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Luo F, Cui W, Zou Y, Li H, Qian Q, Chen Q. Recyclable and elastic highly thermally conductive epoxy-based composites with covalent-noncovalent interpenetrating networks. MATERIALS HORIZONS 2024; 11:3386-3395. [PMID: 38689529 DOI: 10.1039/d4mh00382a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/02/2024]
Abstract
High-power electronic architectures and devices require elastic thermally conductive materials. The use of epoxy resin in thermal management is limited due to its rigidity. Here, based on epoxy vitrimer, flexible polyethylene glycol (PEG) chains are introduced into covalent adaptable networks to construct covalent-noncovalent interpenetrating networks, enabling the elasticity of epoxy resins. Compared to traditional silicone-based thermal interface materials, the newly developed elastic epoxy resin shows the advantages of reprocessability, self-healing, and no small molecule release. Results show that, even after being filled with boron nitride and liquid metal, the material maintains its resilience, reprocessability and self-healing properties. Leveraging these characteristics, the composite can be further processed into thin films through a repeated pressing-rolling technique that facilitates the forced orientation of the fillers. Subsequently, the bulk composites are reconstructed using a film-stacking method. The results indicate that the thermal conductivity of the reconstructed bulk composite reaches 3.66 W m-1 K-1, achieving a 68% increase compared to the composite prepared through blending. Due to the existence of covalent adaptable networks, the inorganic and inorganic components of the composite prepared in this work can be completely separated under mild conditions, realizing closed-loop recycling.
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Affiliation(s)
- Fubin Luo
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
| | - Wenqi Cui
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Yingbing Zou
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Hongzhou Li
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Qingrong Qian
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Qinghua Chen
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
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Kumar V, Alam MN, Park SS. Review of Recent Progress on Silicone Rubber Composites for Multifunctional Sensor Systems. Polymers (Basel) 2024; 16:1841. [PMID: 39000697 PMCID: PMC11244113 DOI: 10.3390/polym16131841] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/07/2024] [Revised: 06/24/2024] [Accepted: 06/25/2024] [Indexed: 07/17/2024] Open
Abstract
The latest progress (the year 2021-2024) on multifunctional sensors based on silicone rubber is reported. These multifunctional sensors are useful for real-time monitoring through relative resistance, relative current change, and relative capacitance types. The present review contains a brief overview and literature survey on the sensors and their multifunctionalities. This contains an introduction to the different functionalities of these sensors. Following the introduction, the survey on the types of filler or rubber and their fabrication are briefly described. The coming section deals with the fabrication methodology of these composites where the sensors are integrated. The special focus on mechanical and electro-mechanical properties is discussed. Electro-mechanical properties with a special focus on response time, linearity, and gauge factor are reported. The next section of this review reports the filler dispersion and its role in influencing the properties and applications of these sensors. Finally, various types of sensors are briefly reported. These sensors are useful for monitoring human body motions, breathing activity, environment or breathing humidity, organic gas sensing, and, finally, smart textiles. Ultimately, the study summarizes the key takeaway from this review article. These conclusions are focused on the merits and demerits of the sensors and are followed by their future prospects.
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Affiliation(s)
- Vineet Kumar
- School of Mechanical Engineering, Yeungnam University, 280 Daehak-Ro, Gyeongsan 38541, Gyeongbuk, Republic of Korea
| | - Md Najib Alam
- School of Mechanical Engineering, Yeungnam University, 280 Daehak-Ro, Gyeongsan 38541, Gyeongbuk, Republic of Korea
| | - Sang Shin Park
- School of Mechanical Engineering, Yeungnam University, 280 Daehak-Ro, Gyeongsan 38541, Gyeongbuk, Republic of Korea
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Chen T, Liu L, Han L, Yu X, Tang X, Li W, Qian Z, Li J, Gan G. Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024; 40:12059-12069. [PMID: 38818697 DOI: 10.1021/acs.langmuir.4c00830] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/01/2024]
Abstract
The growing use of high-power and integrated electronic devices has created a need for thermal conductive adhesives (TCAs) with high thermal conductivity (TC) to manage heat dissipation at the interface. However, TCAs are often limited by contact thermal resistance at the interface between materials. In this study, we synthesized MXene@Ag composites through a direct in situ reduction process. The Ag nanoparticles (Ag NPs) generated by the reduction of the MXene interlayer and surface formed effective thermally conductive pathways with Ag flakes within an epoxy resin matrix. Various characterization analyses revealed that adding MXene@Ag composites at a concentration of 3 wt % resulted in a remarkable TC of 40.80 W/(m·K). This value is 8.77 times higher than that achieved with Ag flakes and 7.9 times higher than with MXene filler alone. The improved TC is attributed to the sintering of the in situ reduced Ag NPs during the curing process, which formed a connection between MXene (a highly conductive material) and the Ag flakes, thereby reducing contact thermal resistance. This reduction in contact thermal resistance significantly enhanced the TC of the thermal interface materials (TIMs). This study presents a novel approach for developing materials with exceptionally high TC, opening new possibilities for the design and fabrication of advanced thermal management systems.
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Affiliation(s)
- Tao Chen
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
| | - Li Liu
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
- School of Electronic Information and Electrical Engineering, Chongqing University of Arts and Sciences, Chongqing 402160, People's Republic of China
| | - Liping Han
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
| | - Xianglei Yu
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
| | - Xianjie Tang
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
| | - Weichao Li
- R&D Center of Yunnan Tin Group (Holding) Co., Ltd., Kunming 650108, People's Republic of China
| | - Zhuo Qian
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
| | - Junpeng Li
- Kunming Institute of Precious Metals State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Kunming 650106, People's Republic of China
- Sino-Platinum Metals Co. Ltd., Kunming 650106, People's Republic of China
| | - Guoyou Gan
- Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093, People's Republic of China
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Dai W, Wang Y, Li M, Chen L, Yan Q, Yu J, Jiang N, Lin CT. 2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024:e2311335. [PMID: 38847403 DOI: 10.1002/adma.202311335] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/28/2023] [Revised: 05/23/2024] [Indexed: 06/27/2024]
Abstract
The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.
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Affiliation(s)
- Wen Dai
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Yandong Wang
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Maohua Li
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Lu Chen
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Qingwei Yan
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Jinhong Yu
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Nan Jiang
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Cheng-Te Lin
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
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Wu K, An D, Zhang Z, Zhao G, Cui C, Zhou F, Li J. Relief of Residual Stress in Bulk Thermosets in the Glassy State by Local Bond Exchange. Macromol Rapid Commun 2024; 45:e2300735. [PMID: 38281084 DOI: 10.1002/marc.202300735] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/22/2023] [Revised: 01/24/2024] [Indexed: 01/29/2024]
Abstract
The covalently cross-linked network gives thermosets superior thermal, mechanical, and electrical properties, which, however, squarely makes the large residual stress that is inevitably induced during preparation hardly relieved in the glassy state. In this work, an incredible reduction in residual stress is successfully achieved in bulk thermosets in the glassy state through introducing highly dynamic thiocarbamate bonds by "click" reactions of thiols and isocyanates. Due to the excellent dynamic behaviors of thiocarbamate bonds, local network rearrangement is achieved through thermal stimulation, while the strong 3D cross-linked network is well maintained. Ultimately, a decrease by 44% in residual stress is detected by simply annealing samples at 30 °C below glass transition temperature (Tg), during which they could well maintain more than 98.4% of the storage modulus. After the annealing, more uniform residual stress distribution is also observed, showing a 32% decline in sample standard deviation. However, the residual stress of epoxy resin, a typical thermoset as a reference, changes little even after annealing at Tg. The results prove it a feasible strategy to reduce residual stress in bulk thermosets in the glassy state by introducing proper dynamic covalent bonds.
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Affiliation(s)
- Kangning Wu
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Dongxu An
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Zhuolin Zhang
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Ge Zhao
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Chenhui Cui
- School of Chemistry, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Fusheng Zhou
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Jianying Li
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, 710049, China
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Han Y, Ruan K, He X, Tang Y, Guo H, Guo Y, Qiu H, Gu J. Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption. Angew Chem Int Ed Engl 2024; 63:e202401538. [PMID: 38334210 DOI: 10.1002/anie.202401538] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/22/2024] [Revised: 02/05/2024] [Accepted: 02/08/2024] [Indexed: 02/10/2024]
Abstract
The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application of 5G communication technology in military fields. This work uses aramid nanofibers (ANF) as the matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by in situ growth as fillers, which are combined to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted as BAB) composite films by "filtration self-assembly, air spraying, and hot-pressing" method. When the mass ratio of AgNWs@BNNS to BNNS is 1 : 1 and the total mass fraction is 50 wt %, BAB composite film has the maximum in-plane thermal conductivity coefficient (λ∥ of 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength and volume resistivity of 41.5 kV/mm and 1.21×1015 Ω ⋅ cm, respectively) and mechanical properties (tensile strength of 170.9 MPa). 50 wt % BAB composite film could efficiently reduce the equilibrium temperature of the central processing unit (CPU) working at full power, resulting in 7.0 °C lower than that of the CPU solely integrated with ANF directly. In addition, BAB composite film boasts adaptive visible light/infrared dual camouflage properties on cement roads and jungle environments, as well as the function of fast encryption of QR code information within 24 seconds.
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Affiliation(s)
- Yixin Han
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Kunpeng Ruan
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Xiaoyu He
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Yusheng Tang
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Hua Guo
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Yongqiang Guo
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Hua Qiu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Junwei Gu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
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Zheng S, Xue H, Liu Y, Yu X, Cao Z. Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024; 20:e2306750. [PMID: 38044278 DOI: 10.1002/smll.202306750] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/07/2023] [Revised: 11/08/2023] [Indexed: 12/05/2023]
Abstract
Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high-performance TIM inspired by alveoli is proposed. The material design includes the self-alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) -the alveoli; and a small amount of liquid metal (LM) - capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m-1 K-1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long-term applications. The thermally conductive, soft, and lightweight composites are believed to be high-performance silicone bases TIMs for advanced electronics.
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Affiliation(s)
- Sijia Zheng
- Key Laboratory of Advanced Textile Materials and Manufacturing Technology and Engineering Research Center for Eco-Dyeing & Finishing of Textiles, Ministry of Education, Zhejiang Provincial Engineering Research Center for Green and Low-carbon Dyeing & Finishing, Zhejiang Sci-Tech University, Hangzhou, 310018, China
| | - Haiyan Xue
- Key Laboratory of Advanced Textile Materials and Manufacturing Technology and Engineering Research Center for Eco-Dyeing & Finishing of Textiles, Ministry of Education, Zhejiang Provincial Engineering Research Center for Green and Low-carbon Dyeing & Finishing, Zhejiang Sci-Tech University, Hangzhou, 310018, China
| | - Ying Liu
- Key Laboratory of Advanced Textile Materials and Manufacturing Technology and Engineering Research Center for Eco-Dyeing & Finishing of Textiles, Ministry of Education, Zhejiang Provincial Engineering Research Center for Green and Low-carbon Dyeing & Finishing, Zhejiang Sci-Tech University, Hangzhou, 310018, China
| | - Xing Yu
- Department of Thyroid Surgery, The Second Affiliated Hospital, Zhejiang University School of Medicine, Hangzhou, 310018, China
| | - Zhihai Cao
- Key Laboratory of Advanced Textile Materials and Manufacturing Technology and Engineering Research Center for Eco-Dyeing & Finishing of Textiles, Ministry of Education, Zhejiang Provincial Engineering Research Center for Green and Low-carbon Dyeing & Finishing, Zhejiang Sci-Tech University, Hangzhou, 310018, China
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8
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Yang L, Ding A, Xu M, Li Y, Zhao X, Peng J, Li X. Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model. Polymers (Basel) 2024; 16:930. [PMID: 38611188 PMCID: PMC11013115 DOI: 10.3390/polym16070930] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/06/2024] [Revised: 03/22/2024] [Accepted: 03/26/2024] [Indexed: 04/14/2024] Open
Abstract
To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress-strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin's viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.
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Affiliation(s)
- Lin Yang
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China; (L.Y.); (A.D.); (M.X.); (J.P.)
| | - Anxin Ding
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China; (L.Y.); (A.D.); (M.X.); (J.P.)
| | - Mi Xu
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China; (L.Y.); (A.D.); (M.X.); (J.P.)
| | - Yuefang Li
- Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China; (Y.L.); (X.Z.)
| | - Xianhang Zhao
- Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China; (Y.L.); (X.Z.)
| | - Jingxuan Peng
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China; (L.Y.); (A.D.); (M.X.); (J.P.)
| | - Xiang Li
- Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China; (Y.L.); (X.Z.)
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Meng Y, Yang D, Jiang X, Bando Y, Wang X. Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges. NANOMATERIALS (BASEL, SWITZERLAND) 2024; 14:331. [PMID: 38392704 PMCID: PMC10893155 DOI: 10.3390/nano14040331] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/21/2023] [Revised: 02/02/2024] [Accepted: 02/05/2024] [Indexed: 02/24/2024]
Abstract
With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.
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Affiliation(s)
- Yuhang Meng
- National Laboratory of Solid State Microstructures (NLSSM), Collaborative Innovation Center of Advanced Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China
| | - Dehong Yang
- National Laboratory of Solid State Microstructures (NLSSM), Collaborative Innovation Center of Advanced Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China
| | - Xiangfen Jiang
- State Key Laboratory of Mechanics and Control of Mechanical Structures, Key Laboratory for Intelligent Nano Materials and Devices of the Ministry of Education, College of Material Science and Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
| | - Yoshio Bando
- Chemistry Department, College of Science, King Saud University, Riyadh 11451, Saudi Arabia
- Australian Institute for Innovative Materials, University of Wollongong, Wollongong, NSW 2500, Australia
| | - Xuebin Wang
- National Laboratory of Solid State Microstructures (NLSSM), Collaborative Innovation Center of Advanced Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China
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10
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Sun Z, Yu H, Feng Y, Feng W. Application and Development of Smart Thermally Conductive Fiber Materials. NANOMATERIALS (BASEL, SWITZERLAND) 2024; 14:154. [PMID: 38251119 PMCID: PMC10821028 DOI: 10.3390/nano14020154] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/15/2023] [Revised: 01/05/2024] [Accepted: 01/08/2024] [Indexed: 01/23/2024]
Abstract
In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.
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Affiliation(s)
| | | | | | - Wei Feng
- Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China; (Z.S.); (H.Y.); (Y.F.)
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11
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Behroozi Kohlan T, Atespare AE, Yildiz M, Menceloglu YZ, Unal S, Dizman B. Amphiphilic Polyoxazoline Copolymer-Imidazole Complexes as Tailorable Thermal Latent Curing Agents for One-Component Epoxy Resins. ACS OMEGA 2023; 8:47173-47186. [PMID: 38107921 PMCID: PMC10720278 DOI: 10.1021/acsomega.3c07177] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 09/19/2023] [Revised: 10/29/2023] [Accepted: 11/16/2023] [Indexed: 12/19/2023]
Abstract
One-component epoxy resins (OCERs) are proposed to overcome the energy inefficiency and processing difficulties of conventional two-component epoxy resins by employing latent curing agents, specifically thermal latent curing agents (TLCs). Despite recent progress, the need for TLCs with a simple preparation method for different curing agents, epoxy resins, and process conditions remains. Here, tailorable TLCs were prepared by forming complexes between imidazole (Im) and amphiphilic polyoxazoline copolymers with tunable structures and properties by a solvent evaporation method. The obtained TLCs were manually mixed with DGEBA to prepare OCERs. The miscibility of the complexes with DGEBA was studied, considering the functionalities of copolymers. The curing behaviors of TLCs were compared using dynamic Differential Scanning Calorimetry (DSC) studies considering the side chain and composition of the copolymers, copolymer:Im ratio, and concentration of Im in DGEBA. The curing behavior of the promising OCERs was studied by isothermal DSC studies to investigate their stability at different temperatures and curing rate at elevated temperatures revealing the stability of these OCERs.
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Affiliation(s)
- Taha Behroozi Kohlan
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
| | - Asu Ece Atespare
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
| | - Mehmet Yildiz
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
| | - Yusuf Ziya Menceloglu
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
| | - Serkan Unal
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
| | - Bekir Dizman
- Integrated
Manufacturing Technologies Research and Application Center & Composite
Technologies Center of Excellence, Sabanci
University, Istanbul 34956, Turkey
- Faculty
of Engineering and Natural Sciences, Materials Science and Nano Engineering, Sabanci University, Istanbul 34956, Turkey
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12
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Tian W, Zhang S, Li W, Chen Y, Zhao J, Xin F, Qian Y, Li W. Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process. MICROMACHINES 2023; 14:2175. [PMID: 38138343 PMCID: PMC10745373 DOI: 10.3390/mi14122175] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/26/2023] [Revised: 11/21/2023] [Accepted: 11/28/2023] [Indexed: 12/24/2023]
Abstract
Plastic packaging has shown its advantages over ceramic packaging and metal packaging in lightweight, thin, and high-density electronic devices. In this paper, the reliability and moisture diffusion of Sop-8 (Small Out-Line Package-8) plastic packaging devices are studied, and we put forward a set of complete optimization methods. Firstly, we propose to improve the reliability of plastic packaging devices by reducing the amount of cavitation and warpage deformation. Structural and process factors were investigated in the injection molding process. An orthogonal experiment design was used to create 25 groups of simulation experiments, and Moldflow software was used to simulate the flow mode analysis. Then, the simulation results are subjected to range analysis and comprehensive weighted score analysis. Finally, different optimization methods are proposed according to different production conditions, and each optimization method can reduce cavitation or warpage by more than 9%. The moisture diffusion of the Sop-8 plastic packing devices was also investigated at the same time. It was determined that the contact surface between the lead frame and the plastic packaging material was more likely to exhibit delamination under the condition of MSL2 moisture diffusion because the humidity gradient was easily produced at the crucial points of different materials. The diffusion of moisture is related to the type of plastic packaging material and the diffusion path.
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Affiliation(s)
- Wenchao Tian
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
| | - Shuaiqi Zhang
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
| | - Wenbin Li
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
| | - Yuanming Chen
- Sharetek Industrial Equipment Co., Ltd., Shanghai 201109, China; (Y.C.); (J.Z.)
| | - Jingrong Zhao
- Sharetek Industrial Equipment Co., Ltd., Shanghai 201109, China; (Y.C.); (J.Z.)
| | - Fei Xin
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
| | - Yingying Qian
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
| | - Wenhua Li
- Key Laboratory of Electronic Equipment Structure Design (MOE), School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China; (S.Z.); (W.L.); (F.X.); (Y.Q.); (W.L.)
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13
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Jia LC, Wang ZX, Wang L, Zeng JF, Du PY, Yue YF, Zhao LH, Jia SL. Self-standing boron nitride bulks enabled by liquid metals for thermal management. MATERIALS HORIZONS 2023; 10:5656-5665. [PMID: 37766462 DOI: 10.1039/d3mh01359f] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/29/2023]
Abstract
Thermally conductive materials (TCMs) are highly desirable for thermal management applications to tackle the "overheating" concerns in the electronics industry. Despite recent progress, the development of high performance TCMs integrated with an in-plane thermal conductivity (TC) higher than 50.0 W (m K)-1 and a through-plane TC greater than 10.0 W (m K)-1 is still challenging. Herein, self-standing liquid metal@boron nitride (LM@BN) bulks with ultrahigh in-plane TC and through-plane TC were reported for the first time. In the LM@BN bulks, LM could serve as a bonding and thermal linker among the oriented BN platelets, thus remarkably accelerating heat transfer across the whole system. Benefiting from the formation of a unique structure, the LM@BN bulk achieved an ultrahigh in-plane TC of 82.2 W (m K)-1 and a through-plane TC of 20.6 W (m K)-1, which were among the highest values ever reported for TCMs. Furthermore, the LM@BN bulks exhibited superior compressive and leakage-free performances, with a high compressive strength (5.2 MPa) and without any LM leakage even after being crushed. It was also demonstrated that the excellent TCs of the LM@BN bulks made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway for the development of high-performance TCMs for thermal management in the electronics industry.
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Affiliation(s)
- Li-Chuan Jia
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Zhi-Xing Wang
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Lei Wang
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Jian-Feng Zeng
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Pei-Yao Du
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Yun-Fei Yue
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Li-Hua Zhao
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
| | - Shen-Li Jia
- College of Electrical Engineering, Sichuan University, Chengdu 610065, China.
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14
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Jiang T, Xu K, Wang Y, Xiang L, Tang B, Shi S, Li Y, Yu W, Xie H, Wu X, Li W, Sun K, Fan R, Yu J. In Situ Construction of High-Thermal-Conductivity and Negative-Permittivity Epoxy/Carbon Fiber@Carbon Composites with a 3D Network by High-Temperature Chemical Vapor Deposition. ACS APPLIED MATERIALS & INTERFACES 2023; 15:54027-54038. [PMID: 37938033 DOI: 10.1021/acsami.3c15040] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/09/2023]
Abstract
Modern highly integrated microelectronic devices are unable to dissipate heat over time, which greatly affects the operating efficiency and service life of electronic equipment. Constructing high-thermal-conductivity composites with 3D network structures is a hot research topic. In this article, carbon fiber felt (CFF) was prepared by airflow netting forming technology and needle punching combined with stepped heat treatment. Then, carbon-coated carbon fiber felt (C@CFF) with a three-dimensional network structure was constructed in situ by high-temperature chemical vapor deposition (CVD). Finally, high-temperature treatment was used to improve the degree of crystallinity of C@CFF and further enhance its graphitization. The epoxy (EP) composites were prepared by simple vacuum infiltration-molding curing. The test results showed that the in-plane thermal conductivity (K∥) and through-plane thermal conductivity (K⊥) of EP/C@CFF-2300 °C could reach up to 13.08 and 2.78 W/mK, respectively, where the deposited carbon content was 11.76 vol %. The in-plane thermal conductivity enhancement (TCE) of EP/C@CFF-2300 °C was improved by 6440 and 808% compared to those of pure EP and EP/CFF, respectively. The high-temperature treatment greatly provides an improvement in thermal conductivity for the in-plane and the through-plane. Infrared imaging showed excellent thermal management properties of the prepared epoxy composites. EP/C@CFF-2300 °C owned an in-plane AC conductivity of up to 0.035 S/cm at 10 kHz, and Lorentz-Drude-type negative permittivity behaviors were observed at the tested frequency region. The CFF thermally conductive composites prepared by the above method have a broad application prospect in the field of advanced thermal management and electromagnetics.
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Affiliation(s)
- Tao Jiang
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Kang Xu
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Ying Wang
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Lixue Xiang
- Hangzhou Vulcan New Materials Technology Co., Ltd, Hangzhou 311255, China
| | - Bo Tang
- Hangzhou Vulcan New Materials Technology Co., Ltd, Hangzhou 311255, China
| | - Shanshan Shi
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Yifan Li
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
| | - Wei Yu
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
| | - Huaqing Xie
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
| | - Xinfeng Wu
- Shanghai Key Laboratory of Engineering Materials Application and Evaluation, China Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Wenge Li
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Kai Sun
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Runhua Fan
- Merchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
| | - Jinhong Yu
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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15
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Lu W, Deng Q, Liu M, Ding B, Xiong Z, Qiu L. Coaxial Wet Spinning of Boron Nitride Nanosheet-Based Composite Fibers with Enhanced Thermal Conductivity and Mechanical Strength. NANO-MICRO LETTERS 2023; 16:25. [PMID: 37985516 PMCID: PMC10661126 DOI: 10.1007/s40820-023-01236-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/29/2023] [Accepted: 09/30/2023] [Indexed: 11/22/2023]
Abstract
Hexagonal boron nitride nanosheets (BNNSs) exhibit remarkable thermal and dielectric properties. However, their self-assembly and alignment in macroscopic forms remain challenging due to the chemical inertness of boron nitride, thereby limiting their performance in applications such as thermal management. In this study, we present a coaxial wet spinning approach for the fabrication of BNNSs/polymer composite fibers with high nanosheet orientation. The composite fibers were prepared using a superacid-based solvent system and showed a layered structure comprising an aramid core and an aramid/BNNSs sheath. Notably, the coaxial fibers exhibited significantly higher BNNSs alignment compared to uniaxial aramid/BNNSs fibers, primarily due to the additional compressive forces exerted at the core-sheath interface during the hot drawing process. With a BNNSs loading of 60 wt%, the resulting coaxial fibers showed exceptional properties, including an ultrahigh Herman orientation parameter of 0.81, thermal conductivity of 17.2 W m-1 K-1, and tensile strength of 192.5 MPa. These results surpassed those of uniaxial fibers and previously reported BNNSs composite fibers, making them highly suitable for applications such as wearable thermal management textiles. Our findings present a promising strategy for fabricating high-performance composite fibers based on BNNSs.
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Affiliation(s)
- Wenjiang Lu
- Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, Shenzhen, 518055, People's Republic of China
| | - Qixuan Deng
- Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, Shenzhen, 518055, People's Republic of China
| | - Minsu Liu
- Monash Suzhou Research Institute (MSRI), Monash University, Suzhou, 215000, People's Republic of China
| | - Baofu Ding
- Faculty of Materials Science and Engineering/Institute of Technology for Carbon Neutrality, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, People's Republic of China
- Shenzhen Key Laboratory of Energy Materials for Carbon Neutrality, Shenzhen, 518055, People's Republic of China
| | - Zhiyuan Xiong
- School of Light Industry and Engineering, South China University of Technology, Guangzhou, 510614, People's Republic of China.
| | - Ling Qiu
- Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, Shenzhen, 518055, People's Republic of China.
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16
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Wan S, Hao X, Zhu L, Yu C, Li M, Zhao Z, Kuang J, Yue M, Lu Q, Cao W, Wang Q. Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si 3N 4 Nanowires. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 37392172 DOI: 10.1021/acsami.3c04473] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/03/2023]
Abstract
As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires (Si3N4NWs) have been considered as promising fillers for preparing anisotropic thermally conductive composite films due to their extremely high thermal conductivity, low dielectric properties, and excellent mechanical properties. However, an efficient approach to synthesize Si3N4NWs in a large scale still need to be explored. In this work, large quantities of Si3N4NWs were successfully prepared using a modified CRN method, presenting the advantages of high aspect ratio, high purity, and easy collection. On the basis, the super-flexible PVA/Si3N4NWs composite films were further prepared with the assistance of vacuum filtration method. Due to the highly oriented Si3N4NWs interconnected to form a complete phonon transport network in the horizontal direction, the composite films exhibited a high in-plane thermal conductivity of 15.4 W·m-1·K-1. The enhancement effect of Si3N4NWs on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the Si3N4NWs enabled the composite film presenting good thermal stability, high electrical insulation, and excellent mechanical strength, which was beneficial for thermal management applications in modern electronic devices.
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Affiliation(s)
- Shiqin Wan
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Xu Hao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Lifeng Zhu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Chang Yu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Mengyi Li
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Zheng Zhao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Jianlei Kuang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Ming Yue
- School of Civil and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Qipeng Lu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Wenbin Cao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Qi Wang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
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17
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Zhou MH, Yin GZ, Prolongo SG, Wang DY. Recent Progress on Multifunctional Thermally Conductive Epoxy Composite. Polymers (Basel) 2023; 15:2818. [PMID: 37447467 DOI: 10.3390/polym15132818] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/11/2023] [Revised: 06/16/2023] [Accepted: 06/20/2023] [Indexed: 07/15/2023] Open
Abstract
In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.
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Affiliation(s)
- Mei-Hui Zhou
- Materials Science and Engineering Area, Escuela Superior de Ciencias Experimentales y Tecnología, Universidad Rey Juan Carlos, C/ Tulipán s/n, Móstoles, 28933 Madrid, Spain
| | - Guang-Zhong Yin
- Escuela Politécnica Superior, Universidad Francisco de Vitoria, Ctra. Pozuelo-Majadahonda Km 1, 800, Pozuelo de Alarcón, 28223 Madrid, Spain
| | - Silvia González Prolongo
- Materials Science and Engineering Area, Escuela Superior de Ciencias Experimentales y Tecnología, Universidad Rey Juan Carlos, C/ Tulipán s/n, Móstoles, 28933 Madrid, Spain
| | - De-Yi Wang
- IMDEA Materials Institute, C/Eric Kandel 2, Getafe, 28906 Madrid, Spain
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18
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Yan L, Liu P, Xu P, Tan L, Zhang Z. Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP. MICROMACHINES 2023; 14:1245. [PMID: 37374830 DOI: 10.3390/mi14061245] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/29/2023] [Revised: 06/05/2023] [Accepted: 06/12/2023] [Indexed: 06/29/2023]
Abstract
Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be negatively impacted by its low thermal conductivity, which can cause overheating. Hence, it is necessary to provide a reliable and workable thermal management model. In this paper, a model of a flip-chip packing (FCP) GaN chip was established, and it was assigned to the Ag sinter paste structure. The different solder bumps and under bump metallurgy (UBM) were considered. The results indicated that the FCP GaN chip with underfill was a promising method because it not only reduced the size of the package model but also reduced thermal stress. When the chip was in operation, the thermal stress was about 79 MPa, only 38.77% of the Ag sinter paste structure, lower than any of the GaN chip packaging methods currently in use. Moreover, the thermal condition of the module often has little to do with the material of the UBM. Additionally, nano-silver was found to be the most suitable bump material for FCP GaN chip. Temperature shock experiments were also conducted with different UBM materials when nano-silver was used as bump. It was found that Al as UBM is a more reliable option.
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Affiliation(s)
- Lei Yan
- Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China
| | - Peisheng Liu
- Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China
| | - Pengpeng Xu
- Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China
| | - Lipeng Tan
- Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China
| | - Zhao Zhang
- Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China
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19
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Wang Z, Hou D, Wang F, Zhou J, Cai N, Guo J. Facile and Scalable Strategy for Fabricating Highly Thermally Conductive Epoxy Composites Utilizing 3D Graphitic Carbon Nitride Nanosheet Skeleton. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 37276584 DOI: 10.1021/acsami.3c05082] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/07/2023]
Abstract
The application of high-performance thermal interface materials (TIMs) for thermal management is commonly used to tackle the problem of heat accumulation, which influences the performance and reliability of microelectronic devices. Herein, a novel three-dimensional (3D) carbon nitride nanosheet (CNNS)/epoxy composite with high thermal conductivity was developed by introducing 3D CNNS skeleton fillers prepared by a facile and scalable strategy assisted by a salt template. Benefiting from the continuous heat transfer pathways formed in the CNNS skeleton, 17.0 wt % 3D CNNS/epoxy composites achieve a superior thermal conductivity of 1.27 W/m·K, which is 6.35 and 1.57 times higher than those of epoxy resin and convention CNNS/epoxy, respectively. With the aid of theoretical model analysis and finite element simulation, the pronounced enhancement effect of the 3D CNNS skeleton on the thermal conductivity of epoxy composites is found to be attributed to the continuous 3D CNNS thermally conductive network, the diminished CNNS-CNNS interfacial thermal resistance, and the effective interfacial interactions between epoxy and CNNS. In addition, the 3D CNNS/epoxy composites possess high electrical insulation and desirable mechanical strength. Therefore, 3D CNNS/epoxy composites are promising TIMs for advanced electronic thermal management.
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Affiliation(s)
- Zelong Wang
- Key Laboratory for Green Chemical Process of Ministry of Education, Hubei Key Laboratory of Novel Reactor and Green Chemical Technology, School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Wuhan 430073, China
| | - Dajun Hou
- State Key Laboratory of Advanced Technology for Material Synthesis and Processing, School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Fang Wang
- Key Laboratory for Green Chemical Process of Ministry of Education, Hubei Key Laboratory of Novel Reactor and Green Chemical Technology, School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Wuhan 430073, China
| | - Jingjing Zhou
- State Key Laboratory of Advanced Technology for Material Synthesis and Processing, School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Ning Cai
- Key Laboratory for Green Chemical Process of Ministry of Education, Hubei Key Laboratory of Novel Reactor and Green Chemical Technology, School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Wuhan 430073, China
| | - Jia Guo
- Key Laboratory for Green Chemical Process of Ministry of Education, Hubei Key Laboratory of Novel Reactor and Green Chemical Technology, School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Wuhan 430073, China
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20
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Wu N, Che S, Shen P, Chen N, Chen F, Ma G, Liu H, Yang W, Wang X, Li Y. A binder-free ice template method for vertically aligned 3D boron nitride polymer composites towards thermal management. J Colloid Interface Sci 2023; 647:43-51. [PMID: 37244175 DOI: 10.1016/j.jcis.2023.05.141] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/04/2023] [Revised: 05/10/2023] [Accepted: 05/21/2023] [Indexed: 05/29/2023]
Abstract
Hexagonal boron nitride (BN) is an attractive filler candidate for thermal interface materials, but the thermal conductivity enhancement is limited by the anisotropic thermal conductivity of BN and disordered thermal pathways in the polymer matrix. Herein, a facile and economic ice template method is proposed, wherein BN modified by tannic acid (BN-TA) directly self-assemble to form vertically aligned nacre-mimetic scaffold without additional binders and post-treatment. The effects of the BN slurry concentration and the ratio of BN/TA on three-dimensional (3D) skeleton morphology are fully investigated. The corresponding polydimethylsiloxane (PDMS) composite via vacuum-impregnation achieves a high through-plane thermal conductivity of 3.8 W/mK at a low filler loading of 18.7 vol%, which is 2433% and 100% higher than that of pristine PDMS and the PDMS composite with randomly distributed BN-TA, respectively. The finite element analysis results theoretically demonstrate the superiority of the highly longitudinally ordered 3D BN-TA skeleton in axial heat transfer. Additionally, 3D BN-TA/PDMS exhibits excellent practical heat dissipation capability, lower thermal expansion coefficient, and enhanced mechanical properties. This strategy offers an anticipated perspective for developing high-performance thermal interface materials to address the thermal challenges of modern electronics.
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Affiliation(s)
- Ni Wu
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Sai Che
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Peidi Shen
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Neng Chen
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Fengjiang Chen
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Guang Ma
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Hongchen Liu
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Wang Yang
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China
| | - Xiaobai Wang
- Department of Materials Application Research, AVIC Manufacturing Technology Institute, Beijing 100024, China.
| | - Yongfeng Li
- State Key Laboratory of Heavy Oil Processing, China University of Petroleum, Beijing 102249, China.
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21
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Lu J, Zhang S, Zhang L, Wang C, Min C. Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials. MATERIALS (BASEL, SWITZERLAND) 2023; 16:ma16103768. [PMID: 37241395 DOI: 10.3390/ma16103768] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/19/2023] [Revised: 05/07/2023] [Accepted: 05/15/2023] [Indexed: 05/28/2023]
Abstract
With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO2 hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm-1 k-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.
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Affiliation(s)
- Jiadong Lu
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Songli Zhang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Leizhi Zhang
- School of Civil Engineering, Southeast University, Nanjing 211189, China
| | - Chenxi Wang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Chunying Min
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
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22
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Zhu S, Zhao M, Zhou H, Wen Y, Wang Y, Liao Y, Zhou X, Xie X. One-pot synthesis of hyperbranched polymers via visible light regulated switchable catalysis. Nat Commun 2023; 14:1622. [PMID: 36959264 PMCID: PMC10036521 DOI: 10.1038/s41467-023-37334-x] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/22/2022] [Accepted: 03/14/2023] [Indexed: 03/25/2023] Open
Abstract
Switchable catalysis promises exceptional efficiency in synthesizing polymers with ever-increasing structural complexity. However, current achievements in such attempts are limited to constructing linear block copolymers. Here we report a visible light regulated switchable catalytic system capable of synthesizing hyperbranched polymers in a one-pot/two-stage procedure with commercial glycidyl acrylate (GA) as a heterofunctional monomer. Using (salen)CoIIICl (1) as the catalyst, the ring-opening reaction under a carbon monoxide atmosphere occurs with high regioselectivity (>99% at the methylene position), providing an alkoxycarbonyl cobalt acrylate intermediate (2a) during the first stage. Upon exposure to light, the reaction enters the second stage, wherein 2a serves as a polymerizable initiator for organometallic-mediated radical self-condensing vinyl polymerization (OMR-SCVP). Given the organocobalt chain-end functionality of the resulting hyperbranched poly(glycidyl acrylate) (hb-PGA), a further chain extension process gives access to a core-shell copolymer with brush-on-hyperbranched arm architecture. Notably, the post-modification with 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO) affords a metal-free hb-PGA that simultaneously improves the toughness and glass transition temperature of epoxy thermosets, while maintaining their storage modulus.
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Affiliation(s)
- Shuaishuai Zhu
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Maoji Zhao
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Hongru Zhou
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Yingfeng Wen
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Yong Wang
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China.
| | - Yonggui Liao
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Xingping Zhou
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
| | - Xiaolin Xie
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China
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23
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Trinh TE, Ku K, Yeo H. Reprocessable and Chemically Recyclable Hard Vitrimers Based on Liquid-Crystalline Epoxides. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2209912. [PMID: 36563334 DOI: 10.1002/adma.202209912] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/26/2022] [Revised: 12/13/2022] [Indexed: 06/17/2023]
Abstract
The rapid increase in demand for recyclable and reusable thermosets has necessitated the development of materials with chemical structures that exhibit these features. Thus, functional mesogenic epoxide monomers bearing both ester and imine groups that can be vitrimerized and recycled are reported herein. The compounds show mesophase characteristics at 100-200 °C and can be converted into hard epoxides by a common curing reaction. The obtained hard epoxides have high isotropic thermal conductivity (≈0.64 W m-1 K-1 ), which is derived from their highly ordered microstructures. The cured products can be easily reprocessed through imine metathesis and transesterification, and decomposed products can be obtained through imine hydrolysis under acidic or basic conditions and subsequently be re-cured. Surprisingly, recycled materials can be repeatedly reprocessed or chemically decomposed. The reprocessed materials retain the properties of their pristine counterparts, and the recycled products preserve the advantages of the hard thermosets without alteration to any of their unique properties. A dehydration reaction occurs between the residual hydroxyl groups during the re-hardening, which dramatically increases the glass transition temperature by ≈60 °C. These reprocessable and recyclable vitrimers demonstrate the effectiveness and environmental friendliness of the molecular design strategy reported herein.
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Affiliation(s)
- Thi En Trinh
- Department of Science Education, Kyungpook National University, 80, Daehak-ro, Buk-gu, Daegu, 41566, Republic of Korea
| | - Kyosun Ku
- Department of Chemistry Education, Kyungpook National University, 80, Daehak-ro, Buk-gu, Daegu, 41566, Republic of Korea
| | - Hyeonuk Yeo
- Department of Chemistry Education & Department of Science Education & Department of Pharmacy, Kyungpook National University, 80, Daehak-ro, Buk-gu, Daegu, 41566, Republic of Korea
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24
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Hao X, Wan S, Zhao Z, Zhu L, Peng D, Yue M, Kuang J, Cao W, Liu G, Wang Q. Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons. ACS APPLIED MATERIALS & INTERFACES 2023; 15:2124-2133. [PMID: 36576869 DOI: 10.1021/acsami.2c18356] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.
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Affiliation(s)
- Xu Hao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Shiqin Wan
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Zheng Zhao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Lifeng Zhu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Dongyao Peng
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Ming Yue
- School of Civil and Environmental Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Jianlei Kuang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Wenbin Cao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
| | - Guanghua Liu
- State Key Laboratory of New Ceramics & Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing100084, China
| | - Qi Wang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing100083, China
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25
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Qian Y, Luo Y, Haruna AY, Xiao B, Li W, Li Y, Xiong T, Jiang Q, Yang J. Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2204303. [PMID: 36228102 DOI: 10.1002/smll.202204303] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/12/2022] [Revised: 09/07/2022] [Indexed: 06/16/2023]
Abstract
The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This work demonstrates a multifunctional epoxy-based composite (MDCF@LDH/EP) with high electromagnetic wave (EMW) absorption, thermal conductivity, and flame retardancy performance. In which, the synergistic effect of porous structure and heterointerface promotes the multiple reflection and absorption, and dielectric loss of EMW. A low reflection loss of -57.77 dB, and an effective absorption bandwidth of 7.20 GHz are achieved under the fillings of only 10 wt%. Meanwhile, a 241.4% enhanced thermal conductivity of EP is due to the high continuous 3D melamine-derived carbon foams (MDCF), which provides a broad path for the transport of phonons. In addition, MDCF@LDH/EP composite exhibits high thermal stability and flame retardancy, thanks to the physical barrier effect of MDCF@LDH combined with the high temperature cooling properties of NiAl-LDH-CO3 2- . Compared with pure epoxy resin, the peak heat release rate and the total heat release rate are reduced by 19.4% and 30.7%, respectively. Such an excellent comprehensive performance enables MDCF@LDH/EP to a promising electronic packaging material.
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Affiliation(s)
- Yongxin Qian
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Yubo Luo
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Abubakar Yakubu Haruna
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Bo Xiao
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Wang Li
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - You Li
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Tianshun Xiong
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Qinghui Jiang
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Junyou Yang
- State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
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26
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Wang Q, Li T, Ding Y, Chen H, Cao X, Xia J, Li B, Sun B. AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics. ACS APPLIED MATERIALS & INTERFACES 2022; 14:41447-41455. [PMID: 36049055 DOI: 10.1021/acsami.2c12386] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.
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Affiliation(s)
- Qiaoli Wang
- College of Physics, Qingdao University, Qingdao 266071, P. R. China
- College of Electronics and Information, Qingdao University, Qingdao 266071, P. R. China
| | - Tianshuo Li
- College of Physics, Qingdao University, Qingdao 266071, P. R. China
- Department of Basic, Ma'anshan University, Ma'anshan 243100, P. R. China
| | - Yafei Ding
- Department of Material Science and Engineering, Department of Physics, Shenzhen Institute for Quantum Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China
| | - Huibao Chen
- College of Physics, Qingdao University, Qingdao 266071, P. R. China
- College of Electronics and Information, Qingdao University, Qingdao 266071, P. R. China
| | - Xiyue Cao
- College of Chemistry and Chemical Engineering, Shandong Sino-Japanese Center for Collaborative Research of Carbon Nanomaterials, Instrumental Analysis Center of Qingdao University, Qingdao University, Qingdao 266071, P. R. China
| | - Jianfei Xia
- College of Chemistry and Chemical Engineering, Shandong Sino-Japanese Center for Collaborative Research of Carbon Nanomaterials, Instrumental Analysis Center of Qingdao University, Qingdao University, Qingdao 266071, P. R. China
| | - Baowen Li
- Department of Material Science and Engineering, Department of Physics, Shenzhen Institute for Quantum Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China
- Paul M. Rady Department of Mechanical Engineering and Department of Physics, University of Colorado, Boulder, Colorado 80305-0427, United States
| | - Bin Sun
- College of Physics, Qingdao University, Qingdao 266071, P. R. China
- College of Electronics and Information, Qingdao University, Qingdao 266071, P. R. China
- Weihai Innovation Research Institute, Qingdao University, Weihai 264200, P. R. China
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