Stretchable and Lithography-Compatible Interconnects Enabled by Self-Assembled Nanofilms with Interlocking Interfaces

Stretchable interconnects with miniature widths are vital for the high-density integration of deformable electronic components on a single substrate for targeted data logic or storage functions. However, it is still challenging to attain high-resolution patternability of stretchable conductors with robust circuit fabrication capability. Here, we report a self-assembled silver nanofilm firmly interlocked by an elastomeric nanodielectric that can be photolithographically patterned into microscale features while preserving high stretchability and conductivity. Both silver and dielectric nanofilms are fabricated by layer-by-layer assembly, ensuring wafer-scale uniformity and meticulous control of thicknesses. Without any thermal annealing, the as-fabricated nanofilms from silver nanoparticles (AgNPs) exhibit conductivity of 1.54 × 106 S m-1 and stretchability of ∼200%, which is due to the impeded crack propagation by the underlying PU nanodielectrics. Furthermore, it is revealed that AgNP microstrips defined by photolithography show higher stretchability when their widths are downscaled to 100 μm owing to confined cracks. However, further scaling restricts the stretchability, following the early development of cracks cutting across the strip. In addition, the resistance change of these silver interconnects can be decreased using serpentine architectures. As a demonstration, these self-assembled interconnects are used as stretchable circuit boards to power LEDs.

Interlocking membrane/catalyst layer interface for high mechanical robustness of hydrocarbon-membrane-based polymer electrolyte membrane fuel cells

A physical interlocking interface that can tightly bind a sulfonated poly(arylene ether sulfone) (SPAES) membrane and a Nafion catalyst layer in polymer electrolyte fuel cells is demonstrated. Owing to higher expansion with hydration for SPAES than for Nafion, a strong normal force is generated at the interface of a SPAES pillar and a Nafion hole, resulting in an 8-fold increase of the interfacial bonding strength at RH 50% and a 4.7-times increase of the wet/dry cycling durability.