Stretchable, Rehealable, Recyclable, and Reconfigurable Integrated Strain Sensor for Joint Motion and Respiration Monitoring

Rational Design of Flexible Mechanical Force Sensors for Healthcare and Diagnosis

Over the past decade, there has been a significant surge in interest in flexible mechanical force sensing devices and systems. Tremendous efforts have been devoted to the development of flexible mechanical force sensors for daily healthcare and medical diagnosis, driven by the increasing demand for wearable/portable devices in long-term healthcare and precision medicine. In this review, we summarize recent advances in diverse categories of flexible mechanical force sensors, covering piezoresistive, capacitive, piezoelectric, triboelectric, magnetoelastic, and other force sensors. This review focuses on their working principles, design strategies and applications in healthcare and diagnosis, with an emphasis on the interplay among the sensor architecture, performance, and application scenario. Finally, we provide perspectives on the remaining challenges and opportunities in this field, with particular discussions on problem-driven force sensor designs, as well as developments of novel sensor architectures and intelligent mechanical force sensing systems.

Enabling High-Performance Pressure and Proximity Dual-Mode Sensing with EGaIn/Ag/ZnO Egg-Shell Ternary Composite Particles

Eutectic gallium-indium alloy (EGaIn) is a biocompatible liquid metal, promising for wearable electronics. Through functionalization and formation of composites, EGaIn-based materials have shown potential in multifunctional sensing devices. Here, egg-shell EGaIn/Ag/ZnO ternary composite particles were prepared through an ultrasound-assisted displacement reaction combined with room-temperature hydrolysis. The composite was further constructed as a wearable sensor capable of both pressure and proximity detection. For pressure sensing, due to the decrease in the Young's modulus of the egg-shell structure and the presence of the electrical double layers between Ag and ZnO, which enriched surface charges, the sensor showed excellent sensitivity at low pressures (2.17 KPa-1, <0.4 KPa) and thus the ability to sense body movements. For proximity sensing, the composite sensor was able to detect approaching objects that were up to 20 cm away. By combining and fitting the sensing curves for both the touchless and touching modes, the extracted parameters were used to create fingerprints for different objects, demonstrating the great potential of our sensor in the differentiation and identification of unknown objects for future robotics and artificial intelligence.

Highly Sensitive, Stretchable, and Robust Strain Sensor Based on Crack Propagation and Opening

Soft and stretchable strain sensors have been attracting significant attention. However, the trade-off between the sensitivity (gauge factor) and the sensing range has been a major challenge. In this work, we report a soft stretchable resistive strain sensor with an unusual combination of high sensitivity, large sensing range, and high robustness. The sensor is made of a silver nanowire network embedded below the surface of an elastomeric matrix (e.g., poly(dimethylsiloxane)). Periodic mechanical cuts are applied to the top surface of the sensor, changing the current flow from uniformly across the sensor to along the conducting path defined by the open cracks. Both experiment and finite element analysis are conducted to study the effect of the slit depth, slit length, and pitch between the slits. The stretchable strain sensor can be integrated into wearable systems for monitoring physiological functions and body motions associated with different levels of strain, such as blood pressure and lower back health. Finally, a soft three-dimensional (3D) touch sensor that tracks both normal and shear stresses is developed for human-machine interfaces and tactile sensing for robotics.

Recent Advances in Multifunctional Wearable Sensors and Systems: Design, Fabrication, and Applications

Multifunctional wearable sensors and systems are of growing interest over the past decades because of real-time health monitoring and disease diagnosis capability. Owing to the tremendous efforts of scientists, wearable sensors and systems with attractive advantages such as flexibility, comfort, and long-term stability have been developed, which are widely used in temperature monitoring, pulse wave detection, gait pattern analysis, etc. Due to the complexity of human physiological signals, it is necessary to measure multiple physiological information simultaneously to evaluate human health comprehensively. This review summarizes the recent advances in multifunctional wearable sensors, including single sensors with various functions, planar integrated sensors, three-dimensional assembled sensors, and stacked integrated sensors. The design strategy, manufacturing method, and potential application of each type of sensor are discussed. Finally, we offer an outlook on future developments and provide perspectives on the remaining challenges and opportunities of wearable multifunctional sensing technology.

Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays

Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors.

CNT/Graphite/SBS Conductive Fibers for Strain Sensing in Wearable Telerehabilitation Devices

Rapid growth of personal electronics with concurrent research into telerehabilitation solutions discovers opportunities to redefine the future of orthopedic rehabilitation. After joint injury or operation, convalescence includes free active range of movement exercises, such as joints bending and straightening under medical supervision. Flexion detection through wearable textile sensors provides numerous potential benefits such as: (1) reduced cost; (2) continuous monitoring; (3) remote telerehabilitation; (4) gamification; and (5) detection of risk-inducing activities in daily routine. To address this issue, novel piezoresistive multi-walled carbon nanotubes/graphite/styrene–butadiene–styrene copolymer (CNT/Gr/SBS) fiber was developed. The extrusion process allowed adjustable diameter fiber production, while being a scalable, industrially adapted method of manufacturing textile electronics. Composite fibers were highly stretchable, withstanding strains up to 285%, and exhibited exceptional piezoresistive parameters with a gauge factor of 91.64 for 0–100% strain range and 2955 for the full scope. Considering the composite’s flexibility and sensitivity during a series of cyclic loading, it was concluded that developed Gr/CNT/SBS fibers were suitable for application in wearable piezoresistive sensors for telerehabilitation application.

Thermoresponsive Lignin-Reinforced Poly(Ionic Liquid) Hydrogel Wireless Strain Sensor

To meet critical requirements on flexible electronic devices, multifunctionalized flexible sensors with excellent electromechanical performance and temperature perception are required. Herein, lignin-reinforced thermoresponsive poly(ionic liquid) hydrogel is prepared through an ultrasound-assisted synthesized method. Benefitting from the electrostatic interaction between lignin and ionic liquid, the hydrogel displays high stretchability (over 1425%), excellent toughness (over 132 kPa), and impressive stress loading-unloading cyclic stability. The hydrogel strain sensor presents excellent electromechanical performance with a high gauge factor (1.37) and rapid response rate (198 ms), which lays the foundation for human body movement detection and smart input. Moreover, owing to the thermal-sensitive feature of poly(ionic liquid), the as-prepared hydrogel displays remarkable thermal response sensitivity (0.217°C⁻¹) in body temperature range and low limit of detection, which can be applied as a body shell temperature indicator. Particularly, the hydrogel can detect dual stimuli of strain and temperature and identify each signal individually, showing the specific application in human-machine interaction and artificial intelligence. By integrating the hydrogel strain sensor into a wireless sensation system, remote motion capture and gesture identification is realized in real-time.

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.