composite Cable-A Review. Polymers (Basel) 2024; 16:1960. [PMID: 39065277 PMCID: PMC11281242 DOI: 10.3390/polym16141960] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/03/2024] [Revised: 06/24/2024] [Accepted: 07/03/2024] [Indexed: 07/28/2024] Open
Abstract
Unidirectional carbon fiber-reinforced polymer (CFRP) may exhibit significant mechanical softening in the transverse direction at an elevated temperature. While significant transverse compressive stress exists on CFRP due to the clamping force from anchorage, a CFRP cable may exhibit anchorage failure when suffering an accidental fire disaster. The high-temperature resistance of a CFRP cable anchorage is critical, and clarifying the performance deterioration and failure mechanism of a CFRP cable anchorage system at elevated temperature is fundamental for clarifying its fire resistance. This paper reviews the current research status of the high-temperature resistance of CFRP cable anchorage systems from two aspects, including the high-temperature resistance of the comprising materials and the anchorage system. The reviews on the high-temperature properties of the comprising materials are summarized from two aspects. Firstly, the mechanical performance degradation of bonding epoxy resin at elevated temperatures and the effect of a filler on its mechanical-thermal properties are analyzed. Secondly, the mechanical performances of CFRP composites at elevated temperatures are summarized, with consideration of the stress state of the CFRP cable under the constraint of an anchorage device. The reviews on the high-temperature resistance of the anchorage system also include two aspects. Firstly, the temperature field solution method for the anchorage system is summarized and discussed. Secondly, the current research status of the anchorage performance at elevated temperatures is also summarized and discussed. Based on these reviews, the research shortage of the high-temperature resistance of CFRP cable anchorage systems is summarized, and further research is recommended.
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Affiliation(s)
- Qian Liu
- School of Civil Engineering, Southwest Jiaotong University, Chengdu 610031, China; (Q.L.); (Q.Y.)
| | - Ligang Qi
- Research Center of Shanghai Carbon Fiber Composite Application Technology in Civil Engineering, China Construction Eighth Engineering Division Co., Ltd., Shanghai 200122, China;
| | - Anni Wang
- Research Institute of Urbanization and Urban Safety, School of Civil and Resource Engineering, University of Science and Technology Beijing, Beijing 100083, China;
| | - Xiaogang Liu
- Research Institute of Urbanization and Urban Safety, School of Civil and Resource Engineering, University of Science and Technology Beijing, Beijing 100083, China;
| | - Qingrui Yue
- School of Civil Engineering, Southwest Jiaotong University, Chengdu 610031, China; (Q.L.); (Q.Y.)
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Li H, Li YQ, You Y, Xie HB. High-Performance One-Component Epoxy Adhesive Based on the Synergistic Effect of Lignin-Derived Triaryl-Imidazole and Phytic Acid. ACS Macro Lett 2024; 13:775-780. [PMID: 38832802 DOI: 10.1021/acsmacrolett.4c00247] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 06/05/2024]
Abstract
Latent curing agents are essential in the formulation of one-component epoxy resins, yet they are seldom derived from fully biobased chemicals. In the present work, a fully biobased latent curing agent for epoxy resins (BIMPA) was produced by synthesizing an ionic complex of lignin-derived triaryl-imidazole (BIM) and phytic acid (PA). Benefiting from the synergistic effect of BIM and PA, the one-component epoxy resin, composed of BIMPA and commercially available E51, exhibits a storage stability of over 90 days. Upon heating, the ionic complex undergoes decomposition, liberating the active imidazole to cure the precursor. The resulting epoxy resins exhibited a flexural modulus of 3.09 GPa, a flexural strength of 107.47 MPa, a notched izod impact strength of 2.47 kJ/m3, and a shear strength of 41.02 MPa. The outcome can provide an effective supplement for the development of biobased epoxy resins.
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Affiliation(s)
- Hai Li
- Department of Polymeric Materials and Engineering, College of Materials and Metallurgy, Guizhou University, West Campus, Huaxi District, Guiyang 550025, P. R. China
| | - Yun Qi Li
- Department of Polymeric Materials and Engineering, College of Materials and Metallurgy, Guizhou University, West Campus, Huaxi District, Guiyang 550025, P. R. China
| | - Yang You
- Department of Polymeric Materials and Engineering, College of Materials and Metallurgy, Guizhou University, West Campus, Huaxi District, Guiyang 550025, P. R. China
| | - Hai Bo Xie
- Department of Polymeric Materials and Engineering, College of Materials and Metallurgy, Guizhou University, West Campus, Huaxi District, Guiyang 550025, P. R. China
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Kim CS, Jang J, Im HG, Yoon S, Kang DJ. Preparation and performance of alumina/epoxy-siloxane composites: A comparative study on thermal- and photo-curing process. Heliyon 2024; 10:e27580. [PMID: 38495185 PMCID: PMC10940936 DOI: 10.1016/j.heliyon.2024.e27580] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/25/2024] [Accepted: 03/01/2024] [Indexed: 03/19/2024] Open
Abstract
Although epoxy-based composites that consist of inorganic fillers and matrixes are widely used in "conventional" electronic packaging applications due to their excellent insulation and robust properties, they limit their uses in "advanced electronic packaging" which requires enhanced thermal conductivity. However, conventional thermal curing methods for fabrication of epoxy-based composites do not fulfill sufficient thermal conductivity. Herein, we apply photo-induced curing strategy for fabricating alumina-incorporated epoxy-siloxane composites that consist of sol-gel derived siloxane matrix and bimodal sized alumina particles as a thermally conductive filler. We investigate how curing mechanism (thermal- or UV-curing) and varying the ratios of the alumina particles of two different sizes affect the various physical properties. It is found that photo-curing process makes greatly enhanced thermal conductivity, low thermal expansion, and high mechanical robustness compared to thermally-cured composites. As the results, we can achieve significantly enhanced thermal conductivity (>11 W/m K) with high thermal stability and mechanical robustness.
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Affiliation(s)
- Chan Soo Kim
- Insulation Materials Research Center, Electrical Materials Research Division, Korea Electrotechnology Research Institute (KERI), Changwon-si, 51543, Republic of Korea
- School of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea
| | - Junho Jang
- Insulation Materials Research Center, Electrical Materials Research Division, Korea Electrotechnology Research Institute (KERI), Changwon-si, 51543, Republic of Korea
| | - Hyeon-Gyun Im
- Insulation Materials Research Center, Electrical Materials Research Division, Korea Electrotechnology Research Institute (KERI), Changwon-si, 51543, Republic of Korea
| | - Seogyoung Yoon
- School of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea
| | - Dong Jun Kang
- Insulation Materials Research Center, Electrical Materials Research Division, Korea Electrotechnology Research Institute (KERI), Changwon-si, 51543, Republic of Korea
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Khan J, Mariatti M, Zubir SA, Rusli A, Manaf AA, Khirotdin RK. Eco-friendly alkali lignin-assisted water-based graphene oxide ink and its application as a resistive temperature sensor. NANOTECHNOLOGY 2023; 35:055301. [PMID: 37879329 DOI: 10.1088/1361-6528/ad06d4] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/09/2023] [Accepted: 10/25/2023] [Indexed: 10/27/2023]
Abstract
Inkjet-printable ink formulated with graphene oxide (GO) offers several advantages, including aqueous dispersion, low cost, and environmentally friendly production. However, water-based GO ink encounters challenges such as high surface tension, low wetting properties, and reduced ink stability over prolonged storage time. Alkali lignin, a natural surfactant, is promising in improving GO ink's stability, wettability, and printing characteristics. The concentration of surfactant additives is a key factor in fine-tuning GO ink's stability and printing properties. The current study aims to explore the detailed effects of alkali lignin concentration and optimize the overall properties of graphene oxide (GO) ink for drop-on-demand thermal inkjet printing. A meander-shaped temperature sensor electrode was printed using the optimized GO ink to demonstrate its practical applicability for commercial purposes. The sensing properties are evaluated using a simple experimental setup across a range of temperatures. The findings demonstrate a significant increase in zeta potential by 25% and maximum absorption by 84.3%, indicating enhanced stability during prolonged storage with an optimized alkali lignin concentration compared to the pure GO dispersions. The temperature sensor exhibits a remarkable thermal coefficient of resistance of 1.21 within the temperature range of 25 °C-52 °C, indicative of excellent sensitivity, response, and recovery time. These results highlight the potential of alkali lignin as a natural surfactant for improving the performance and applicability of inkjet-printable GO inks in various technological applications.
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Affiliation(s)
- Junaid Khan
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal Penang, 14300, Malaysia
| | - M Mariatti
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal Penang, 14300, Malaysia
| | - Syazana A Zubir
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal Penang, 14300, Malaysia
| | - Arjulizan Rusli
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal Penang, 14300, Malaysia
| | - Asrulnizam Abd Manaf
- Collaborative Microelectronic Design Excellence Center, Universiti Sains Malaysia, Pulau Pinang, Malaysia
| | - Rd Khairilhijra Khirotdin
- Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Parit Raja, Batu Pahat, Johor, Malaysia
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Zimmerer C, Simon F, Putzke S, Drechsler A, Janke A, Krause B. N-Type Coating of Single-Walled Carbon Nanotubes by Polydopamine-Mediated Nickel Metallization. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2813. [PMID: 37887963 PMCID: PMC10610227 DOI: 10.3390/nano13202813] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/26/2023] [Revised: 10/17/2023] [Accepted: 10/19/2023] [Indexed: 10/28/2023]
Abstract
Single-walled carbon nanotubes (SWCNTs) have unique thermal and electrical properties. Coating them with a thin metal layer can provide promising materials for many applications. This study presents a bio-inspired, environmentally friendly technique for CNT metallization using polydopamine (PDA) as an adhesion promoter, followed by electroless plating with nickel. To improve the dispersion in the aqueous reaction baths, part of the SWCNTs was oxidized prior to PDA coating. The SWCNTs were studied before and after PDA deposition and metallization by scanning and transmission electron microscopy, scanning force microscopy, and X-ray photoelectron spectroscopy. These methods verified the successful coating and revealed that the distribution of PDA and nickel was significantly improved by the prior oxidation step. Thermoelectric characterization showed that the PDA layer acted as a p-dopant, increasing the Seebeck coefficient S of the SWCNTs. The subsequent metallization decreased S, but no negative S-values were reached. Both coatings affected the volume conductivity and the power factor, too. Thus, electroless metallization of oxidized and PDA-coated SWCNTs is a suitable method to create a homogeneous metal layer and to adjust their conduction type, but more work is necessary to optimize the thermoelectric properties.
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Affiliation(s)
- Cordelia Zimmerer
- Institute of Polymer Materials, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
| | - Frank Simon
- Institute of Physical Chemistry and Polymer Physics, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
| | - Sascha Putzke
- Institute of Polymer Materials, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
| | - Astrid Drechsler
- Institute of Physical Chemistry and Polymer Physics, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
| | - Andreas Janke
- Institute of Polymer Materials, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
| | - Beate Krause
- Institute of Macromolecular Chemistry, Leibniz-Institut für Polymerforschung Dresden e.V. (IPF), Hohe Str. 6, 01069 Dresden, Germany
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Zhang Y, Lin H, Dong K, Tang S, Zhao C. Comparison of the Properties of Epoxy Resins Containing Various Trifluoromethyl Groups with Low Dielectric Constant. Polymers (Basel) 2023; 15:2853. [PMID: 37447498 DOI: 10.3390/polym15132853] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/07/2023] [Revised: 06/26/2023] [Accepted: 06/27/2023] [Indexed: 07/15/2023] Open
Abstract
A series of epoxy resins containing various trifluoromethyl groups were synthesized and thermally cured with diaminodiphenylmethane (DDM) and aminophenyl sulfone (DDS). All epoxy resins exhibited excellent thermal stability with the glass transition temperatures of above 128 °C and 5% weight loss temperatures of above 300 °C. DDS-cured epoxy resins possessed higher thermal stability than that of DDM-cured epoxy resins, while DDM-cured epoxy resins showed better mechanical, dielectric, and hydrophobic properties. Additionally, DDM-cured epoxy resins with different locations and numbers of trifluoromethyl groups showed flexural strength in the range of 95.55~152.36 MPa, flexural modulus in the range of 1.71~2.65 GPa, dielectric constant in the range of 2.55~3.05, and water absorption in the range of 0.49~0.95%. These results indicate that the incorporation of trifluoromethyl pendant groups into epoxy resins can be a valid strategy to improve the dielectric and hydrophobic performance.
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Affiliation(s)
- Yurong Zhang
- Key Laboratory of High Performance Plastics, Ministry of Education, College of Chemistry, Jilin University, Changchun 130012, China
| | - Haidan Lin
- Electric Power Research Institute, State Grid Jilin Electric Power Company, Changchun 130012, China
| | - Kai Dong
- Key Laboratory of High Performance Plastics, Ministry of Education, College of Chemistry, Jilin University, Changchun 130012, China
| | - Shasha Tang
- Key Laboratory of High Performance Plastics, Ministry of Education, College of Chemistry, Jilin University, Changchun 130012, China
| | - Chengji Zhao
- Key Laboratory of High Performance Plastics, Ministry of Education, College of Chemistry, Jilin University, Changchun 130012, China
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Cui X, Liu J, Zhang E, Gong Z, Liang L, Shi J, Hao X, Hu J, Lu M. Synthesis and Properties of a Novel Thermally Conductive Pressure-Sensitive Adhesive with UV-Responsive Peelability. Macromol Rapid Commun 2023; 44:e2200884. [PMID: 36756858 DOI: 10.1002/marc.202200884] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/11/2022] [Revised: 01/30/2023] [Indexed: 02/10/2023]
Abstract
Thermally conductive pressure-sensitive adhesive (PSA) has received a great amount of attention in recent years, but the traditional PSA hardly loses adhesion properties after UV irradiation or heating. Therefore, endowing thermally conductive adhesive with UV-responsive peelability becomes a design strategy. Herein, vinyl-functionalized graphene (AA-GMA-G) is prepared by modifying graphene with acrylic acid and subsequently reacting with glycidyl methacrylate. Then, the UV-curable acrylate copolymer is synthesized by grafting glycidyl methacrylate. Finally, the novel thermally conductivity PSA with UV-responsive peelability is obtained by blending the copolymer with AA-GMA-G and photoinitiator. The results show that the PSA at 2 wt% AA-GMA-G loading exhibits an excellent thermal conductivity (0.74 W m-1 K-1 ) and a relatively strong peel strength, increasing by 15% compared with pristine graphene/PSA. Interestingly, the peel strength of AA-GMA-G/PSA can achieve a dramatic drop after UV treatment, and the decrease rate is 96.7%. Therefore, the novel thermally conductive PSA with UV-responsive peelability has potential applications in certain electronic devices.
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Affiliation(s)
- Xiaohua Cui
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,CASH GCC Fine Chemicals Incubator (Nanxiong) Co., Ltd, Nanxiong, 512400, P. R. China.,CAS Engineering Laboratory for Special Fine Chemicals, Guangzhou, 510650, P. R. China.,CASH GCC Shaoguan Research Institute of Advanced Materials, Nanxiong, 512400, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Jiaming Liu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,CAS Engineering Laboratory for Special Fine Chemicals, Guangzhou, 510650, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Ending Zhang
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,CASH GCC Shaoguan Research Institute of Advanced Materials, Nanxiong, 512400, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Ziyang Gong
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,CASH GCC Shaoguan Research Institute of Advanced Materials, Nanxiong, 512400, P. R. China
| | - Liyan Liang
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Jun Shi
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China.,CASH GCC (Nanxiong) Research Institute of Advanced Materials Co., Ltd, Nanxiong, 512400, P. R. China
| | - Xiaopeng Hao
- Zhejiang Guanhao Functional Material Co., Ltd., Zhejiang, 314200, P. R. China
| | - Jiwen Hu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,CASH GCC Shaoguan Research Institute of Advanced Materials, Nanxiong, 512400, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Mangeng Lu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, P. R. China.,University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
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