Printing conformal and flexible copper networks for multimodal pressure and flow sensing

Flexible multimodal sensors with ultrasensitive detection capabilities are an indispensable component of wearable electronics and are highly sought-after involving a wide range of signal monitoring such as artificial skin and soft robotics. Here we report a flexible and wireless multimodal sensor using low-temperature additive manufacturing of copper nanoplates on elastic polyurethane substrates for temperature, pressure, and flow monitoring. The positive temperature coefficient and piezoresistive performance of the copper nanoplate network translates to a reliable temperature, steady-state and dynamic pressure/flow sensing for detecting pressures as small as 0.64 Pa with a response time of 130 ms, as well as velocity detection ranging from 2.5-6.8 m s-1. Additionally, by incorporating a printed antenna, it enables a self-powered, battery-free system, offering a wireless readout of printed multimodal sensors with superior real-time sensing performance in conjunction with wearable flexibility.

Surface-passivated Cu conductors for high-temperature sulfurous environments

Advanced materials capable of withstanding extreme environments garner extensive interest in the development of next-generation advanced anti-corrosion electronics. Herein, we report that the surface passivation of printed copper conductors imparts corrosion resistance in high-temperature sulfurous environments while maintaining a high electrical conductivity of 4.42 MS m^-1 when subjected to a sulfur-containing environment at 350 °C for 12 h. This study provides potential for the development of surface-passivated copper conductors that are resistant to the sulfidizing environments found in several applications of modern technology.

Molecular Copper Decomposition ink for Printable Electronics

Nanostructured metal materials are the frontrunners of numerous electronic advancements. While realizing such potential, it is indispensable to address its oxidation and stability drawbacks, that are due to its high...

Printed copper-nanoplate conductor for electro-magnetic interference

As one of the conductive ink materials with high electric conductivity, elemental copper (Cu) based nanocrystals promise for printable electronics. Here, single crystalline Cu nanoplates were synthesized using a facile hydrothermal method. Size engineering of Cu nanoplates can be rationalized by using the LaMer model and the versatile Cu conductive ink materials are suitable for different printing technologies. The printed Cu traces show high electric conductivity of 6 MS m^-1, exhibiting electro-magnetic interference shielding efficiency value of 75 dB at an average thicknesses of 11μm. Together with flexible alumina ceramic aerogel substrates, it kept 87% conductivity at the environmental temperature of 400 °C, demonstrating the potential of Cu conductive ink for high-temperature printable electronics applications.

Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

Advanced high-temperature materials, metals and ceramics, have been widely sought after for printed flexible electronics under extreme conditions. However, the thermal stability and electronic performance of these materials generally diminish under extreme environments. Additionally, printable electronics typically utilize nanoscale materials, which further exacerbate the problems with oxidation and corrosion at those extreme conditions. Here we report superior thermal and electronic stability of printed copper-flexible ceramic electronics by means of integral hybridization and passivation strategies. High electric conductivity (5.6 MS/m) and thermal stability above 400 °C are achieved in the printed graphene-passivated copper platelet features, while thermal management and stability above 1000 °C of printed electronics can be achieved by using either ultrathin alumina or flexible alumina aerogel sheets. The findings shown here provide a pathway toward printed, extreme electronic applications for harsh service conditions.

Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation

Polymer dielectrics, an insulating material ubiquitous in electrical power systems, must be ultralight, mechanically and dielectrically strong, and very thermally conductive. However, electric and thermal transport parameters are intercorrelated in a way that works against the occurrence of thermally conductive polymer electric insulators. Here, we describe how solution gel-shearing–strained polyethylene yields an electric insulating material with an outstanding in-plane thermal conductivity of 10.74 W m⁻¹ K⁻¹ and an average dielectric constant of 4.1. The dielectric constant and loss of such sheared polymer electric insulators are nearly independent of the frequency and a wide temperature range. The gel-shearing aligns ultrahigh–molecular weight polymer crystalline chains for the formation of separated and aligned nanoscale fibrous arrays. Together with lattice strains and the presence of boron nitride nanosheets, the dielectric polymer shows high current density carrying and high operating temperature, which is attributed to greatly enhanced heat conduction.

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Printed copper materials have been attracting significant attention prominently due to their electric, mechanical, and thermal properties. The emerging copper-based flexible electronics and energy-critical applications rely on the control of electric conductivity, current-carrying capacity, and reliability of copper nanostructures and their printable ink materials. In this review, we describe the growth of copper nanostructures as the building blocks for printable ink materials on which a variety of conductive features can be additively manufactured to achieve high electric conductivity and stability. Accordingly, the copper-based flexible hybrid electronics and energy-critical devices printed by different printing techniques are reviewed for emerging applications.

Ductile cooling phase change material

Cooling represents a considerable fraction of energy consumption. However, it is indispensable to develop eco-friendly, biocompatible, and ductile cooling materials for personal applications. In this study, we demonstrate the ductile cooling ability with phase change of thermally passivated hydrogel composite materials with additive manufacturing ability. Thermal evaluation of such water-based composites indicates a superior cold retention capacity with a cooling comfort over 6 hours, while the composite displays a full recovery when strained up to 80% in uniaxial compression tests as a result of the intertwining between covalent and ionic bonds. A three-layered rectangular model was utilized to simulate the problem in a steady-state thermal analysis to study the cooling effect. Our findings indicate the potential of hydrogel as a cooling phase-change medium and its contribution towards ductile cooling applications.