Alternative Materials for Printed Circuit Board Production: An Environmental Perspective

A Green Conformable Thermoformed Printed Circuit Board Sourced from Renewable Materials

Printed circuit boards (PCBs) physically support and connect electronic components to the implementation of complex circuits. The most widespread insulating substrate that also acts as a mechanical support in PCBs is commercially known as FR4, and it is a glass-fiber-reinforced epoxy resin laminate. FR4 has exceptional dielectric, mechanical, and thermal properties. However, it was designed without considering sustainability and end-of-life aspects, heavily contributing to the accumulation of electronic waste in the environment. Thus, greener alternatives that can be reprocessed, reused, biodegraded, or composted at the end of their function are needed. This work presents the development and characterization of a PCB substrate based on poly(lactic acid) and cotton fabric, a compostable alternative to the conventional FR4. The substrate has been developed by compression molding, a process compatible with the polymer industry. We demonstrate that conductive silver ink can be additively printed on the substrate's surface, as its morphology and wettability are similar to those of FR4. For example, the compostable PCB's water contact angle is 72°, close to FR4's contact angle of 64°. The developed substrate can be thermoformed to curved surfaces at low temperatures while preserving the conductivity of the silver tracks. The green substrate has a dielectric constant comparable to that of the standard FR4, showing a value of 5.6 and 4.6 at 10 and 100 kHz, respectively, which is close to the constant value of 4.6 of FR4. The substrate is suitable for microdrilling, a fundamental process for integrating electronic components to the PCB. We implemented a proof-of-principle circuit to control the blinking of LEDs on top of the PCB, comprising resistors, capacitors, LEDs, and a dual in-line package circuit timer. The developed PCB substrate represents a sustainable alternative to standard FR4 and could contribute to the reduction of the overwhelming load of electronic waste in landfills.

Integrated Papertronic Techniques: Highly Customizable Resistor, Supercapacitor, and Transistor Circuitry on a Single Sheet of Paper

Humanity's excessive production of material waste poses a critical environmental threat, and the problem is only escalating, especially in the past few decades with the rapid development of powerful electronic tools and persistent consumer desire to upgrade to the newest available technology. The poor disposability of electronics is especially an issue for the newly arising field of single-use devices and sensors, which are often used to evaluate human health and monitor environmental conditions, and for other novel applications. Though impressive in terms of function and convenience, usage of conventional electronic components in these applications would inflict an immense surge in waste and result in higher costs. This work's primary objective is to develop a cost-effective, eco-friendly, all-paper, device for single-use applications that can be easily and safely disposed of through incineration or biodegradation. All electronic components are paper-based and integrated on paper-based printed circuit boards (PCBs), innovatively providing a realistic and practical solution for green electronic platforms. In particular, a methodology is discussed for simultaneously achieving very tunable resistors (20 Ω to 285 kΩ), supercapacitors (∼3.29 mF), and electrolyte-gated field-effect transistors on and within the thickness of a single sheet of paper. Each electronic component is completely integrated into functionalized paper regions and exhibits favorable electrical activity, adjustability, flexibility, and disposability. A simple amplifier circuit is successfully demonstrated within a small area and within the thickness of a single sheet of paper, displaying component versatility and the capability for their fabrication processes to be performed in parallel for efficient and rapid development.

Potential of Commercial Wood-Based Materials as PCB Substrate

In our research on sustainable solutions for printed electronics, we are moving towards renewable materials in applications, which can be very challenging from the performance perspective, such as printed circuit boards (PCB). In this article, we examine the potential suitability of wood-based materials, such as cardboard and veneer, as substrate materials for biodegradable solutions instead of the commonly used glass-fiber reinforced epoxy. Our substrate materials were coated with fire retardant materials for improved fire resistance and screen printed with conductive silver ink. The print quality, electrical conductivity, fire performance and biodegradation were evaluated. It was concluded that if the PCB application allows manufacturing using screen printing instead of an etching process, there is the potential for these materials to act as substrates in, e.g., environmental analytics applications.

Implementation of Circular Economy Strategies within the Electronics Sector: Insights from Finnish Companies

There is an increasing call for products following circular economy principles. Despite growing pressure, understanding of the current situation and development vectors is largely missing. In this study, circular economy workshops were arranged for six industrial companies manufacturing electronics and operating in Finland to obtain an empirical understanding of the current state of circular economy implementation. During the workshops, each company assessed the state of the circular economy for a chosen product using a set of 51 circular economy strategies, i.e., the circularity deck. The results indicated that circular economy principles were implemented in only 25% of the cases. This is mostly related to the production of smaller, thinner, and lighter products. The results also indicate a large improvement potential of 36% for the participating companies. This is the share of cases that are planned for implementation. Those strategies mostly relate to the use of recycled inputs, the development of products made of a single material, and the design of products suitable for primary recycling. The least relevant or even irrelevant strategies were those related to the use of information technologies and artificial intelligence, despite electronic products being the enablers of such strategies for the other companies. Therefore, to further increase the circularity of electronic products and to meet the demands and interests of the manufacturing industry, research work on the technologies and services enabling the use of waste as raw materials should be emphasized to close the loops. Finally, the results imply the necessity for a more widespread assessment of circular economy strategies among companies, with consequent development of action plans for their implementation.