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For: Li G, Li P, Chen Q, Mani MP, Jaganathan SK. Enhanced mechanical, thermal and biocompatible nature of dual component electrospun nanocomposite for bone tissue engineering. PeerJ 2019;7:e6986. [PMID: 31179183 PMCID: PMC6542347 DOI: 10.7717/peerj.6986] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/18/2018] [Accepted: 04/19/2019] [Indexed: 01/18/2023]  Open
Number Cited by Other Article(s)
1
Terrell JA, Jones CG, Kabandana GKM, Chen C. From cells-on-a-chip to organs-on-a-chip: scaffolding materials for 3D cell culture in microfluidics. J Mater Chem B 2021;8:6667-6685. [PMID: 32567628 DOI: 10.1039/d0tb00718h] [Citation(s) in RCA: 49] [Impact Index Per Article: 12.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/06/2023]
2
Liu H, Gough CR, Deng Q, Gu Z, Wang F, Hu X. Recent Advances in Electrospun Sustainable Composites for Biomedical, Environmental, Energy, and Packaging Applications. Int J Mol Sci 2020;21:E4019. [PMID: 32512793 PMCID: PMC7312508 DOI: 10.3390/ijms21114019] [Citation(s) in RCA: 30] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/26/2020] [Revised: 06/01/2020] [Accepted: 06/02/2020] [Indexed: 12/13/2022]  Open
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