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Zhang Z, Tian B, Cheng G, Liu Z, Liu J, Zhang B, Lei J, Zhao N, Han F, Fang X, Sun H, Zhao L. Influences of RF Magnetron Sputtering Power and Gas Flow Rate on a High Conductivity and Low Drift Rate of Tungsten-Rhenium Thin-Film Thermocouples. NANOMATERIALS 2022; 12:nano12071120. [PMID: 35407238 PMCID: PMC9000736 DOI: 10.3390/nano12071120] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/15/2022] [Revised: 03/25/2022] [Accepted: 03/27/2022] [Indexed: 11/16/2022]
Abstract
Thin-Film Thermocouples (TFTCs) are characterized by their high spatial resolutions, low cost, high efficiency and low interference on the air flow. However, the thermal stability of TFTCs should be further improved for application since their accuracy is influenced by joule heat and temperature time drift. In this paper, 3D molecular dynamics and finite element analysis are used for structural design. The effects of RF magnetron sputtering power and gas flow rate on conductivity and temperature time drift rate (DT) of high thermal stability tungsten–rhenium (95% W/5% Re vs. 74% W/26% Re) TFTCs were analyzed. According to the experimental results, the average Seebeck coefficient reached 31.1 µV/°C at 900 °C temperature difference (hot junction 1040 °C) with a repeatability error at ±1.37% in 33 h. The conductivity is 17.1 S/m, which is approximately 15.2 times larger than the compared tungsten-rhenium sample we presented, and the DT is 0.92 °C/h (1040 °C for 5 h), which is 9.5% of the old type we presented and 4.5% of compared ITO sample. The lumped capacity method test shows that the response time is 11.5 ms at 300 °C. This indicated an important significance in real-time temperature measurement for narrow spaces, such as the aero-engine combustion chamber.
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Affiliation(s)
- Zhongkai Zhang
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
- Institute of Materials in Electrical Engineering 1, Department of Micro- and Nano Electronics, Faculty of Electical Engineering and Information Technology, RWTH Aachen University, 52074 Aachen, Germany
| | - Bian Tian
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Gong Cheng
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Zhaojun Liu
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Jiangjiang Liu
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Bingfei Zhang
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Jiaming Lei
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Na Zhao
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
- Correspondence:
| | - Feng Han
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Xudong Fang
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
- Collaborative Innovation Center of Suzhou Nano Science and Technology, Suzhou 215123, China
| | - Hao Sun
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
| | - Libo Zhao
- State Key Laboratory for Mechanical Manufacturing Systems Engineering, Institute of Precision Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China; (Z.Z.); (B.T.); (G.C.); (Z.L.); (J.L.); (B.Z.); (J.L.); (F.H.); (X.F.); (H.S.); (L.Z.)
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Yi F, Grapes MD, LaVan DA. Practical Guide to the Design, Fabrication, and Calibration of NIST Nanocalorimeters. JOURNAL OF RESEARCH OF THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY 2019; 124:1-19. [PMID: 34877173 PMCID: PMC7340549 DOI: 10.6028/jres.124.021] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Accepted: 08/22/2019] [Indexed: 06/13/2023]
Abstract
We report here on the design, fabrication, and calibration of nanocalorimeter sensors used in the National Institute of Standards and Technology (NIST) Nanocalorimetry Measurements Project. These small-scale thermal analysis instruments are produced using silicon microfabrication approaches. A single platinum line serves as both the heater and temperature sensor, and it is made from a 500 μm wide, 100 nm thick platinum trace, suspended on a 100 nm thick silicon nitride membrane for thermal isolation. Supplemental materials to this article (available online) include drawing files and LabVIEW code used in the fabrication and calibration process.
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Affiliation(s)
- Feng Yi
- National Institute of Standards and Technology, Gaithersburg, MD 20899, USA
| | - Michael D Grapes
- Lawrence Livermore National Laboratory, Livermore, CA 94550, USA
| | - David A LaVan
- National Institute of Standards and Technology, Gaithersburg, MD 20899, USA
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Yang F, Yang N, Huo X, Xu S. Thermal sensing in fluid at the micro-nano-scales. BIOMICROFLUIDICS 2018; 12:041501. [PMID: 30867860 PMCID: PMC6404956 DOI: 10.1063/1.5037421] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/24/2018] [Accepted: 06/19/2018] [Indexed: 06/09/2023]
Abstract
Temperature is one of the most fundamental parameters for the characterization of a physical system. With rapid development of lab-on-a-chip and biology at single cell level, a great demand has risen for the temperature sensors with high spatial, temporal, and thermal resolution. Nevertheless, measuring temperature in liquid environment is always a technical challenge. Various factors may affect the sensing results, such as the fabrication parameters of built-in sensors, thermal property of electrical insulating layer, and stability of fluorescent thermometers in liquid environment. In this review, we focused on different kinds of micro/nano-thermometers applied in the thermal sensing for microfluidic systems and cultured cells. We discussed the advantages and limitations of these thermometers in specific applications and the challenges and possible solutions for more accurate temperature measurements in further studies.
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Affiliation(s)
- Fan Yang
- Key Laboratory for the Physics and Chemistry of Nanodevices, Department of Electronics, Peking University, Beijing 100871, People's Republic of China
| | - Nana Yang
- Key Laboratory for the Physics and Chemistry of Nanodevices, Department of Electronics, Peking University, Beijing 100871, People's Republic of China
| | - Xiaoye Huo
- Faculty of Mechanical Engineering, Micro-and Nanofluidics Laboratory, Technion-Israel Institute of Technology, Technion City, Haifa 32000, Israel
| | - Shengyong Xu
- Key Laboratory for the Physics and Chemistry of Nanodevices, Department of Electronics, Peking University, Beijing 100871, People's Republic of China
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Li G, Wang Z, Mao X, Zhang Y, Huo X, Liu H, Xu S. Real-Time Two-Dimensional Mapping of Relative Local Surface Temperatures with a Thin-Film Sensor Array. SENSORS 2016; 16:s16070977. [PMID: 27347969 PMCID: PMC4969835 DOI: 10.3390/s16070977] [Citation(s) in RCA: 18] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/14/2016] [Revised: 06/08/2016] [Accepted: 06/09/2016] [Indexed: 01/23/2023]
Abstract
Dynamic mapping of an object's local temperature distribution may offer valuable information for failure analysis, system control and improvement. In this letter we present a computerized measurement system which is equipped with a hybrid, low-noise mechanical-electrical multiplexer for real-time two-dimensional (2D) mapping of surface temperatures. We demonstrate the performance of the system on a device embedded with 32 pieces of built-in Cr-Pt thin-film thermocouples arranged in a 4 × 8 matrix. The system can display a continuous 2D mapping movie of relative temperatures with a time interval around 1 s. This technique may find applications in a variety of practical devices and systems.
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Affiliation(s)
- Gang Li
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Zhenhai Wang
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Xinyu Mao
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Yinghuang Zhang
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Xiaoye Huo
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Haixiao Liu
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
| | - Shengyong Xu
- Key Laboratory for the Physics & Chemistry of Nanodevices, and Department of Electronics, Peking University, Beijing 100871, China.
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Imboden M, Han H, Stark T, Lowell E, Chang J, Pardo F, Bolle C, del Corro PG, Bishop DJ. Building a Fab on a Chip. NANOSCALE 2014; 6:5049-5062. [PMID: 24705908 DOI: 10.1039/c3nr06087j] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/03/2023]
Abstract
Semiconductor fabs are large, complex industrial sites with costs for a single facility approaching $10B. In this paper we discuss the possibility of putting the entire functionality of such a fab onto a single silicon chip. We demonstrate a path forward where, for certain applications, especially at the nanometer scale, one can consider using a single chip approach for building devices with significant potential cost savings. In our approach, we build micro versions of the macro machines one typically finds in a fab, and integrating all the components together. We argue that the technology now exists to allow one to build a Fab on a Chip.
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Affiliation(s)
- Matthias Imboden
- Department of Electrical and Computer Engineering, Boston University, Boston, Massachusetts 02215, USA.
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