Effects of polyisocyanate on properties and pot life of epoxy resin cross-linked soybean meal-based bioadhesive

A fully bio-based soy protein wood adhesive modified by citric acid with high water tolerance

Despite the widespread application prospect of soybean meal flour (SF) as a non-toxic and renewable wood adhesive, the practical application is limited by its poor mechanical properties and water resistance. In this work, a novel SF-based wood adhesive (CSP) was developed using citric acid (CA) as a modifier, which was further designated to produce plywood on a laboratory scale. Moreover, the effects of the mass ratio of CA/SF, hot-pressing temperature, and hot-pressing time on the bonding properties and water resistance of the resulting plywood were investigated in detail. As a result, under the optimal hot-pressing conditions (180 °C, 5 min), high-performance plywood bonded by CSP (CA/SF = 15/100) adhesive was fabricated, whose dry shear strength, cold-water wet shear strength (20 °C for 24 h), and hot-water wet shear strength (63 °C for 3 h) reached 1.65 MPa, 1.99 MPa, and 1.58 MPa, respectively. Due to the easy preparation process, sustainability, and favorable properties, the proposed fully bio-based CSP wood adhesive has great potential for the large-scale fabrication of eco-friendly wood panels in industry.

Effects of Lysine on the Interfacial Bonding of Epoxy Resin Cross-Linked Soy-Based Wood Adhesive

Soy protein isolate (SPI) is an attractive natural material for preparing wood adhesives that has found broad application. However, poor mechanical properties and unfavorable water resistance of wood composites with SPI adhesive bonds limit its more extensive utilization. The combination of lysine (Lys) with a small molecular structure as a curing agent for modified soy-based wood adhesive allows Lys to penetrate wood pores easily and can result in better mechanical strength of soy protein-based composites, leading to the formation of strong chemical bonds between the amino acid and wood interface. Scanning electron microscopy (SEM) results showed that the degree of penetration of the S/G/L-9% adhesive into the wood was significantly increased, the voids, such as ducts of wood at the bonding interface, were filled, and the interfacial bonding ability of the plywood was enhanced. Compared with the pure SPI adhesive, the corresponding wood breakage rate was boosted to 84%. The wet shear strength of the modified SPI adhesive was 0.64 MPa. When Lys and glycerol epoxy resin (GER) were added, the wet shear strength of plywood prepared by the S/G/L-9% adhesive reached 1.22 MPa, which increased by 29.8% compared with only GER (0.94 MPa). Furthermore, the resultant SPI adhesive displayed excellent thermostability. Water resistance of S/G/L-9% adhesive was further enhanced with respect to pure SPI and S/GER adhesives through curing with 9% Lys. In addition, this work provides a new and feasible strategy for the development and application of manufacturing low-cost, and renewable biobased adhesives with excellent mechanical properties, a promising alternative to traditional formaldehyde-free adhesives in the wood industry.

Organophilized Montmorillonites as Fillers for Silicone Pressure-Sensitive Adhesives

In the presented work, organophilized montmorillonites (OMMT) with selected quaternary ammonium compounds (QAC) with different chemical structure ((trioctylmethylammonium chloride-A336, dimethyloctadecyl[3-trimethoxysilyl)propyl]ammonium chloride-D, cetyltrimethylammonium bromide-CTAB, 2-methacryloxyethyltrimethylammonium chloride-MOA) were obtained and used as fillers for physically modified silicone pressure-sensitive adhesives (Si-PSA). Before OMMT addition into Si-PSA matrix, they were analyzed via TGA and XRD techniques. Type of chemical structure of QAC affected d-spacing of OMMT. New self-adhesive materials were obtained based on prepared Si-PSA compositions by adding the obtained fillers to the polymer matrix. New tapes exhibit a good level of useful properties as adhesion, cohesion, and tack-the values did not change or slightly decreased; in addition, the tapes with addition of OMMT showed high thermal resistance reaching the measuring limit of the test equipment-to 225 °C.

Development of a High-Performance Adhesive with a Microphase, Separation Crosslinking Structure Using Wheat Flour and a Hydroxymethyl Melamine Prepolymer

The objective of this study is to use wheat flour (WF) and hydroxymethyl melamine prepolymer (HMP) to develop a low cost, highly water-resistant, starch-based bio-adhesive for plywood fabrication. Three-layer plywood was fabricated using the resultant adhesive, and the wet shear strength of the plywood samples was measured under various conditions. After determining that water resistance was significantly improved with the addition of HMP, we evaluated the physical characteristics of the starch-based adhesive and functional groups and analyzed the thermal stability and fracture surface of the cured adhesive samples. Results showed that by adding 20 wt.% HMP into WF adhesive, the sedimentation volume in the resultant adhesive decreased by 11.3%, indicating that the increase of crosslinking in the structure of the adhesives increased the bond strength, and the wet shear strength of the resultant plywood in 63 °C water improved by 375% when compared with the WF adhesive. After increasing the addition of HMP to 40 wt.%, the wet shear strength of the resultant plywood in 100 °C water changed from 0 MPa to 0.71 MPa, which meets the exterior use plywood requirement. This water resistance and bond strength improvement resulted from (1) HMP reacting with functions in WF and forming a crosslinking structure to prevent moisture intrusion; and (2) HMP self-crosslinking and combining with crosslinked WF to form a microphase separation crosslinking structure, which improved both the crosslinking density and the toughness of the adhesive, and subsequently, the adhesive's bond performance. In addition, the microphase separation crosslinking structure had better thermostability and created a compact ductile fracture surface, which further improved the bond performance of the adhesive. Thus, using a prepolymer to form a microphase separation crosslinking structure within the adhesive improves the rigidity, toughness, and water resistance of the material in a practical and cost-effective manner.

Physico-Chemical Properties of Soybean Meal-Based Adhesives Reinforced by Ethylene Glycol Diglycidyl Ether and Modified Nanocrystalline Cellulose

An eco-friendly soybean meal-based adhesive (SM adhesive) was developed by incorporating ethylene glycol diglycidyl ether (EGDE) and nanocrystalline cellulose (NCC). In order to introduce epoxy groups, NCC was modified by KH560 (denoted as MNCC). The functional groups, thermal stability, and cross section of the resultant adhesive were characterized. Three-ply plywood was fabricated to measure the dry and wet shear strength of the adhesive. The experimental results showed that the epoxy groups on MNCC reacted with the carboxyl group of SM protein molecules, forming a crosslinking network and a ductile adhesive layer. As a result, compared with the SM adhesive modified by EGDE, the thermal stability of the adhesive with MNCC was improved and the wet shear strength was increased to 1.08 MPa.

Improve Performance of Soy Flour-Based Adhesive with a Lignin-Based Resin

A lignin-based resin (LB) was used to improve the performance of soy flour-based adhesives. Soy flour (SF), polyamidoamine-epichlorohydrin (PAE), and LB were used to develop a plywood adhesive. The solid content and viscosity of the adhesive, the functional groups, the thermo-stability, and the crystallinity of the cured adhesives were characterized, and the performance of the resultant adhesive was evaluated by fabricating three-ply plywood. Results showed that the LB and PAE mixture used to modify the SF adhesive improved both dry and wet bond strength by 66.3% and 184.2%, respectively. Therefore, the PAE improved the wet bond strength, and the LB improved the dry bond strength. The improvement was attributed to: (1) the reaction of LB/PAE with the functions of the soy protein to form a cross-linking network; (2) a polycondensation reaction between the LB molecules improved the crosslinking density of the adhesive to form an interpenetration structure with cross-linked proteins; and (3) the easy penetration of the LB into the wood surface that enhanced interlocking between the wood and adhesive. Furthermore, the denser structure created by the LB and the PAE mixture improved thermal stability and decreased the crystallinity of the cured adhesive. The use of the LB and the PAE mixture increased the solid content by 35.5%, while still making its viscosity acceptable for industrial applications.