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Park S, On SY, Kim J, Lee J, Kim TS, Wardle BL, Kim SS. Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements. ACS Appl Mater Interfaces 2023; 15:38750-38758. [PMID: 37535803 PMCID: PMC10436241 DOI: 10.1021/acsami.3c06145] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/28/2023] [Accepted: 07/16/2023] [Indexed: 08/05/2023]
Abstract
Semiconductor packaging based on an epoxy molding compound (EMC) currently has several disadvantages including warpage, limited processing area, and variability that all negatively affect cost and production yield. We propose a facile EMC molding process method using a flash electro-thermal carbon fiber heating (FE-CH) device based on carbon fiber-based papers to manufacture an EMC molded to a copper substrate (EMC/Cu bi-layer package) via Joule heating, and using this device, a modified cure cycle that combines the conventional cure cycle (CCC) with rapid cooling was performed using FE-CH to reduce the curvature of the EMC/Cu bi-layer package. Compared to the conventional hot press process, which uses 3.17 MW of power, the FE-CH process only uses 32.87 kW, resulting in a power consumption reduction of over 100 times when following the CCC. Furthermore, the FE-CH-cured EMC/Cu bi-layer package exhibits mechanical properties equivalent to those of a hot press-cured specimen, including the degree of cure, elastic modulus, curvature, bonding temperature, residual strain, and peel strength. The modified cure cycle using the FE-CH results in a 31% reduction in residual strain, a 32% reduction in curvature, and a 47% increase in peel strength compared to the CCC, indicating that this new process method is very promising for reducing a semiconductor package's price by reducing the process cost and warpage.
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Affiliation(s)
- Seong
Yeon Park
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
| | - Seung Yoon On
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
| | - Junmo Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
| | - Jeonyoon Lee
- Department
of Aerospace Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
| | - Taek-Soo Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
| | - Brian L. Wardle
- Department
of Aeronautics and Astronautics, Massachusetts
Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States
- Department
of Mechanical Engineering, Massachusetts
Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States
| | - Seong Su Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea
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Park S, On SY, Kim J, Lee J, Kim TS, Wardle BL, Kim SS. Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS Appl Mater Interfaces 2023; 15:11024-11032. [PMID: 36696132 PMCID: PMC9982811 DOI: 10.1021/acsami.2c21229] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/25/2022] [Accepted: 01/11/2023] [Indexed: 06/17/2023]
Abstract
Semiconductor packaging continues to reduce in thickness following the overall thinning of electronic devices such as smartphones and tablets. As the package becomes thinner, the warpage of the semiconductor package becomes more important due to the reduced bending stiffness and driven by thermal residual stresses and thermal expansion mismatch during the epoxy molding compound (EMC) curing to create the package. To address this packaging reliability issue, in this study, we developed a modified cure cycle that adds a rapid cooling step to the conventional cure cycle (CCC) to enhance the reliability of the EMC molded to a copper substrate (EMC/Cu bi-layer package) by lowering the bonding temperature of the EMC/Cu bi-layer package. Modeling of the package via Timoshenko theory including effective cure shrinkage allowed the rapid cooling step to be quantified and confirmed via experiments. The modified cure cycle resulted in a 26% reduction in residual strain, a 27% reduction in curvature, and a 40% increase in peel strength compared to the CCC, suggesting that this is an effective new method for managing warping effects in such packaged structures.
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Affiliation(s)
- Seong
Yeon Park
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
| | - Seung Yoon On
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
| | - Junmo Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
| | - Jeonyoon Lee
- Department
of Aerospace Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
| | - Taek-Soo Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
| | - Brian L. Wardle
- Department
of Aeronautics and Astronautics, Massachusetts
Institute of Technology, 77 Massachusetts Ave, Cambridge, Massachusetts02139, United States
- Department
of Mechanical Engineering, Massachusetts
Institute of Technology, 77 Massachusetts Ave, Cambridge, Massachusetts02139, United States
| | - Seong Su Kim
- Department
of Mechanical Engineering, Korea Advanced
Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea
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