Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers

Microwave Modification of an Epoxy Basalt-Filled Oligomer to Improve the Functional Properties of a Composite Based on It

The purpose of this work is to study the influence of the electric field strength of an electromagnetic wave with the maximum modifying effect on an epoxy basalt-filled oligomer, which is of great scientific and practical importance for the development of microwave oligomer modification technology. The optimal modes of microwave modification, under which the highest values of the mechanical properties of an epoxy basalt-filled polymer composite material are obtained, are identified: power of 400 W and an exposure time of 24 s. At the same time, the breaking stress in bending increases by 20%, the impact strength increases by 2 times, and hardness increases by 31%. A slight increase of 4.5% in heat resistance is noted compared to the composite obtained on the basis of an oligomer unmodified in the microwave electromagnetic field. The results of resistance to various aggressive environments are obtained, which show that the studied physical and mechanical characteristics of the epoxy basalt-filled material after exposure to an aggressive environment decrease by less than 14%, which corresponds to their good resistance to an aggressive environment. It is established that the effect of the microwave electromagnetic field on an epoxy basalt-filled oligomer is an effective modification method that improves physical and mechanical characteristics with a high level of temporal stability to climatic influences, with a coefficient of property retention of more than 90%.

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

Preparation and Properties of Epoxy Composites with Multi-Scale BN Sheets

Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in power electronics field. The intrinsic properties of epoxy can be improved by the introduction of inorganic filler, thus fabricating a composite material. In this paper, different scales of modified boron nitride (BN, 1 μm, 10 μm) were used to improve the thermal conductivity of epoxy resin. The surfaces BN were modification by a silane coupling agent to improve the compatibility between BN and epoxy resin. The effects of micro-and nano-BN sheets on the microstructure, breakdown strength, thermal and mechanical properties of epoxy resin composite were studied. The characterization of its morphology by scanning electron microscopy shows that nano-BN distribution is in the middle of micro-BN, forming a better bridging effect. The data of the breakdown strength and thermal conductivity indicated that when the content of micro-BN is 30 wt% and nano-BN is 20 wt%, the thermal conductivity of BN/epoxy composite was 1.52 W/m·K. In addition, the breakdown strength is 77.1 kV/mm. Thus, this type of BN-filled BN/EP composites with remarkable insulation and thermal conductivity properties would have potential for power engineering materials.

Significantly enhanced thermally conductive epoxy composite composed of caterpillar-like structured expanded graphite/ boron nitride nanotubes

The trend toward miniaturization, integration and multifunctionality of modern electronics has led to a rapid increase in power density, which makes heat dissipation a critical issue. Despite the great potential of graphite-related nanocomposites in dissipating excess heat to ensure high efficiency and long lifetime of electronic devices, the practical application of these composites is limited by the ultra-low vertical thermal conductivity due to the interfacial thermal resistance between graphite layers. Here, a caterpillar-like hybrid filler was fabricated by the in situ intercalation of boron nitride nanotubes (BNNTs) between expanded graphite (EG) layers based on chemical vapor deposition technology. Owing to the optimized interfacial thermal resistance by forming covalent C-N bonding at the interface of EG and BNNT, the through-plane thermal conductivity of epoxy-based nanocomposites can be up to 5.18 Wm−1 K−1. In addition, the composite possessed electromagnetic interference shielding performance of 33.34 dB while maintaining electrical insulation due to the hierarchical structure. This work provided a new strategy for fabricating polymer-based composites with excellent through-plane thermal conductivity in thermal management applications.