Self-Healing Polymeric Materials and Composites for Additive Manufacturing

External Stimuli-Induced Welding of Dynamic Cross-Linked Polymer Networks

Thermosets have been crucial in modern engineering for decades, finding applications in various industries. Welding cross-linked components are essential in the processing of thermosets for repairing damaged areas or fabricating complex structures. However, the inherent insolubility and infusibility of thermoset materials, attributed to their three-dimensional network structure, pose challenges to welding development. Incorporating dynamic chemical bonds into highly cross-linked networks bridges the gap between thermosets and thermoplastics presenting a promising avenue for innovative welding techniques. External stimuli, including thermal, light, solvent, pH, electric, and magnetic fields, induce dynamic bonds' breakage and reformation, rendering the cross-linked network malleable. This plasticity facilitates the seamless linkage of two parts to an integral whole, attracting significant attention for potential applications in soft actuators, smart devices, solid batteries, and more. This review provides a comprehensive overview of dynamic bonds employed in welding dynamic cross-linked networks (DCNs). It extensively discusses the classification and fabrication of common epoxy DCNs and acrylate DCNs. Notably, recent advancements in welding processes based on DCNs under external stimuli are detailed, focusing on the welding dynamics among covalent adaptable networks (CANs).

Electrically Conductive Polymers for Additive Manufacturing

The use of electrically conductive polymers (CPs) in the development of electronic devices has attracted significant interest due to their unique intrinsic properties, which result from the synergistic combination of physicochemical properties in conventional polymers with the electronic properties of metals or semiconductors. Most conventional methods adopted for the fabrication of devices with nonplanar morphologies are still challenged by the poor ionic/electronic mobility of end products. Additive manufacturing (AM) brings about exciting prospects to the realm of CPs by enabling greater design freedom, more elaborate structures, quicker prototyping, relatively low cost, and more environmentally friendly electronic device creation. A growing variety of AM technologies are becoming available for three-dimensional (3D) printing of conductive devices, i.e., vat photopolymerization (VP), material extrusion (ME), powder bed fusion (PBF), material jetting (MJ), and lamination object manufacturing (LOM). In this review, we provide an overview of the recent research progress in the area of CPs developed for AM, which advances the design and development of future electronic devices. We consider different AM techniques, vis-à-vis, their development progress and respective challenges in printing CPs. We also discuss the material requirements and notable advances in 3D printing of CPs, as well as their potential electronic applications including wearable electronics, sensors, energy storage and conversion devices, etc. This review concludes with an outlook on AM of CPs.