Micro-tensile bond strength of different adhesive systems on sound dentin and resin-based composite: An in-vitro study

Influence of diode laser irradiation on microtensile bond strength of etch-and-rinse adhesive to dentin using two different etchants: An in vitro study

Aim

The aim of this study was to evaluate the influence of 970 nm diode laser (DL) irradiation on the microtensile bond strength (µTBS) of etch-and-rinse adhesive (ERA) to dentin using phosphoric acid (PA) or alpha-hydroxy glycolic acid (GA) as etchants.

Materials and Methods

A total of 32 human third molars were selected and assigned randomly among two different groups and four subgroups based on etching protocols and DL irradiation: PA, PA-DL, GA, and GA-DL. After tooth preparation and subsequent incremental composite build-up, the samples were stored in distilled water for 24 h at 37°C. µTBS values were obtained using the universal testing machine. The failure modes observed in dentin were categorized as adhesive, cohesive within dentin/resin, or mixed.

Statistical Analysis

The data were analyzed using one-way analysis of variance, followed by Tukey's post hoc test (P ≤ 0.001).

Results

GA showed better or similar bond strength values to PA. Furthermore, irradiation of DL increased the µTBS to dentin when both PA or GA are used as etchants.

Conclusion

GA can be used as an alternative etchant to PA. DL irradiation stands as a promising approach for elevating the performance of ERA adhesive systems to dentin.

Effect of matrix metalloproteinase inhibitors on microtensile bond strength of dental composite restorations to dentin in use of an etch-and-rinse adhesive system

Aim

This study assesses the effect of matrix metalloproteinases on microtensile bond strength (μTBS) of an etch‐and‐rinse adhesive system.

Methods

This in vitro study evaluated 88 extracted premolars. The teeth were sectioned to expose dentin and were then randomly divided into four groups (n = 22). In group 1 (control), dentin surface was etched, and Adper Single Bond 2 was applied. In groups 2–4, dentin surface was etched and chlorhexidine (CHX), 1‐ethyl‐3‐(3‐dimethylaminopropyl) carbodiimide (EDC), and dimethyl sulfoxide (DMSO) were applied on the surfaces, respectively, and blotted dry. Next, Adper Single Bond 2 was applied and all teeth were built up with Z350 composite. In each group, half the samples immediately and the other half after 10,000 thermal cycles underwent μTBS test. Data were analyzed using ANOVA and Tukey's test (α = .05).

Results

In thermocycled samples, maximum μTBS was noted in CHX group followed by DMSO, EDC, and control group (p < .001). The thermocycled μTBS of composite to dentin was significantly higher in CHX group compared with EDC, DMSO, and control groups (p < .001) but was not significantly different in EDC and DMSO groups (p = .498).

Conclusion

The thermocycled μTBS obtained by the application of CHX, EDC, and DMSO was significantly higher compared with the value to the control group.

Assessment of Bonding Effectiveness of Adhesive Materials to Tooth Structure using Bond Strength Test Methods: A Review of Literature

Background

The rapid developments in the field of adhesive dental materials have led to improvements in many aspects of clinical dentistry. Adhesive bond strength plays an important role in determining the clinical performance and longevity of dental restorations. Nevertheless, bond strength tests have never been well-standardized, although a number of important recommendations have been made.

Objective

The aim of this paper is to critically review the validity of different bond strength testing methods for assessment of bonding effectiveness of adhesive materials to tooth structure and discuss factors that may affect bond strength measurement.

Data Collection

Relevant literature published between 1983 and 2018 was collected and reviewed from the PubMed database and Google scholar resources.

Review Results

Results of the current bond testing methods should be used to compare materials tested under the same laboratory settings, but they shouldn't be used to make direct inferences on their clinical behaviour. Shear and micro-shear tests, result in non-uniform stress distribution, stress concentration at the substrate area, and predominantly tensile stresses rather than shear stresses. Micro-tensile bond tests provide many advantages over the shear tests, although these methods are technique sensitive and labour intensive.

Conclusion

Bond strength testing methods should be well-standardized, but there are many factors that cannot be fully controlled which leads to variation and misinterpretation of the data about the bonding abilities of adhesives.

Clinical Significance

New adhesive materials should be subjected to a combination of testing protocols to properly assess their bonding effectiveness.

Bonding effectiveness of self-etch adhesives to dentin after 24 h water storage

Purpose:

This study evaluated the immediate bonding effectiveness of five self-etch adhesive systems bonded to dentin.

Materials and Methods:

The microtensile bond strength of five self-etch adhesives systems, including one two-step and four one-step self-etch adhesives to dentin, was measured. Human third molars had their superficial dentin surface exposed, after which a standardized smear layer was produced using a medium-grit diamond bur. The selected adhesives were applied according to their respective manufacturer's instructions for μTBS measurement after storage in water at 37°C for 24 h.

Results:

The μTBS varied from 11.1 to 44.3 MPa; the highest bond strength was obtained with the two-step self-etch adhesive Clearfil SE Bond and the lowest with the one-step self-etch adhesive Adper Prompt L-Pop. Pretesting failures mainly occurring during sectioning with the slow-speed diamond saw were observed only with the one-step self-etch adhesive Adper Prompt L-Pop (4 out of 18).

Conclusions:

When bonded to dentin, the self-etch adhesives with simplified application procedures (one-step self-etch adhesives) still underperform as compared to the two-step self-etch adhesive Clearfil SE Bond.