Recent Progress of Flexible Image Sensors for Biomedical Applications

Artificial Sense Technology: Emulating and Extending Biological Senses

Biological senses are critical for the survival of organisms. A great deal of attention has focused on elucidating the underlying physiological mechanisms of the senses, inspiring various sensing techniques. Despite progress in this area, gaps remain between the biological senses and conventional sensing techniques. In this Perspective, we propose the concept of artificial sense technology, which mimics the biological senses but differs in terms of objective sensing and intelligent feedback capabilities. We first summarize recent progress in the use of nanotechnologies to emulate the biological senses and then outline the advantages of artificial sense technology, which extend the capabilities of its biological counterparts. We envision artificial sense technology as a powerful perceptual interface that will play key roles in sensation substitution, digital healthcare, animal interactions, plant electronics, smart robots, and other areas that enrich the connections of the physical and virtual worlds.

Direct gold bonding for flexible integrated electronics

Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved using low-temperature processes to prevent device damage. However, conventional interconnection bonding methods require additional adhesive layers, making it challenging to achieve these characteristics simultaneously. Here, we develop and characterize water vapor plasma–assisted bonding (WVPAB) that enables direct bonding of gold electrodes deposited on ultrathin polymer films. WVPAB bonds rough gold electrodes at room temperature and atmospheric pressure in ambient air. Hydroxyl groups generated by the plasma assist bonding between two gold surfaces, allowing the formation of a strong and stable interface. The applicability of WVPAB-mediated connections to ultrathin electronic systems was also demonstrated, and ultraflexible organic photovoltaics and light-emitting diodes fabricated on separate films were successfully interconnected via ultrathin wiring films.

High-Performance Flexible InAs Thin-Film Photodetector Arrays with Heteroepitaxial Growth Using an Abruptly Graded InxAl1-xAs Buffer

Current infrared thermal image sensors are mainly based on planar firm substrates, but the rigid form factor appears to restrain the versatility of their applications. For wearable health monitoring and implanted biomedical sensing, transfer of active device layers onto a flexible substrate is required while controlling the high-quality crystalline interface. Here, we demonstrate high-detectivity flexible InAs thin-film mid-infrared photodetector arrays through high-yield wafer bonding and a heteroepitaxial lift-off process. An abruptly graded In_xAl_1-xAs (0.5 < x < 1) buffer was found to drastically improve the lift-off interface morphology and reduce the threading dislocation density twice, compared to the conventional linear grading method. Also, our flexible InAs photodetectors showed excellent optical performance with high mechanical robustness, a peak room-temperature specific detectivity of 1.21 × 10⁹ cm-Hz^1/2/W at 3.4 μm, and excellent device reliability. This flexible InAs photodetector enabled by the heteroepitaxial lift-off method shows promise for next-generation thermal image sensors.

Photoacoustic imaging for monitoring of stroke diseases: A review

Stroke is the leading cause of death and disability after ischemic heart disease. However, there is lacking a non-invasive long-time monitoring technique for stroke diagnosis and therapy. The photoacoustic imaging approach reconstructs images of an object based on the energy excitation by optical absorption and its conversion to acoustic waves, due to corresponding thermoelastic expansion, which has optical resolution and acoustic propagation. This emerging functional imaging method is a non-invasive technique. Due to its precision, this method is particularly attractive for stroke monitoring purpose. In this paper, we review the achievements of this technology and its applications on stroke, as well as the development status in both animal and human applications. Also, various photoacoustic systems and multi-modality photoacoustic imaging are introduced as for potential clinical applications. Finally, the challenges of photoacoustic imaging for monitoring stroke are discussed.

Recent advances in liquid-metal-based wearable electronics and materials

Soft wearable electronics are rapidly developing through exploration of new materials, fabrication approaches, and design concepts. Although there have been many efforts for decades, a resurgence of interest in liquid metals (LMs) for sensing and wiring functional properties of materials in soft wearable electronics has brought great advances in wearable electronics and materials. Various forms of LMs enable many routes to fabricate flexible and stretchable sensors, circuits, and functional wearables with many desirable properties. This review article presents a systematic overview of recent progresses in LM-enabled wearable electronics that have been achieved through material innovations and the discovery of new fabrication approaches and design architectures. We also present applications of wearable LM technologies for physiological sensing, activity tracking, and energy harvesting. Finally, we discuss a perspective on future opportunities and challenges for wearable LM electronics as this field continues to grow.

A Review of the Progress of Thin-Film Transistors and Their Technologies for Flexible Electronics

Flexible electronics enable various technologies to be integrated into daily life and fuel the quests to develop revolutionary applications, such as artificial skins, intelligent textiles, e-skin patches, and on-skin displays. Mechanical characteristics, including the total thickness and the bending radius, are of paramount importance for physically flexible electronics. However, the limitation regarding semiconductor fabrication challenges the mechanical flexibility of thin-film electronics. Thin-Film Transistors (TFTs) are a key component in thin-film electronics that restrict the flexibility of thin-film systems. Here, we provide a brief overview of the trends of the last three decades in the physical flexibility of various semiconducting technologies, including amorphous-silicon, polycrystalline silicon, oxides, carbon nanotubes, and organics. The study demonstrates the trends of the mechanical properties, including the total thickness and the bending radius, and provides a vision for the future of flexible TFTs.