Preparation and characterization of soluble bismaleimide-triazine resins based on asymmetric bismaleimide

Amino Functionalization of Reduced Graphene Oxide/Tungsten Disulfide Hybrids and Their Bismaleimide Composites with Enhanced Mechanical Properties

A novel graphene-based nanocomposite particles (NH₂-rGO/WS₂), composed of reduced graphene oxide (rGO) and tungsten disulfide (WS₂) grafted with active amino groups (NH₂-rGO/WS₂), was successfully synthesized by an effective and facile method. NH₂-rGO/WS₂ nanoparticles were then used to fabricate new bismaleimide (BMI) composites (NH₂-rGO/WS₂/BMI) via a casting method. The results demonstrated that a suitable amount of NH₂-rGO/WS₂ nanoparticles significantly improved the mechanical properties of the BMI resin. When the loading of NH₂-rGO/WS₂ was only 0.6 wt %, the impact and flexural strength of the composites increased by 91.3% and 62.6%, respectively, compared to the neat BMI resin. Rare studies have reported such tremendous enhancements on the mechanical properties of the BMI resin with trace amounts of fillers. This is attributable to the unique layered structure of NH₂-rGO/WS₂ nanoparticles, fine interfacial adhesion, and uniform dispersion of NH₂-rGO/WS₂ in the BMI resin. Besides, the thermal gravimetrical analysis (TGA) revealed that the addition of NH₂-rGO/WS₂ could also improve the stability of the composites.

Thermally stabilized bismaleimide–triazine resin composites for 10-GHz level high-frequency application

A hybrid cured resin with excellent dielectric and thermal properties was prepared with bismaleimide–triazine (BT) resin modified with 2,2′-diallylbisphenol A (DBA). The thermal and dielectric properties of the resin were investigated, and the effect of DBA concentration on the curing reaction was determined. Results indicated that DBA significantly influenced the curing reaction and the properties of the cured product. The modified BT resins exhibited outstanding thermal stability (initial decomposition temperature was over 400°C), although the stability was slightly lower than that of pure BT resins. The dielectric constant and dielectric loss of the cured resin decreased when DBA was introduced into the BT resins. Moreover, the fabricated resins showed dielectric constant of 2.91–3.07 and dielectric loss lower than 0.0057 under the testing high-frequency range of 1 GHz to 15 GHz. Overall, the BT resins modified by DBA display great potential to be applied in high frequency field.