Synthesis of Silicon Hybrid Phenolic Resins with High Si-Content and Nanoscale Phase Separation Structure

Improved Performances of SiBCN Powders Modified Phenolic Resins-Carbon Fiber Composites

The effect of SiBCN powder on properties of phenolic resins and composites was analyzed. Compared with phenolic resins, the thermal stability of SiBCN powder modified phenolic resins (the SiBCN phenolic resins) by characterization of thermogravimetric analysis (TGA) improved clearly. It was found by X-ray photoelectron spectroscopy (XPS) that reactions between SiBCN powder and the pyrolysis product of phenolic resins were the main factor of the increased residual weight. TGA and static ablation of a muffle furnace were used to illustrate the roles of SiBCN powder on increasing oxidation resistance of SiBCN powder-modified phenolic resin–carbon fiber composites (SiBCN–phenolic/C composites), and the oxidative product was analyzed by X-ray diffraction (XRD), scanning electron microscopy (SEM) and Fourier transform infrared spectroscopy (FTIR). For SiBCN–phenolic/C composites, the occurrence of oxidation reaction and the formation of protective crust contributed to improving oxidative resistance. The result of the oxygen-acetylene test showed that the linear ablation rate (LAR) and mass ablation rate (MAR) of phenolic resin–carbon fiber composites reduced from 0.052 ± 0.005 mm/s to 0.038 ± 0.004 mm/s and from 0.050 ± 0.004 g/s to 0.043 ± 0.001 g/s by introducing SiBCN powder, respectively. The mechanism of ablation resistance after the introduction of SiBCN powder was investigated. The high melt-viscosity of SiBCN powder caused SiBCN powder to remain on the surface of composites and protect the internal resins and carbon fibers. The oxidation of SiBCN powder and volatilization of oxide can consume energy and oxygen, thus the ablation resistance of SiBCN–Ph composite was improved.

Synthesis and Thermal Degradation Study of Polyhedral Oligomeric Silsesquioxane (POSS) Modified Phenolic Resin

In this paper, a new polyhedral oligomeric silsesquioxane containing a phenol group (POSS-Phenol) is prepared through the Michael addition reaction, which is added to the synthesis of phenolic resin as a functional monomer. Infrared spectroscopy (IR) is used to demonstrate the chemistry structure of the synthesized POSS modified phenolic resin. After introducing POSS into the resole, a comprehensive study is conducted to reveal the effects of POSS on the thermal degradation of phenolic resin. First, thermal degradation behaviors of neat phenolic resin and modified phenolic resin are carried out by thermogravimetric analysis (TGA). Then, the gas volatiles from thermal degradation are investigated by thermogravimetric mass spectrometry (TG-MS). Finally, the residues after thermal degradation are characterized by X-ray diffraction (XRD). The research indicates that POSS modified phenolic resin shows a better thermal stability than neat phenolic resin, especially at high temperatures under air atmosphere. On the one hand, the introduction of the POSS group can effectively improve the release temperature of oxygen containing volatiles. On the other hand, the POSS group forms silica at high temperatures under air, which can effectively inhibit the thermal oxidation of phenolic resin and make phenolic resin show a better high-temperature oxidation resistance.