A Flexible Integrated Bending Strain and Pressure Sensor System for Motion Monitoring

Self-Powered Acceleration Sensor for Distance Prediction via Triboelectrification

Accurately predicting the distance an object will travel to its destination is very important in various sports. Acceleration sensors as a means of real-time monitoring are gaining increasing attention in sports. Due to the low energy output and power density of Triboelectric Nanogenerators (TENGs), recent efforts have focused on developing various acceleration sensors. However, these sensors suffer from significant drawbacks, including large size, high complexity, high power input requirements, and high cost. Here, we described a portable and cost-effective real-time refreshable strategy design comprising a series of individually addressable and controllable units based on TENGs embedded in a flexible substrate. This results in a highly sensitive, low-cost, and self-powered acceleration sensor. Putting, which accounts for nearly half of all strokes played, is obviously an important component of the golf game. The developed acceleration sensor has an accuracy controlled within 5%. The initial velocity and acceleration of the forward movement of a rolling golf ball after it is hit by a putter can be displayed, and the stopping distance is quickly calculated and predicted in about 7 s. This research demonstrates the application of the portable TENG-based acceleration sensor while paving the way for designing portable, cost-effective, scalable, and harmless ubiquitous self-powered acceleration sensors.

A Soft Inductive Bimodal Sensor for Proprioception and Tactile Sensing of Soft Machines

The somatosensory system is crucial for living beings to survive and thrive in complex environments and to interact with their surroundings. Similarly, rapidly developed soft robots need to be aware of their own posture and detect external stimuli. Bending and force sensing are key for soft machines to achieve embodied intelligence. Here, we present a soft inductive bimodal sensor (SIBS) that uses the strain modulation of magnetic permeability and the eddy-current effect for simultaneous bidirectional bending and force sensing with only two wires. The SIBS is made of a flexible planar coil, a porous ferrite film, and a soft conductive film. By measuring the inductance at two different frequencies, the bending angle and force can be obtained and decoupled. Rigorous experiments revealed that the SIBS can achieve high resolution (0.44° bending and 1.09 mN force), rapid response, excellent repeatability, and high durability. A soft crawling robot embedded with one SIBS can sense its own shape and interact with and respond to external stimuli. Moreover, the SIBS is demonstrated as a wearable human-machine interaction to control a crawling robot via wrist bending and touching. This highlights that the SIBS can be readily implemented in diverse applications for reliable bimodal sensing.

Micro-/Nano-Structured Biodegradable Pressure Sensors for Biomedical Applications

The interest in biodegradable pressure sensors in the biomedical field is growing because of their temporary existence in wearable and implantable applications without any biocompatibility issues. In contrast to the limited sensing performance and biocompatibility of initially developed biodegradable pressure sensors, device performances and functionalities have drastically improved owing to the recent developments in micro-/nano-technologies including device structures and materials. Thus, there is greater possibility of their use in diagnosis and healthcare applications. This review article summarizes the recent advances in micro-/nano-structured biodegradable pressure sensor devices. In particular, we focus on the considerable improvement in performance and functionality at the device-level that has been achieved by adapting the geometrical design parameters in the micro- and nano-meter range. First, the material choices and sensing mechanisms available for fabricating micro-/nano-structured biodegradable pressure sensor devices are discussed. Then, this is followed by a historical development in the biodegradable pressure sensors. In particular, we highlight not only the fabrication methods and performances of the sensor device, but also their biocompatibility. Finally, we intoduce the recent examples of the micro/nano-structured biodegradable pressure sensor for biomedical applications.

The Progress of Research into Flexible Sensors in the Field of Smart Wearables

In modern society, technology associated with smart sensors made from flexible materials is rapidly evolving. As a core component in the field of wearable smart devices (or 'smart wearables'), flexible sensors have the advantages of excellent flexibility, ductility, free folding properties, and more. When choosing materials for the development of sensors, reduced weight, elasticity, and wearer's convenience are considered as advantages, and are suitable for electronic skin, monitoring of health-related issues, biomedicine, human-computer interactions, and other fields of biotechnology. The idea behind wearable sensory devices is to enable their easy integration into everyday life. This review discusses the concepts of sensory mechanism, detected object, and contact form of flexible sensors, and expounds the preparation materials and their applicability. This is with the purpose of providing a reference for the further development of flexible sensors suitable for wearable devices.

Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays

Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors.