Deterministic Integration of Biological and Soft Materials onto 3D Microscale Cellular Frameworks

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.

Biomimetic and Biologically Compliant Soft Architectures via 3D and 4D Assembly Methods: A Perspective

Recent progress in soft material chemistry and enabling methods of 3D and 4D fabrication-emerging programmable material designs and associated assembly methods for the construction of complex functional structures-is highlighted. The underlying advances in this science allow the creation of soft material architectures with properties and shapes that programmably vary with time. The ability to control composition from the molecular to the macroscale is highlighted-most notably through examples that focus on biomimetic and biologically compliant soft materials. Such advances, when coupled with the ability to program material structure and properties across multiple scales via microfabrication, 3D printing, or other assembly techniques, give rise to responsive (4D) architectures. The challenges and prospects for progress in this emerging field in terms of its capacities for integrating chemistry, form, and function are described in the context of exemplary soft material systems demonstrating important but heretofore difficult-to-realize biomimetic and biologically compliant behaviors.

Degradation Study of Thin-Film Silicon Structures in a Cell Culture Medium

Thin-film silicon (Si)-based transient electronics represents an emerging technology that enables spontaneous dissolution, absorption and, finally, physical disappearance in a controlled manner under physiological conditions, and has attracted increasing attention in pertinent clinical applications such as biomedical implants for on-body sensing, disease diagnostics, and therapeutics. The degradation behavior of thin-film Si materials and devices is critically dependent on the device structure as well as the environment. In this work, we experimentally investigated the dissolution of planar Si thin films and micropatterned Si pillar arrays in a cell culture medium, and systematically analyzed the evolution of their topographical, physical, and chemical properties during the hydrolysis. We discovered that the cell culture medium significantly accelerates the degradation process, and Si pillar arrays present more prominent degradation effects by creating rougher surfaces, complicating surface states, and decreasing the electrochemical impedance. Additionally, the dissolution process leads to greatly reduced mechanical strength. Finally, in vitro cell culture studies demonstrate desirable biocompatibility of corroded Si pillars. The results provide a guideline for the use of thin-film Si materials and devices as transient implants in biomedicine.

3D Particle Free Printing of Biocompatible Conductive Hydrogel Platforms for Neuron Growth and Electrophysiological Recording

Electrically conductive 3D periodic microscaffolds are fabricated using a particle-free direct ink writing approach for use as neuronal growth and electrophysiological recording platforms. A poly (2-hydroxyethyl methacrylate) (pHEMA)/pyrrole ink, followed by chemical in situ polymerization of pyrrole, enables hydrogel printing through nozzles as small as 1 μm. These conductive hydrogels can pattern complex 2D and 3D structures and have good biocompatibility with test cell cultures (~94.5% viability after 7 days). Hydrogel arrays promote extensive neurite outgrowth of cultured Aplysia californica pedal ganglion neurons. This platform allows extracellular electrophysiological recording of steady-state and stimulated electrical neuronal activities. In summation, this 3D conductive ink printing process enables preparation of biocompatible and micron-sized structures to create customized in vitro electrophysiological recording platforms.

Reprogrammable 3D Shaping from Phase Change Microstructures in Elastic Composites

Herein, we demonstrate reprogrammable 3D structures that are assembled from elastic composite sheets made from elastic materials and phase change microparticles. By controlling the phase change of the microparticles by localized thermal patterning, anisotropic residual strain is generated in the pre-stretched composite sheets and then triggers 3D structure assembly when the composite sheets are released from the external stress. Modulation of the geometries and location of the thermal patterns leads to complex 2D-3D shaping behaviors such as bending, folding, buckling, and wrinkling. Because of the reversible phase change of the microparticles, these programmed 3D structures can later be recovered to 2D sheets once they are heated for reprogramming different 3D structures. To predict the 3D structures assembled from the 2D composite sheets, finite element modeling was employed, which showed reasonable agreement with the experiments. The demonstrated strategy of reversibly programming 3D shapes by controlling the phase change microstructures in the elastic composites offers unique capabilities in fabricating functional devices such as a rewritable "paper" and a shape reconfigurable pneumatic actuator.

Integration of biological systems with electronic-mechanical assemblies

Biological systems continuously interact with the surrounding environment because they are dynamically evolving. The interaction is achieved through mechanical, electrical, chemical, biological, thermal, optical, or a synergistic combination of these cues. To provide a fundamental understanding of the interaction, recent efforts that integrate biological systems with the electronic-mechanical assemblies create unique opportunities for simultaneous monitoring and eliciting the responses to the biological system. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual. In this short review, we will provide a brief overview of the recent development on the integration of the biological systems with electronic-mechanical assemblies across multiple scales, with applications ranging from healthcare monitoring to therapeutic options such as drug delivery and rehabilitation therapies. STATEMENT OF SIGNIFICANCE: An overview of the recent progress on the integration of the biological system with both electronic and mechanical assemblies is discussed. The integration creates the unique opportunity to simultaneously monitor and elicit the responses to the biological system, which provides a fundamental understanding of the interaction between the biological system and the electronic-mechanical assemblies. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual.

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

Proactively modulating mechanical behaviors of materials at multiscale for mechano-adaptable devices

How materials behave when subjected to mechanical stresses is studied by mechanics of materials. However, the application of flexible and stretchable devices exposes materials to dynamic mechanical environments. Therefore, mechano-adaptable materials and devices that can respond as pre-designed have been explored. There are two main ways to proactively modulate mechanical behaviors for materials, which involve molecular design and structural design. Molecular design has effectively integrated mechanically sensitive groups into synthetic materials for anticipated mechano-response. Structural design has broadened the boundary of conventional materials, generating mechanical metamaterials at multiscale with unique mechanical properties. Furthermore, molecular, structural plus systematic design for the application of mechano-adaptable devices have realized better electrical performance, human interaction, long-term sustainability, and even higher efficiency. Various devices based on design ideas are summarized and future challenges for proactively modulating mechanical behaviors of mechano-adaptable devices are discussed.

Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to integrate planar thin film materials and device layouts. The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes (Si NMs) as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS). Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others.