A Review of Data Mining Applications in Semiconductor Manufacturing

Predictive Maintenance of Pins in the ECD Equipment for Cu Deposition in the Semiconductor Industry

Nowadays, Predictive Maintenance is a mandatory tool to reduce the cost of production in the semiconductor industry. This paper considers as a case study a critical part of the electrochemical deposition system, namely, the four Pins that hold a wafer inside a chamber. The aim of the study is to replace the schedule of replacement of Pins presently based on fixed timing (Preventive Maintenance) with a Hardware/Software system that monitors the conditions of the Pins and signals possible conditions of failure (Predictive Maintenance). The system is composed of optical sensors endowed with an image processing methodology. The prototype built for this study includes one optical camera that simultaneously takes images of the four Pins on a roughly daily basis. Image processing includes a pre-processing phase where images taken by the camera at different times are coregistered and equalized to reduce variations in time due to movements of the system and to different lighting conditions. Then, some indicators are introduced based on statistical arguments that detect outlier conditions of each Pin. Such indicators are pixel-wise to identify small artifacts. Finally, criteria are indicated to distinguish artifacts due to normal operations in the chamber from issues prone to a failure of the Pin. An application (PINapp) with a user friendly interface has been developed that guides industry experts in monitoring the system and alerting in case of potential issues. The system has been validated on a plant at STMicroelctronics in Catania (Italy). The study allowed for understanding the mechanism that gives rise to the rupture of the Pins and to increase the time of replacement of the Pins by a factor at least 2, thus reducing downtime.

Assembly Line Overall Equipment Effectiveness (OEE) Prediction from Human Estimation to Supervised Machine Learning

Nowadays, in the domain of production logistics, one of the most complex planning processes is the accurate forecasting of production and assembly efficiency. In industrial companies, Overall Equipment Effectiveness (OEE) is one of the most common used efficiency measures at semi-automatic assembly lines. Proper estimation supports the right use of resources and more accurate and cost-effective delivery to the customers. This paper presents the prediction of OEE by comparing human prediction with one of the techniques of supervised machine learning through a real-life example. In addition to descriptive statistics, takt time-based decision trees are applied and the target-oriented OEE prediction model is presented. This concept takes into account recent data and assembly line targets with different weights. Using the model, the value of OEE can be predicted with an accuracy of within 1% on a weekly basis, four weeks in advance.

Non-Polar Gallium Nitride for Photodetection Applications: A Systematic Review

Ultraviolet photodetectors have been widely utilized in several applications, such as advanced communication, ozone sensing, air purification, flame detection, etc. Gallium nitride and its compound semiconductors have been promising candidates in photodetection applications. Unlike polar gallium nitride-based optoelectronics, non-polar gallium nitride-based optoelectronics have gained huge attention due to the piezoelectric and spontaneous polarization effect–induced quantum confined-stark effect being eliminated. In turn, non-polar gallium nitride-based photodetectors portray higher efficiency and faster response compared to the polar growth direction. To date, however, a systematic literature review of non-polar gallium nitride-based photodetectors has yet to be demonstrated. Hence, the objective of this systematic literature review is to critically analyze the data related to non-polar gallium nitride-based photodetectors. Based on the pool of literature, three categories are introduced, namely, growth and fabrication, electrical properties, and structural, morphological, and optical properties. In addition, bibliometric analysis, a precise open-source tool, was used to conduct a comprehensive science mapping analysis of non-polar gallium nitride-based photodetectors. Finally, challenges, motivations, and future opportunities of non-polar gallium nitride-based photodetectors are presented. The future opportunities of non-polar GaN-based photodetectors in terms of growth conditions, fabrication, and characterization are also presented. This systematic literature review can provide initial reading material for researchers and industries working on non-polar gallium nitride-based photodetectors.

Mapping Oxidation and Wafer Cleaning to Device Characteristics Using Physics-Assisted Machine Learning

It is always highly desired to have a well-defined relationship between the chemistry in semiconductor processing and the device characteristics. With the shrinkage of technology nodes in the semiconductors roadmap, it becomes more complicated to understand the relation between the device electrical characteristics and the process parameters such as oxidation and wafer cleaning procedures. In this work, we use a novel machine learning approach, i.e., physics-assisted multitask and transfer learning, to construct a relationship between the process conditions and the device capacitance voltage curves. While conventional semiconductor processes and device modeling are based on a physical model, recently, the machine learning-based approach or hybrid approaches have drawn significant attention. In general, a huge amount of data is required to train a machine learning model. Since producing data in the semiconductor industry is not an easy task, physics-assisted artificial intelligence has become an obvious choice to resolve these issues. The predicted C-V uses the hybridization of physics, and machine learning provides improvement while the coefficient of determination (R ²) is 0.9442 for semisupervised multitask learning (SS-MTL) and 0.9253 for transfer learning (TL), referenced to 0.6108 in the pure machine learning model using multilayer perceptrons. The machine learning architecture used in this work is capable of handling data sparsity and promotes the usage of advanced algorithms to model the relationship between complex chemical reactions in semiconductor manufacturing and actual device characteristics. The code is available at https://github.com/albertlin11/moscapssmtl.

Special Issue “Advanced Process Monitoring for Industry 4.0”

Industry 4 [...]

Artificial Immune System for Fault Detection and Classification of Semiconductor Equipment

Semiconductor manufacturing comprises hundreds of consecutive unit processes. A single misprocess could jeopardize the whole manufacturing process. In current manufacturing environments, data monitoring of equipment condition, wafer metrology, and inspection, etc., are used to probe any anomaly during the manufacturing process that could affect the final chip performance and quality. The purpose of investigation is fault detection and classification (FDC). Various methods, such as statistical or data mining methods with machine learning algorithms, have been employed for FDC. In this paper, we propose an artificial immune system (AIS), which is a biologically inspired computing algorithm, for FDC regarding semiconductor equipment. Process shifts caused by parts and modules aging over time are main processes of failure cause. We employ state variable identification (SVID) data, which contain current equipment operating condition, and optical emission spectroscopy (OES) data, which represent plasma process information obtained from faulty process scenario with intentional modification of the gas flow rate in a semiconductor fabrication process. We achieved a modeling prediction accuracy of modeling of 94.69% with selected SVID and OES and an accuracy of 93.68% with OES data alone. To conclude, the possibility of using an AIS in the field of semiconductor process decision making is proposed.

Predictive Process Adjustment by Detecting System Status of Vacuum Gripper in Real Time during Pick-Up Operations

In manufacturing systems, pick-up operations by vacuum grippers may fail owing to manufacturing errors in an object’s surface that are within the allowable tolerance limits. In such situations, manual interference is required to resume system operation, which results in considerable loss of time as well as economic losses. Although vacuum grippers have many advantages and are widely used in the industry, it is highly difficult to directly monitor the current machine status and provide appropriate recovery feedback for stable operation. Therefore, this paper proposes a method to detect the success or failure of a suction operation in advance by analyzing the amount of outlet air pressure in the Venturi line. This was achieved by installing an air pressure sensor on the Venturi line to predict whether the current suction action will be successful. Through empirical experiments, it was found that downward movements in the z-axis of the vacuum gripper can easily rectify a faulty gripper suction operation. Real-time monitoring results verified that predictive process adjustment of the pick-up operation can be performed by modifying the z-position of the vacuum gripper.