Elastomer surfaces with directionally dependent adhesion strength and their use in transfer printing with continuous roll-to-roll applications

Advanced Mechanical Transfer of Micro-LEDs Enabled by Structurally Modified Wide Sapphire Nanomembranes through Thermal Reflow of Photoresist

Micro light-emitting diodes (micro-LEDs) are pivotal in next-generation display technologies, driven by the need for high pixel density. This study introduces a novel methodology utilizing wide sapphire nanomembranes (W-SNM) as a dual-purpose template for high-quality epitaxial growth and the mechanical lift-off of individual micro-LEDs. Micro-LEDs grow individually on W-SNM, obviating the chip singulation process. By employing mechanical fracturing of the thin W-SNM, our method facilitates the transfer of micro-LEDs without the conventional laser lift-off (LLO) process. Previously introduced sapphire nanomembranes (SNM) have shown promise in enhancing epitaxial layer quality; however, they encountered challenges in managing micro-LED size variation and achieving efficient mechanical transfer. Here, we apply simple yet effective adjustments to the SNM structure, specifically, its elevation and widening. This strategic modification allows micro-LEDs to endure applied forces without incurring cracks or defects, ensuring that only the targeted W-SNM are selectively fractured. The mechanically transferred vertical 15 × 15 μm2 micro-LED device operates at an optimal turn-on voltage of 3.3 V. Finite element simulations validate the mechanical strain distribution between the W-SNM and GaN when pressure is applied, confirming the efficacy of our design approach. This pioneering methodology offers a streamlined, efficient pathway for the production and mechanical transfer of micro-LEDs, presenting new avenues for their integration into next-generation, high-performance displays.

A review of bioinspired dry adhesives: from achieving strong adhesion to realizing switchable adhesion

In the early twenty-first century, extensive research has been conducted on geckos' ability to climb vertical walls with the advancement of microscopy technology. Unprecedented studies and developments have focused on the adhesion mechanism, structural design, preparation methods, and applications of bioinspired dry adhesives. Notably, strong adhesion that adheres to both the principles of contact splitting and stress uniform distribution has been discovered and proposed. The increasing popularity of flexible electronic skins, soft crawling robots, and smart assembly systems has made switchable adhesion properties essential for smart adhesives. These adhesives are designed to be programmable and switchable in response to external stimuli such as magnetic fields, thermal changes, electrical signals, light exposure as well as mechanical processes. This paper provides a comprehensive review of the development history of bioinspired dry adhesives from achieving strong adhesion to realizing switchable adhesion.

Switchable Adhesive Based on Shape Memory Polymer with Micropillars of Different Heights for Laser-Driven Noncontact Transfer Printing

Switchable adhesive is essential to develop transfer printing, which is an advanced heterogeneous material integration technique for developing electronic systems. Designing a switchable adhesive with strong adhesion strength that can also be easily eliminated to enable noncontact transfer printing still remains a challenge. Here, we report a simple yet robust design of switchable adhesive based on a thermally responsive shape memory polymer with micropillars of different heights. The adhesive takes advantage of the shape-fixing property of shape memory polymer to provide strong adhesion for a reliable pick-up and the various levels of shape recovery of micropillars under laser heating to eliminate the adhesion for robust printing in a noncontact way. Systematic experimental and numerical studies reveal the adhesion switch mechanism and provide insights into the design of switchable adhesives. This switchable adhesive design provides a good solution to develop laser-driven noncontact transfer printing with the capability of eliminating the influence of receivers on the performance of transfer printing. Demonstrations of transfer printing of silicon wafers, microscale Si platelets, and micro light emitting diode (μ-LED) chips onto various challenging nonadhesive receivers (e.g., sandpaper, stainless steel bead, leaf, or glass) to form desired two-dimensional or three-dimensional layouts illustrate its great potential in deterministic assembly.

Universal selective transfer printing via micro-vacuum force

Transfer printing of inorganic thin-film semiconductors has attracted considerable attention to realize high-performance soft electronics on unusual substrates. However, conventional transfer technologies including elastomeric transfer printing, laser-assisted transfer, and electrostatic transfer still have challenging issues such as stamp reusability, additional adhesives, and device damage. Here, a micro-vacuum assisted selective transfer is reported to assemble micro-sized inorganic semiconductors onto unconventional substrates. 20 μm-sized micro-hole arrays are formed via laser-induced etching technology on a glass substrate. The vacuum controllable module, consisting of a laser-drilled glass and hard-polydimethylsiloxane micro-channels, enables selective modulation of micro-vacuum suction force on microchip arrays. Ultrahigh adhesion switchability of 3.364 × 106, accomplished by pressure control during the micro-vacuum transfer procedure, facilitates the pick-up and release of thin-film semiconductors without additional adhesives and chip damage. Heterogeneous integration of III-V materials and silicon is demonstrated by assembling microchips with diverse shapes and sizes from different mother wafers on the same plane. Multiple selective transfers are implemented by independent pressure control of two separate vacuum channels with a high transfer yield of 98.06%. Finally, flexible micro light-emitting diodes and transistors with uniform electrical/optical properties are fabricated via micro-vacuum assisted selective transfer.

Technological Breakthroughs in Chip Fabrication, Transfer, and Color Conversion for High-Performance Micro-LED Displays

The implementation of high-efficiency and high-resolution displays has been the focus of considerable research interest. Recently, micro light-emitting diodes (micro-LEDs), which are inorganic light-emitting diodes of size <100 µm2 , have emerged as a promising display technology owing to their superior features and advantages over other displays like liquid crystal displays and organic light-emitting diodes. Although many companies have introduced micro-LED displays since 2012, obstacles to mass production still exist. Three major challenges, i.e., low quantum efficiency, time-consuming transfer, and complex color conversion, have been overcome with technological breakthroughs to realize cost-effective micro-LED displays. In the review, methods for improving the degraded quantum efficiency of GaN-based micro-LEDs induced by the size effect are examined, including wet chemical treatment, passivation layer adoption, LED structure design, and growing LEDs in self-passivated structures. Novel transfer technologies, including pick-up transfer and self-assembly methods, for developing large-area micro-LED displays with high yield and reliability are discussed in depth. Quantum dots as color conversion materials for high color purity, and deposition methods such as electrohydrodynamic jet printing or contact printing on micro-LEDs are also addressed. This review presents current status and critical challenges of micro-LED technology and promising technical breakthroughs for commercialization of high-performance displays.

Fabrication and Functionality Integration Technologies for Small-Scale Soft Robots

Small-scale soft robots are attracting increasing interest for visible and potential applications owing to their safety and tolerance resulting from their intrinsic soft bodies or compliant structures. However, it is not sufficient that the soft bodies merely provide support or system protection. More importantly, to meet the increasing demands of controllable operation and real-time feedback in unstructured/complicated scenarios, these robots are required to perform simplex and multimodal functionalities for sensing, communicating, and interacting with external environments during large or dynamic deformation with the risk of mismatch or delamination. Challenges are encountered during fabrication and integration, including the selection and fabrication of composite/materials and structures, integration of active/passive functional modules with robust interfaces, particularly with highly deformable soft/stretchable bodies. Here, methods and strategies of fabricating structural soft bodies and integrating them with functional modules for developing small-scale soft robots are investigated. Utilizing templating, 3D printing, transfer printing, and swelling, small-scale soft robots can be endowed with several perceptual capabilities corresponding to diverse stimulus, such as light, heat, magnetism, and force. The integration of sensing and functionalities effectively enhances the agility, adaptability, and universality of soft robots when applied in various fields, including smart manufacturing, medical surgery, biomimetics, and other interdisciplinary sciences.

Transfer printing technologies for soft electronics

Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.

Wafer-scale monolithic integration of full-colour micro-LED display using MoS2 transistor

Large-scale growth of transition metal dichalcogenides and their subsequent integration with compound semiconductors is one of the major obstacles for two-dimensional materials implementation in optoelectronics applications such as active matrix displays or optical sensors. Here we present a novel transition metal dichalcogenide-on-compound-semiconductor fabrication method that is compatible with a batch microfabrication process. We show how a thin film of molybdenum disulfide (MoS₂) can be directly synthesized on a gallium-nitride-based epitaxial wafer to form a thin film transistor array. Subsequently, the MoS₂ thin film transistor was monolithically integrated with micro-light-emitting-diode (micro-LED) devices to produce an active matrix micro-LED display. In addition, we demonstrate a simple approach to obtain red and green colours through the printing of quantum dots on a blue micro-LED, which allows for the scalable fabrication of full-colour micro-LED displays. This strategy represents a promising route to attain heterogeneous integration, which is essential for high-performance optoelectronic systems that can incorporate the established semiconductor technology and emerging two-dimensional materials.

Contact Printing of Multilayered Thin Films with Shape Memory Polymers

This study describes a method for transfer printing microarrays of multilayered organic-inorganic thin films using shape memory printing stamps and microstructured donor substrates. By applying the films on the microstructured donor substrates during physical vapor deposition and modulating the interfacial adhesion using a shape memory elastomer during printing, this method achieves (1) high lateral and feature-edge resolution and (2) high transfer efficiency from the donor to the receiver substrate. For demonstration, polyurethane-acrylate stamps and silicon/silicon oxide donor substrates were used in the large-area transfer printing of organic-inorganic thin-film stacks with micrometer lateral dimensions and sub-200 nm thickness.

Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.

Registry-Dependent Peeling of Layered Material Interfaces: The Case of Graphene Nanoribbons on Hexagonal Boron Nitride

Peeling of layered materials from supporting substrates, which is central for exfoliation and transfer processes, is found to be dominated by lattice commensurability effects in both low and high velocity limits. For a graphene nanoribbon atop a hexagonal boron nitride surface, the microscopic peeling behavior ranges from stick-slip, through smooth-sliding, to pure peeling regimes, depending on the relative orientation of the contacting surfaces and the peeling angle. The underlying mechanisms stem from the intimate relation between interfacial registry, interlayer interactions, and friction. This, in turn, allows for devising simple models for extracting the interfacial adhesion energy from the peeling force traces.

Adaptive Self-Sealing Suction-Based Soft Robotic Gripper

While suction cups prevail as common gripping tools for a wide range of real-world parts and surfaces, they often fail to seal the contact interface when engaging with irregular shapes and textured surfaces. In this work, the authors propose a suction-based soft robotic gripper where suction is created inside a self-sealing, highly conformable and thin flat elastic membrane contacting a given part surface. Such soft gripper can self-adapt the size of its effective suction area with respect to the applied load. The elastomeric membrane covering edge of the soft gripper can develop an air-tight self-sealing with parts even smaller than the gripper diameter. Such gripper shows 4 times higher adhesion than the one without the membrane on various textured surfaces. The two major advantages, underactuated self-adaptability and enhanced suction performance, allow the membrane-based suction mechanism to grip various three-dimensional (3D) geometries and delicate parts, such as egg, lime, apple, and even hydrogels without noticeable damage, which can have not been gripped with the previous adhesive microstructures-based and active suction-based soft grippers. The structural and material simplicity of the proposed soft gripper design can have a broad use in diverse fields, such as digital manufacturing, robotic manipulation, transfer printing, and medical gripping.

High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

Detachment of the remora suckerfish disc: kinematics and a bio-inspired robotic model

Remora suckerfish can attach to a wide diversity of marine hosts, however, their detachment mechanism remains poorly understood. Through analyzing high-speed videos, we found that the detachment of the live remora (Echeneis naucrates) is a rapid behavior that can happen within 240 ms. We separate this remarkable behavior into three stages: 1) lamellae folding down and soft lip curling, 2) disc raising and 3) complete detachment. To quantitatively investigate the detachment behavior, we fabricated a multi-material biomimetic disc and utilized it to study each stage of the detachment process. In stage one, we found that folding down lamellae is essential for decreasing the detachment resistance (vertical interfacial force and friction force) of the suction disc. Also, curling up the soft lip to breaking the adhesive seal reduced the vertical pull-off force up to 94 times. During disc raising in stage 2, we found that the partially flexible base (Young's modulus: ∼3 MPa) of the disc can lead to a 30% power-use reduction compared to a rigid base (Young's modulus: ∼3 GPa). After completing full detachment in stage 3, the corresponding drag wake flow decreased by 44% compared to an attached state due to lamellae folding and the entire soft lip uncurling. We developed a bio-inspired remora suckerfish robot propelled by a water jet to demonstrate a complete detachment which covers all three stages within 200 ms. We also demonstrated that an ROV has both hitchhiking and pick-and-place capabilities by integrating remora-inspired discs at appropriate locations. This study may shed light on future research in bio-inspired adhesives and lay a foundation for developing an untethered, multimodal, underwater hitchhiking robot.

Flexible PZT-Integrated, Bilateral Sensors via Transfer-Free Laser Lift-Off for Multimodal Measurements

Fabrication of functional devices that require a high-temperature annealing process on a thin, temperature-sensitive substrate is a long-standing, crucial issue in flexible electronics. Herein, we propose a transfer-free laser lift-off method to directly fabricate lead zirconate titanate (PZT) piezoelectric sensors that commonly undergo a high-temperature annealing (∼650 °C) on ubiquitous flexible substrates, including polyimide (∼300 °C), polyethylene terephthalate (∼120 °C), and polydimethylsiloxane (∼150 °C). The method includes the steps of fabricating sensors, encapsulating a flexible substrate, and peeling off the device by melting the sacrificial PZT layer at the interface with a sapphire glass. The appropriate fluence of laser energy has been figured out to avoid inadequate stripping or damage of the device. In addition, a process window for reliable stripping of the device has been established among the laser fluence and the thickness of the sacrificial layer and the supporting substrate. Furthermore, the capability of the newly proposed technique has been verified and expanded by successfully integrating several sensors that need skillful low-temperature heating treatment on top of a flexible supporting substrate accordingly before stripping. Finally, a PZT-integrated, bilateral multimodal sensor on a PI substrate has been fabricated, and the device demonstrates excellent performance and stability toward perceiving distributed dynamic pressure and temperature stimuli, revealing its high potential for the fabrication of high-performance devices for multimodal sensing applications.

Investigation on Key Parameters in the Fabrication of Stamps for Transfer Printing of Micro Devices

For the past few years, the transfer printing method has been developed and has secured numerous advantages. Here, via both experiments and analyses, we have focused on identifying key parameters and optimizing their values in the fabrication process of stamps for transfer-printing micro-devices. Specifically, the elastic modulus of posts is measured using the atomic force microscope and the Derjaguin, Muller, and Toporov model. Based on mold morphologies data, we subsequently explore the law of photoresist development under different design widths as well as development time, establish mathematical models, and offer relevant explanations for the formation of various developmental topographies. Furthermore, the relationship between the elastic modulus and these stamp-fabrication parameters has also been analyzed and confirmed. Hopefully, the proposed work can provide the guidance for fabricating reliable stamps in the future.

Integration of biological systems with electronic-mechanical assemblies

Biological systems continuously interact with the surrounding environment because they are dynamically evolving. The interaction is achieved through mechanical, electrical, chemical, biological, thermal, optical, or a synergistic combination of these cues. To provide a fundamental understanding of the interaction, recent efforts that integrate biological systems with the electronic-mechanical assemblies create unique opportunities for simultaneous monitoring and eliciting the responses to the biological system. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual. In this short review, we will provide a brief overview of the recent development on the integration of the biological systems with electronic-mechanical assemblies across multiple scales, with applications ranging from healthcare monitoring to therapeutic options such as drug delivery and rehabilitation therapies. STATEMENT OF SIGNIFICANCE: An overview of the recent progress on the integration of the biological system with both electronic and mechanical assemblies is discussed. The integration creates the unique opportunity to simultaneously monitor and elicit the responses to the biological system, which provides a fundamental understanding of the interaction between the biological system and the electronic-mechanical assemblies. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual.

Micro-LEGO for MEMS

The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO.

Droplet-Mediated Deterministic Microtransfer Printing: Water as a Temporary Adhesive

Deterministic transfer printing of solid objects has been introduced and demonstrated, where capillary force based on water droplet has been utilized. Droplets on pickup head form capillary bridges with chips to be picked, where the capillarity provides enough force to grip or lift the chip. Release or printing of chips can be achieved by simply drying droplet while the chip is in contact with receiver substrate. That is, water droplet acts as a temporary adhesive, adheres onto solid chip by capillary force, and releases it upon drying. The technique has unique features such as self-alignment during pickup, self-correction on pickup head by short exposure to water mist, and pickup capability of solids having a nonflat, corrugated surface, all of which originated from the fluidic nature of water droplet. The technique has been successfully applied for the fabrication of stretchable micro-light-emitting diode chip arrays. The proposed technique can find wide applications in many fields such as displays, sensors, printed electronics, photovoltaics, etc.

Transfer Printing and its Applications in Flexible Electronic Devices

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

Rapidly tunable and highly reversible bio-inspired dry adhesion for transfer printing in air and a vacuum

Tunable and reversible dry adhesion has attracted much attention in academia and industry due to its wide applications ranging from releasable joints to stamps for transfer printing. Here, a simple yet robust magnetically actuated, aphid-inspired design of an elastomeric surface that provides rapidly tunable and highly reversible adhesion strength is reported. The magnetically actuated adhesive features open reservoirs filled with magnetic particles and encapsulated by a thin surface membrane, which can be deformed in a controlled manner via the magnetic field, thus, to tune the adhesion. The combination of the rate dependent effect and magnetic actuation of the thin surface membrane offers continuously tunable adhesion with a great switchability and a quick response. Experimental and theoretical studies reveal the underlying physics and provide design guidelines to optimize geometries for the broad control of adhesion. Demonstrations of this concept in stamps for transfer printing of silicon wafers in air and in a vacuum with a selective and programmable mode illustrate the capabilities for deterministic assembly and the potential in the semiconductor industry.

Tunable Adhesion for Bio-Integrated Devices

With the rapid development of bio-integrated devices and tissue adhesives, tunable adhesion to soft biological tissues started gaining momentum. Strong adhesion is desirable when used to efficiently transfer vital signals or as wound dressing and tissue repair, whereas weak adhesion is needed for easy removal, and it is also the essential step for enabling repeatable use. Both the physical and chemical properties (e.g., moisture level, surface roughness, compliance, and surface chemistry) vary drastically from the skin to internal organ surfaces. Therefore, it is important to strategically design the adhesive for specific applications. Inspired largely by the remarkable adhesion properties found in several animal species, effective strategies such as structural design and novel material synthesis were explored to yield adhesives to match or even outperform their natural counterparts. In this mini-review, we provide a brief overview of the recent development of tunable adhesives, with a focus on their applications toward bio-integrated devices and tissue adhesives.

Materials, Processes, and Facile Manufacturing for Bioresorbable Electronics: A Review

Bioresorbable electronics refer to a new class of advanced electronics that can completely dissolve or disintegrate with environmentally and biologically benign byproducts in water and biofluids. They have provided a solution to the growing electronic waste problem with applications in temporary usage of electronics such as implantable devices and environmental sensors. Bioresorbable materials such as biodegradable polymers, dissolvable conductors, semiconductors, and dielectrics are extensively studied, enabling massive progress of bioresorbable electronic devices. Processing and patterning of these materials are predominantly relying on vacuum-based fabrication methods so far. However, for the purpose of commercialization, nonvacuum, low-cost, and facile manufacturing/printing approaches are the need of the hour. Bioresorbable electronic materials are generally more chemically reactive than conventional electronic materials, which require particular attention in developing the low-cost manufacturing processes in ambient environment. This review focuses on material reactivity, ink availability, printability, and process compatibility for facile manufacturing of bioresorbable electronics.

Composite Microposts with High Dry Adhesion Strength

Interfaces with enhanced and tunable adhesion have applications in a broad range of fields, including microtransfer printing of semiconductors, grippers on robots, and component handling in manufacturing. Here, a composite post structure with a stiff core and a compliant shell is used to achieve an enhanced adhesion under normal loading. Loading the composite structure in shear significantly reduces the effective adhesion strength, thus providing tunability. The composite posts can be used as stamps in microtransfer printing processes or as building blocks of large-area tunable surfaces composed of arrays of posts. Experimental measurements on composite posts with diameters of 200 μm show a peak adhesion strength of 1.5 MPa, a 9 times enhancement in adhesion relative to a homogeneous post under normal loading, and also that the adhesion can be reduced by nearly a factor of 7 through the application of shear. The adhesion behavior of these composite structures was also examined using finite element analysis, which provides an understanding of the mechanics of detachment. Finally, the composite adhesive posts were used as stamps in a microtransfer printing process in which 5 μm thick silicon membranes were retrieved and subsequently printed.

Controllable load sharing for soft adhesive interfaces on three-dimensional surfaces

For adhering to three-dimensional (3D) surfaces or objects, current adhesion systems are limited by a fundamental trade-off between 3D surface conformability and high adhesion strength. This limitation arises from the need for a soft, mechanically compliant interface, which enables conformability to nonflat and irregularly shaped surfaces but significantly reduces the interfacial fracture strength. In this work, we overcome this trade-off with an adhesion-based soft-gripping system that exhibits enhanced fracture strength without sacrificing conformability to nonplanar 3D surfaces. Composed of a gecko-inspired elastomeric microfibrillar adhesive membrane supported by a pressure-controlled deformable gripper body, the proposed soft-gripping system controls the bonding strength by changing its internal pressure and exploiting the mechanics of interfacial equal load sharing. The soft adhesion system can use up to ∼26% of the maximum adhesion of the fibrillar membrane, which is 14× higher than the adhering membrane without load sharing. Our proposed load-sharing method suggests a paradigm for soft adhesion-based gripping and transfer-printing systems that achieves area scaling similar to that of a natural gecko footpad.

A Review of the State of Dry Adhesives: Biomimetic Structures and the Alternative Designs They Inspire

Robust and inexpensive dry adhesives would have a multitude of potential applications, but replicating the impressive adhesive organs of many small animals has proved challenging. A substantial body of work has been produced in recent years which has illuminated the many mechanical processes influencing a dry adhesive interface. The especially potent footpads of the tokay gecko have inspired researchers to develop and examine an impressive and diverse collection of artificial fibrillar dry adhesives, though study of tree frogs and insects demonstrate that successful adhesive designs come in many forms. This review discusses the current theoretical understanding of dry adhesive mechanics, including the observations from biological systems and the lessons learned by recent attempts to mimic them. Attention is drawn in particular to the growing contingent of work exploring ideas which are complimentary to or an alternative for fibrillar designs. The fundamentals of compliance control form a basis for dry adhesives made of composite and “smart,” stimuli-responsive materials including shape memory polymers. An overview of fabrication and test techniques, with a sampling of performance results, is provided.

CONTACT INSTABILITY OF NON-PLANAR ELASTOMERIC SURFACES

Contact surfaces between non-planar elastomers widely present in the industrial and biomedical fields, such as corrugated mats and biological fillers. Probing out the mechanical instability of these contact surfaces could greatly contribute to the efficiency, safety and durability of the related structures. In this paper, we numerically studied the contact instability of non-planar elastomeric surfaces with typical projections (i.e., circular and triangle projections) by proposing an instability criterion and using the finite element method. Moreover, we studied the effects of several key factors (e.g., the geometrical parameters and the friction coefficients of the surfaces) on the critical force of the mechanical instability. It is found that with comparable geometric sizes, the surface with circular projections is more effective to enhance the contact stability than that with triangle projections. A larger slope and curvature radius result in weaker stability while a larger friction coefficient plays a positive role for the stability. However, with increasing friction coefficient, the maximum force presents smaller and smaller changes and further improvement of contact stability mainly depends on the changes of the number of projections. These investigations may improve the understanding of the mechanical instability of non-planar elastomeric surfaces and contribute to achieve better designs of related structures.

Process, Design and Materials for Unidirectionally Tilted Polymeric Micro/Nanohairs and Their Adhesion Characteristics

Recent research in the field of gecko-inspired dry adhesive has focused on modifying the material and structural properties of polymer-based nanohairs. Polymers such as polystyrene (PS), high-density polyethylene (HDPE), ultraviolet curable epoxy (SU-8), polyurethane acrylate (PUA), polycarbonate (PC), and polydimethyl siloxane (PDMS) can fulfill many mechanical property requirements, are easily tunable, and can be produced via large-scale fabrication. However, the fabrication process for tilted structure remains challenging. The tilted structure is a crucial factor in high-degree conformal contact, which facilitates high adhesion, low effective modulus, and directional adhesion properties. Recent studies have attempted to create a tilted structure by applying beam irradiation, mechanical and thermal stress, and magnetic fields. This review provides a comprehensive investigation into advanced strategies for producing tilted polymeric nanostructures and their potential applications in the near future.

Adhesiveless Transfer Printing of Ultrathin Microscale Semiconductor Materials by Controlling the Bending Radius of an Elastomeric Stamp

High-performance electronic devices integrated onto unconventional substrates provide opportunities for use in diverse applications, such as wearable or implantable forms of electronic devices. However, the interlayer adhesives between the electronic devices and substrates often limit processing temperature or cause electrical or thermal resistance at the interface. This paper introduces a very simple but effective transfer printing method that does not require an interlayer adhesive. Controlling the bending radius of a simple flat stamp enables picking up or printing of microscale semiconductor materials onto rigid, curvilinear, or flexible surfaces without the aid of a liquid adhesive. Theoretical and experimental studies reveal the underlying mechanism of the suggested approach. Adhesiveless printing of thin Si plates onto diverse substrates demonstrates the capability of this method.

Understanding Surface Adhesion in Nature: A Peeling Model

Nature often exhibits various interesting and unique adhesive surfaces. The attempt to understand the natural adhesion phenomena can continuously guide the design of artificial adhesive surfaces by proposing simplified models of surface adhesion. Among those models, a peeling model can often effectively reflect the adhesive property between two surfaces during their attachment and detachment processes. In the context, this review summarizes the recent advances about the peeling model in understanding unique adhesive properties on natural and artificial surfaces. It mainly includes four parts: a brief introduction to natural surface adhesion, the theoretical basis and progress of the peeling model, application of the peeling model, and finally, conclusions. It is believed that this review is helpful to various fields, such as surface engineering, biomedicine, microelectronics, and so on.

Fracture and adhesion of soft materials: a review

Soft materials are materials with a low shear modulus relative to their bulk modulus and where elastic restoring forces are mainly of entropic origin. A sparse population of strong bonds connects molecules together and prevents macroscopic flow. In this review we discuss the current state of the art on how these soft materials break and detach from solid surfaces. We focus on how stresses and strains are localized near the fracture plane and how elastic energy can flow from the bulk of the material to the crack tip. Adhesion of pressure-sensitive-adhesives, fracture of gels and rubbers are specifically addressed and the key concepts are pointed out. We define the important length scales in the problem and in particular the elasto-adhesive length Γ/E where Γ is the fracture energy and E is the elastic modulus, and how the ratio between sample size and Γ/E controls the fracture mechanisms. Theoretical concepts bridging solid mechanics and polymer physics are rationalized and illustrated by micromechanical experiments and mechanisms of fracture are described in detail. Open questions and emerging concepts are discussed at the end of the review.

High Fidelity Tape Transfer Printing Based On Chemically Induced Adhesive Strength Modulation

Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system. To ensure a reliable process, strong adhesion for picking up and weak or no adhesion for printing are required. However, it is challenging to meet the requirements of switchable stamp adhesion. Here we introduce a simple, high fidelity process, namely tape transfer printing (TTP), enabled by chemically induced dramatic modulation in tape adhesive strength. We describe the working mechanism of the adhesion modulation that governs this process and demonstrate the method by high fidelity tape transfer printing several types of materials and devices, including Si pellets arrays, photodetector arrays, and electromyography (EMG) sensors, from their preparation substrates to various alien substrates. High fidelity tape transfer printing of components onto curvilinear surfaces is also illustrated.

Highly durable and unidirectionally stooped polymeric nanohairs for gecko-like dry adhesive

Gecko-like dry adhesive using high aspect ratio polymeric nanohairs has insuperable limitations, although it has huge potential in many applications. Repeated harsh contacts on a target substrate lead to physical collapse of nanohairs and significant degradation of the adhesion property, because the polymeric nanohairs are quite fragile due to poor mechanical robustness. Herein, we demonstrate a highly robust gecko-like dry adhesive with unidirectionally stooped polymeric nanohairs (diameter 100 nm) with a high aspect ratio (∼9) using an ultrathin metal coating. 100 cycles of repeated adhesion tests with 1 N preloading force did not significantly degrade adhesion or cause collapse of nanohairs. We believe that this approach allows gecko-like dry adhesive to be utilized in many related applications and diverse industry interests.

Roll-to-roll continuous patterning and transfer of graphene via dispersive adhesion

We present a roll-to-roll, continuous patterning and transfer of graphene sheets capable of residue-free and fast patterning. The graphene sheet is supported with dispersive adhesion. Graphene is continuously patterned by the difference in adhesion forces with a pre-defined embossed roller. The patterned graphene sheet adheres to the polyethylene terephthalate (PET)/silicone with very low strength and can be easily transferred to various substrates without the aid of any heating mechanism. The width of the patterned film was 120 mm and a production rate of 15 m min(-1) for patterning was achieved. Large-area uniformity was confirmed by observing the optical images on 4 inch Si wafer and Raman mapping spectra for 50 × 50 mm(2).

Harnessing tunable scanning probe techniques to measure shear enhanced adhesion of gecko-inspired fibrillar arrays

The hierarchical arrays of mesoscale to nanoscale fibrillar structures on a gecko's foot enable the animal to climb surfaces of varying roughness. Adhesion force between the fibrillar structures and various surfaces is maximized after the gecko drags its foot in one direction, which has also been demonstrated to improve the adhesion forces of artificial fibrillar arrays. Essential conditions that influence the magnitude of these interactions include the lateral distance traveled and velocity between the contacting surfaces, as well as the velocity at which the two surfaces are subsequently separated. These parameters have, however, not been systematically investigated to assess the adhesion properties of artificial adhesives. We introduce a systematic study that investigates these conditions using a scanning probe microscope to measure the adhesion forces of artificial adhesives through a process that mimics the mechanism by which a gecko climbs. The measured adhesion response was different for arrays of shorter and longer fibrils. These results from 9000 independent measurements also provide further insight into the dynamics of the interactions between fibrillar arrays and contacting surfaces. These studies establish scanning probe microscopy techniques as a versatile approach for measuring a variety of adhesion properties of artificial fibrillar adhesives.

Metal-etching-free direct delamination and transfer of single-layer graphene with a high degree of freedom

A method of graphene transfer without metal etching is developed to minimize the contamination of graphene in the transfer process and to endow the transfer process with a greater degree of freedom. The method involves direct delamination of single-layer graphene from a growth substrate, resulting in transferred graphene with nearly zero Dirac voltage due to the absence of residues that would originate from metal etching. Several demonstrations are also presented to show the high degree of freedom and the resulting versatility of this transfer method.

Complex nonlinear dynamics in the limit of weak coupling of a system of microcantilevers connected by a geometrically nonlinear tunable nanomembrane

Intentional utilization of geometric nonlinearity in micro/nanomechanical resonators provides a breakthrough to overcome the narrow bandwidth limitation of linear dynamic systems. In past works, implementation of intentional geometric nonlinearity to an otherwise linear nano/micromechanical resonator has been successfully achieved by local modification of the system through nonlinear attachments of nanoscale size, such as nanotubes and nanowires. However, the conventional fabrication method involving manual integration of nanoscale components produced a low yield rate in these systems. In the present work, we employed a transfer-printing assembly technique to reliably integrate a silicon nanomembrane as a nonlinear coupling component onto a linear dynamic system with two discrete microcantilevers. The dynamics of the developed system was modeled analytically and investigated experimentally as the coupling strength was finely tuned via FIB post-processing. The transition from the linear to the nonlinear dynamic regime with gradual change in the coupling strength was experimentally studied. In addition, we observed for the weakly coupled system that oscillation was asynchronous in the vicinity of the resonance, thus exhibiting a nonlinear complex mode. We conjectured that the emergence of this nonlinear complex mode could be attributed to the nonlinear damping arising from the attached nanomembrane.

Elastomeric angled microflaps with reversible adhesion for transfer-printing semiconductor membranes onto dry surfaces

Recent research for unconventional types of electronics has revealed that it is necessary to transfer-print high-performance microelectronic devices onto diverse surfaces, including flexible or stretchable surfaces, to relieve mechanical constraints associated with conventional rigid electronics. Picking up and placing ultrathin microdevices without damage are critical procedures for the successful manufacture of various types of unconventional electronics. This paper introduces elastomeric angled microflaps that have reversible adhesion; i.e., they generate higher adhesion for picking up and low adhesion for printing because of their structural shapes and viscoelastic material properties. The microstructured stamp, fabricated in relatively simple ways, enables simultaneous transfer-printing of multiple silicon membranes that have irregular shapes in sizes ranging from micrometer to millimeter scales. Mechanical characterizations by experiment reveal optimal parameters for picking up and placing ultrathin membranes on a programmable custom-built microstage. Further refinement of the structures and materials should be useful for many applications requiring the microassembly of multiple semiconductor membranes in diverse shapes and sizes on dry surfaces without the aid of liquid adhesives.

Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays

Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional 'geckoprinted' microelectronic devices provides a proof of concept of our results in practical applications.

Soft grippers using micro-fibrillar adhesives for transfer printing

The adhesive characteristics of fibrillar adhesives on a soft deformable membrane are reported. A soft gripper with an inflatable membrane covered by elastomer mushroom-shaped microfibers have a superior conformation to non-planar 3D part geometries, enabling the transfer printing of various parts serially or in parallel.

Gecko-inspired bidirectional double-sided adhesives

A new concept of gecko-inspired double-sided adhesives (DSAs) is presented. The DSAs, constructed by dual-angled (i.e. angled base and angled tip) micro-pillars on both sides of the backplane substrate, are fabricated by combinations of angled etching, mould replication, tip modification, and curing bonding. Two types of DSA, symmetric and antisymmetric (i.e. pillars are patterned symmetrically or antisymmetrically relative to the backplane), are fabricated and studied in comparison with the single-sided adhesive (SSA) counterparts through both non-conformal and conformal tests. Results indicate that the DSAs show controllable and bidirectional adhesion. Combination of the two pillar-layers can either amplify (for the antisymmetric DSA, providing a remarkable and durable adhesion capacity of 25.8 ± 2.8 N cm⁻² and a high anisotropy ratio of ∼8) or counteract (for the symmetric DSA, generating almost isotropic adhesion) the adhesion capacity and anisotropic level of one SSA (capacity of 16.2 ± 1.7 N cm⁻² and anisotropy ratio of ∼6). We demonstrate that these two DSAs can be utilized as a facile fastener for two individual objects and a small-scale delivery setup, respectively, complementing the functionality of the commonly studied SSA. As such, the double-sided patterning is believed to be a new branch in the further development of biomimetic dry adhesives.

Fabrication and characterization of thermoplastic elastomer dry adhesives with high strength and low contamination

Polydimethylsiloxane (PDMS) and polyurethane elastomers have commonly been used to manufacture mushroom shaped gecko-inspired dry adhesives with high normal adhesion strength. However, the thermosetting nature of these two materials severely limits the commercial viability of their manufacturing due to long curing times and high material costs. In this work, we introduce poly(styrene-ethylene/butylene-styrene) (SEBS) thermoplastic elastomers as an alternative for the manufacture of mushroom shaped dry adhesives with both directional and nondirectional performance. These materials are attractive for their potential to be less contaminating via oligomer transfer than thermoset elastomers, as well as being more suited to mass manufacturing. Low material transfer properties are attractive for adhesives that could potentially be used in cleanroom environments for microscale assembly and handling in which device contamination is a serious concern. We characterized a thermoplastic elastomer in terms of oligomer transfer using X-ray photoelectron spectroscopy and found that the SEBS transfers negligible amounts of its own oligomers, during contact with a gold-coated silicon surface, which may be representative of the metallic bond pads found in micro-electro-mechanical systems devices. We also demonstrate the fabrication of mushroom shaped isotropic and anisotropic adhesive fibers with two different SEBS elastomer grades using thermocompression molding and characterize the adhesives in terms of their shear-enhanced normal adhesion strength. The overall adhesion of one of the thermoplastic elastomer adhesives was found to be stronger or comparable to their polyurethane counterparts with identical dimensions.

Anisotropic dry adhesive via cap defects

We demonstrate how introducing a deliberate defect on the overhanging caps of strongly adhering mushroom shaped dry adhesive fibers can produce directional adhesion behavior. We find that the shape and location of this defect controls both the total adhesion force and the degree of directionality for these bio-inspired adhesives. Linear beam theory is used to demonstrate how the application of a shear load to a fiber in tension can create a small compressive load to an asymmetric crack, thereby delaying adhesion failure and producing directional adhesion, and the theory is confirmed with finite element models and empirical data. Anisotropic adhesives have been fabricated and tested and can demonstrate normal adhesion force up to ~250 kPa with a shear displacement of 15 µm away from the defect and as small as ~5 kPa when sheared the same amount towards the defect.

Controllable interfacial adhesion applied to transfer light and fragile objects by using gecko inspired mushroom-shaped pillar surface

Gecko-inspired surfaces are smart dry adhesive surfaces that have attracted much attention because of their wide range of potential applications. However, strong frictional force, rather than adhesive force, is frequently targeted in most of research in this area. In this study, the interfacial adhesive and frictional properties of a gecko-inspired mushroom-shaped polyurethane pillar array surface have been systematically characterized to design and control the interfacial adhesion of the surface by considering the nanoscale interfacial adhesion, the microscale structural compliance and deformation, and the macro-scale actuation. Matching the movement of the leg springs and the interfacial adhesive characteristics between the pillar array surfaces and substrates, a three-legged clamp prototype has been designed and fabricated to successfully pick up and release light and fragile objects with a smooth upper surface, such as a silicon wafer. These results provide a new insight into not only the theoretical understanding of the integrating adhesion mechanisms, but also the practical applications of utilizing and controlling the adhesive and frictional forces of gecko-inspired surfaces.

Intelligent materials with adaptive adhesion properties based on comb-like polymer brushes

We investigated the adaptive adhesion properties of comb-like random copolymer brushes made of poly(ethylene glycol) (PEG)-poly(dimethylsiloxane) (PDMS) grafted on flat and rough substrates. The properties of the brush layers were investigated using ARXPS, contact angle, electrokinetics, null ellipsometry, and adhesion measurements. It was found that hydrophobic PDMS segments segregate at the brush topmost layer in the dry state. However, hydrophilic PEG chains segregate at the brush topmost layer in the wet state. The adhesion properties of fabricated materials were tested using the AFM colloid probe technique and probe tack tester. It was found that the adhesive properties depend strongly on the mechanical properties (stiff/soft) and chemical functionality (hydrophobicity/hydrophilicity) of the applied adhesion tester as well as on the chemical composition, surface roughness, and thickness of the brush. In particular, hydrophobic PDMS and hydrophilic PEG adhere more strongly to hydrophobically modified and hydrophilic native colloid probes, respectively. Thick brushes are more adhesive than thin ones, and brushes grafted to flat substrates are stickier than those grafted to rough substrates when measured with a hard AFM probe. Unlike the results of adhesion measurements performed using hard AFM probes, the PDMS surface probed by soft pressure-sensitive adhesives (PSA) is almost nonadhesive. However, PEG is strongly adhesive, and the adhesion increases with the PEG fraction in the brush when probed by both hydrophilic and hydrophobic soft adhesives. The surfaces roughness also has a considerable effect on adhesion. Contrary to the adhesion measurements performed by hard AFM colloid probes, the adhesion of rough surfaces measured with a soft PAA or SIS tack tester is greater than that on the corresponding flat one.