A Method to Form Smooth Films of Liquid Metal Supported by Elastomeric Substrate

Interface of gallium-based liquid metals: oxide skin, wetting, and applications

Gallium-based liquid metals (GaLMs) are promising for a variety of applications-especially as a component material for soft devices-due to their fluidic nature, low toxicity and reactivity, and high electrical and thermal conductivity comparable to solid counterparts. Understanding the interfacial properties and behaviors of GaLMs in different environments is crucial for most applications. When exposed to air or water, GaLMs form a gallium oxide layer with nanoscale thickness. This "oxide nano-skin" passivates the metal surface and allows for the formation of stable microstructures and films despite the high-surface tension of liquid metal. The oxide skin easily adheres to most smooth surfaces. While it enables effective printing and patterning of the GaLMs, it can also make the metals challenging to handle because it adheres to most surfaces. The oxide also affects the interfacial electrical resistance of the metals. Its formation, thickness, and composition can be chemically or electrochemically controlled, altering the physical, chemical, and electrical properties of the metal interface. Without the oxide, GaLMs wet metallic surfaces but do not wet non-metallic substrates such as polymers. The topography of the underlying surface further influences the wetting characteristics of the metals. This review outlines the interfacial attributes of GaLMs in air, water, and other environments and discusses relevant applications based on interfacial engineering. The effect of surface topography on the wetting behaviors of the GaLMs is also discussed. Finally, we suggest important research topics for a better understanding of the GaLMs interface.

Liquid Metal Combinatorics toward Materials Discovery

Liquid metals and their derivatives provide several opportunities for fundamental and practical exploration worldwide. However, the increasing number of studies and shortage of desirable materials to fulfill different needs also pose serious challenges. Herein, to address this issue, a generalized theoretical frame that is termed as "Liquid Metal Combinatorics" (LMC) is systematically presented, and summarizes promising candidate technical routes toward new generation material discovery. The major categories of LMC are defined, and eight representative methods for manufacturing advanced materials are outlined. It is illustrated that abundant targeted materials can be efficiently designed and fabricated via LMC through deep physical combinations, chemical reactions, or both among the main bodies of liquid metals, surface chemicals, precipitated ions, and other materials. This represents a large class of powerful, reliable, and modular methods for innovating general materials. The achieved combinatorial materials not only maintained the typical characteristics of liquid metals but also displayed distinct tenability. Furthermore, the fabrication strategies, wide extensibility, and pivotal applications of LMC are classified. Finally, by interpreting the developmental trends in the area, a perspective on the LMC is provided, which warrants its promising future for society.

Breakup-Free and Colorful Liquid Metal Thin Films via Electrochemical Oxidation

Thin-film metal conductors featuring high conductivity and stretchability are basic building blocks for high-performance conformable electronics. Gallium-based liquid metals are attractive candidates for thin-film conductors due to their intrinsic stretchability and ease of processing. Moreover, the phase change nature of liquid metal provides an opportunity to create conformal electronics in a substrate-free manner. However, thin liquid metal films tend to break during the solid-to-liquid transition due to the high surface tension of liquid metal. Here, we created breakup-free liquid metal thin films by the electrochemical oxidation of solid gallium films. We show that electrochemical oxidation can enhance the mechanical strength of the gallium oxide layer and its interfacial adhesion to the gallium core. When heated to the liquid state, the oxidized gallium films can maintain their structural integrity on various solid substrates, hydrogels, and even the water surface. The solid-liquid phase change-induced stiffness decrease allowed the gallium films to be conformably attached to various nonplanar surfaces upon heating or water transfer printing. Moreover, we also found that enhanced electrochemical oxidation can result in the formation of structure color due to nanoporous structures on the film surface. We also demonstrate the applications of oxidized liquid metal films in functional electronics, electrophysiological monitoring, and tattoo art.

Highly Stable Liquid Metal Conductors with Superior Electrical Stability and Tough Interface Bonding for Stretchable Electronics

Ga-based liquid metal stretchable conductors have recently gained interest in flexible electronic devices such as electrodes, antennas, and sensors. It is essential to maintain electrical stability under strain or cyclic strain for reliable data acquisition and exhibit tough interfacial bonding between liquid metal and polymers to prevent performance loss and device failure. Herein, a highly stable conductor with superior electrical stability and tough interface bonding is introduced by casting curable polymers and a peeling-activated process from liquid metal particles. Based on the compensating effect of liquid metal, similar to the recharge relationship of water between rivers and lakes in nature, the conductor is not only strain-insensitive (ΔR/R₀ < 10% for 100% strain) but also immune to cyclic deformation (ΔR/R₀ < 7% with 5000 stretching cycles at 50% strain). Embedding liquid metal within the elastomer to create stretchable conductors effectively improves interfacial adhesion properties (the fluid-solid interfacial adhesion force increases from 0.48 to 0.62 mN/mm²). The constructed tough interface could even withstand sonication treatment. Finally, by combining strategies in material design and fabrication, an integrated array composed of vertical interconnect access and robust electrodes is fabricated, which simultaneously holds tough interfacial bonding with the upper and lower layers.

Shaping a Soft Future: Patterning Liquid Metals

This review highlights the unique techniques for patterning liquid metals containing gallium (e.g., eutectic gallium indium, EGaIn). These techniques are enabled by two unique attributes of these liquids relative to solid metals: 1) The fluidity of the metal allows it to be injected, sprayed, and generally dispensed. 2) The solid native oxide shell allows the metal to adhere to surfaces and be shaped in ways that would normally be prohibited due to surface tension. The ability to shape liquid metals into non-spherical structures such as wires, antennas, and electrodes can enable fluidic metallic conductors for stretchable electronics, soft robotics, e-skins, and wearables. The key properties of these metals with a focus on methods to pattern liquid metals into soft or stretchable devices are summari.

Stretchable Electrodes Based on Over-Layered Liquid Metal Networks

Liquid metals are attractive materials for stretchable electronics owing to their high electrical conductivity and near-zero Young's modulus. However, the high surface tension of liquid metals makes it difficult to form films. A novel stretchable film is proposed based on an over-layered liquid-metal network. An intentionally oxidized interfacial layer helps to construct uninterrupted indium and gallium nanoclusters and produces additional electrical pathways between the two metal networks under mechanical deformation. The films exhibit gigantic negative piezoresistivity (G-NPR), which decreased the resistance up to 85% during the first 50% stretching. This G-NPR property is due to the rupture of the metal oxides, which allows the formation of liquid eutectic gallium-indium (EGaIn) and the connection of the over-layered networks to build new electrical paths. The electrodes exhibiting G-NPR are complementarily combined with conventional electrodes to amplify their performance or achieve some unique operations.

Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics

Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.

Liesegang Phenomenon of Liquid Metals on Au Film

Room temperature liquid metals (LM) such as gallium (Ga) own the potential to react with specific materials which would incubate new application categories. Here, diverse self-organized ring patterns due to nonequilibrium reaction-diffusion and spreading-limitation of Ga-based LM clusters on gold (Au) film are reported, among which diffusion is the controlling step and the self-limiting oxide layer plays the role of kinetic barrier. Such phenomena, classically known as the Liesegang rings, mainly occur in electrolyte media. Unlike existing systems, the present periodic crystallization mechanism enables highly symmetric spatiotemporal periodic Liesegang rings on a smaller scale under ambient conditions. Typically, the Ga-Au and eutectic gallium-indium alloy (EGaIn)-Au reaction-diffusion-spreading systems are constructed, obtaining the revert type and hybrid type concentric Liesegang patterns, respectively. The competitive patterning behavior of the intermediate phase products AuGa₂ and AuIn₂ in hybrid Liesegang patterns is further analyzed by altering the initial Ga/In mass ratio, first-principles calculations, and molecular dynamic simulations. When the mass ratio of In in GaIn alloy exceeds 15%, it will preferentially react with Au. The discovery of LM Liesegang phenomenon is expected to be a flashpoint for self-organized reaction-diffusion systems and offers promising rules for diverse areas such as materials synthesis and the jewelry design industry.

Conformally Adhesive, Large-Area, Solidlike, yet Transient Liquid Metal Thin Films and Patterns via Gelatin-Regulated Droplet Deposition and Sintering

Adhesion and spreading of liquid metals (LMs) on substrates are essential steps for the generation of flexible electronics and thermal management devices. However, the controlled deposition is limited by the high surface tension and peculiar wetting and adhesion behavior of LMs. Herein, we introduce gelatin-regulated LM droplet deposition and sintering (GLMDDS), for the upscalable production of conformally adhesive, solidlike, yet transient LM thin films and patterns on diverse substrates. This method involves four steps: homogeneous deposition of LM microdroplets, gelation of the LM-gelatin solution, toughening of the gelatin hydrogel by solvent displacement, and peeling-induced sintering of LM microdroplets. The LM thin film exhibits a three-layer structure, comprising an LM microdroplet-embedded tough organohydrogel adhesion layer, a continuous LM layer, and an oxide skin. The composite exhibits high stretchability and mechanical robustness, conformal adhesion to various substrates, high conductivity (4.35 × 10⁵ S·m^-1), and transience (86% LM recycled). Large-scale deposition (i.e., 5.6 dm²) and the potential for patterns on diverse substrates demonstrate its upscalability and broad suitability. Finally, the LM thin films and patterns are applied for flexible and wearable devices, i.e., pressure sensors, heaters, human motion tracking devices, and thermal management devices, illustrating the broad applicability of this strategy.

Imbibition-induced selective wetting of liquid metal

Herein, we present the imbibition-induced, spontaneous, and selective wetting characteristics of gallium-based liquid metal alloys on a metallized surface with micro-scale topographical features. Gallium-based liquid metal alloys are fascinating materials that have enormous surface tension; therefore, they are difficult to pattern into films. The complete wetting of eutectic alloy of gallium and indium is realized on microstructured copper surfaces in the presence of HCl vapor, which removes the native oxide from the liquid metal alloy. This wetting is numerically explained based on the Wenzel’s model and imbibition process, revealing that the dimensions of the microstructures are critical for effective imbibition-driven wetting of the liquid metal. Further, we demonstrate that the spontaneous wetting of the liquid metal can be directed selectively along the microstructured region on the metallic surface to create patterns. This simple process enables the uniform coating and patterning of the liquid metal over large areas without an external force or complex processing. We demonstrate that the liquid metal-patterned substrates maintain electrical connection even in a stretched state and after repetitive stretching cycles.

Liquid metals that have enormous surface tension are difficult to pattern into films. Here, authors report the spontaneous and selective wetting of a gallium-based liquid metal, which is induced by imbibition on a micro-structured metallized substrate.

A Highly Stretchable and Permeable Liquid Metal Micromesh Conductor by Physical Deposition for Epidermal Electronics

Stretchable electronics allow functional devices to integrate with human skin seamlessly in an emerging wearable platform termed epidermal electronics. Compliant conductors represent key building components for functional devices. Among the various candidates, gallium-based liquid metals stand out with metallic conductivity and inherent deformability. Currently, the widespread applications of liquid metals in epidermal electronics are hindered by the low steam permeability and hence unpleasant wearing perceptions. In this study, a facile physical deposition approach is established to create a liquid metal micromesh over an elastomer sponge, which exhibits low sheet resistance (∼0.5 Ω sq^-1), high stretchability (400% strain), and excellent durability. The porous micromesh shows textile-level permeability to achieve long-term wearing comfort. The conformal interaction of the liquid metal micromesh with the skin gives rise to a low contact impedance. An integrated epidermal sensing sleeve is demonstrated as a human-machine interface to distinguish different hand gestures by recording muscle contractions. The reported stretchable and permeable liquid metal conductor shows promising potentials in next-generation epidermal electronics.

Gallium-Enhanced Aluminum and Copper Electromigration Performance for Flexible Electronics

Wide range binary and ternary thin film combinatorial libraries mixing Al, Cu, and Ga were screened for identifying alloys with enhanced ability to withstand electromigration. Bidimensional test wires were obtained by lithographically patterning the substrates before simultaneous vacuum co-deposition from independent sources. Current-voltage measurement automation allowed for high throughput experimentation, revealing the maximum current density and voltage at the electrical failure threshold for each alloy. The grain boundary dynamic during electromigration is attributed to the resultant between the force corresponding to the electron flux density and the one corresponding to the atomic concentration gradient perpendicular to the current flow direction. The screening identifies Al-8 at. % Ga and Cu-5 at. % Ga for replacing pure Al or Cu connecting lines in high current/power electronics. Both alloys were deposited on polyethylene naphthalate (PEN) flexible substrates. The film adhesion to PEN is enhanced by alloying Al or Cu with Ga. Electrical testing demonstrated that Al-8 at. % Ga is more suitable for conducting lines in flexible electronics, showing an almost 50% increase in electromigration suppression when compared to pure Al. Moreover, Cu-5 at. % Ga showed superior properties as compared to pure Cu on both SiO₂ and PEN substrates, where more than 100% increase in maximum current density was identified.

Nanofabrication for all-soft and high-density electronic devices based on liquid metal

Innovations in soft material synthesis and fabrication technologies have led to the development of integrated soft electronic devices. Such soft devices offer opportunities to interact with biological cells, mimicking their soft environment. However, existing fabrication technologies cannot create the submicron-scale, soft transducers needed for healthcare and medical applications involving single cells. This work presents a nanofabrication strategy to create submicron-scale, all-soft electronic devices based on eutectic gallium-indium alloy (EGaIn) using a hybrid method utilizing electron-beam lithography and soft lithography. The hybrid lithography process is applied to a biphasic structure, comprising a metallic adhesion layer coated with EGaIn, to create soft nano/microstructures embedded in elastomeric materials. Submicron-scale EGaIn thin-film patterning with feature sizes as small as 180 nm and 1 μm line spacing was achieved, resulting in the highest resolution EGaIn patterning technique to date. The resulting soft and stretchable EGaIn patterns offer a currently unrivaled combination of resolution, electrical conductivity, and electronic/wiring density.

Harnessing the Rheological Properties of Liquid Metals To Shape Soft Electronic Conductors for Wearable Applications

Emerging applications of the Internet of Things in healthcare, wellness, and gaming require continuous monitoring of the body and its environment, fueling the need for wearable devices able to maintain intimate, reliable, and unobtrusive contact with the human body. This translates in the necessity to develop soft and deformable electronics that match the body's mechanics and dynamics. In recent years, various strategies have been proposed to form stretchable circuits and more specifically elastic electrical conductors embedded in elastomeric substrate using either geometrical structuring of solid conductors or intrinsically stretchable materials. Gallium (Ga)-based liquid metals (LMs) are an emerging class of materials offering a particularly interesting set of properties for the design of intrinsically deformable conductors. They concomitantly offer the high electrical conductivity of metals with the ability of liquids to flow and reconfigure. The specific chemical and physical properties of Ga-based LMs differ fundamentally from those of solid conductors and need to be considered to successfully process and implement them into stretchable electronic devices. In this Account, we report on how the key physical and chemical properties of Ga-based LMs can be leveraged to enable repeatable manufacturing and precise patterning of stretchable LM conductors. A comprehensive understanding of the interplay between the LM, its receiving substrate chemistry and topography, and the environmental conditions is necessary to meet the reproducibility and reliability standards for large scale deployment in next-generation wearable systems. In oxidative environments, a solid oxide skin forms at the surface of the LM and provides enough stiffness to counterbalance surface tension, and prevent the LM from beading up to a spherical shape. We review techniques that advantageously harness the oxide skin to form metastable structures such as spraying, 3D printing, or channel injection. Next, we explore how controlling the environmental condition prevents the formation or removes the oxide skin, thereby allowing for selective wetting of Ga lyophilic surfaces. Representative examples include selective plating and physical vapor deposition. The wettability of LMs can be further tuned by engineering the surface chemistry and topology of the receiving substrate to form superlyophobic or superlyophilic surfaces. In particular, our group developed Ga-superlyophilic substrates by engineering the surface of silicone rubber with microstructures and a gold coating layer. Thermal evaporation of Ga on such engineered substrates allows for the formation of smooth LM films with micrometric thickness control and design freedom. The versatility of the available deposition techniques facilitates the implementation of LM conductors in a wide variety of wearable devices. We review various epidermal electronic systems using LM conductors as interconnects to carry power and information, transducers and sensors, antennas, and complex hybrid (soft-rigid) electronic circuits. In addition, we highlight the limitations and challenges inherent to the use of Ga LM conductors that include electromigration, corrosion, solidification, and biocompatibility.