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Li H, Wang X, Ding Z, Gao W, Liu Y, Ma K, Hu Z, Wang Y. Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency. Polymers (Basel) 2024; 16:1188. [PMID: 38732657 PMCID: PMC11085621 DOI: 10.3390/polym16091188] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/29/2024] [Revised: 04/09/2024] [Accepted: 04/19/2024] [Indexed: 05/13/2024] Open
Abstract
Polymer materials with a low dielectric constant and low dielectric loss have the potential to be applied to high-frequency signal transmissions, such as mobile phone antennas and millimeter wave radars. Two types of diamines, 4,4'-diamino-p-tetraphenyl (DPT) and crown ether diamine (CED), were prepared for ternary copolymerization with BPDA in this study. Cross-links with molecular chains were formed, increasing molecular chain distance by utilizing rings of CED. The MPI films exhibit a good thermal performance with the increase in CED addition, with Tg > 380 °C and CTE from -4 × 10-6 K-1 to 5 × 10-6 K-1. The Young's modulus can reach 8.6 GPa, and the tensile strength is above 200 MPa when 5% and 7% CED are introduced. These MPI films exhibit good mechanical performances. The dielectric constant of PI-10% film can go as low as 3.17. Meanwhile, the relationship between dielectric properties and molecular structure has been demonstrated by Molecular Simulation (MS). PI molecules are separated by low dielectric groups, resulting in a decrease in the dielectric constant.
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Affiliation(s)
- Heming Li
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Xinming Wang
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Ziyang Ding
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Weiguo Gao
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Yan Liu
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Ke Ma
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
| | - Zhizhi Hu
- School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China; (H.L.); (X.W.); (Z.D.); (W.G.); (Y.L.)
- Oxiranchem Holding Group Co., Ltd., Liaoyang 111003, China
| | - Yongqi Wang
- Liaoning Agricultural Technical College, Yingkou 115009, China
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Liu S, Cheng L, Liu L. Synthesis of Biaryl Carboxylic Acids through a Cascade Suzuki-Miyaura Coupling/Friedel-Crafts Alkylation/Lewis-Acid-Catalyzed Rearrangement/Aromatization Process. Org Lett 2024; 26:1902-1907. [PMID: 38421159 DOI: 10.1021/acs.orglett.4c00204] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/02/2024]
Abstract
In this study, we present a series of 1,3-dicarbonyls that can undergo a cascade Suzuki coupling, followed by a Friedel-Crafts reaction to produce molecules containing polycyclic alcohols. These polycyclic alcohols can then be converted into biaryl carboxylic acids through ring-opening rearrangement reactions catalyzed by a Lewis acid. The Friedel-Crafts reaction exhibits selective para-positioning of the hydroxyl group and demonstrates good compatibility with functional groups with a yield of up to 82%. Substrates with substituted hydroxyl groups can also be converted into biaryl carboxylic acids through a Lewis-acid-catalyzed ring-opening rearrangement.
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Affiliation(s)
- Shaodong Liu
- Beijing National Laboratory for Molecular Sciences (BNLMS), CAS Key Laboratory of Molecular Recognition and Function, CAS Research/Education Center for Excellence in Molecular Sciences; Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
- China University of Chinese Academy of Sciences, Beijing 100049, China
| | - Liang Cheng
- Beijing National Laboratory for Molecular Sciences (BNLMS), CAS Key Laboratory of Molecular Recognition and Function, CAS Research/Education Center for Excellence in Molecular Sciences; Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
- China University of Chinese Academy of Sciences, Beijing 100049, China
| | - Li Liu
- Beijing National Laboratory for Molecular Sciences (BNLMS), CAS Key Laboratory of Molecular Recognition and Function, CAS Research/Education Center for Excellence in Molecular Sciences; Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
- China University of Chinese Academy of Sciences, Beijing 100049, China
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Chen J, Pei Z, Chai B, Jiang P, Ma L, Zhu L, Huang X. Engineering the Dielectric Constants of Polymers: From Molecular to Mesoscopic Scales. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023:e2308670. [PMID: 38100840 DOI: 10.1002/adma.202308670] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/25/2023] [Revised: 11/30/2023] [Indexed: 12/17/2023]
Abstract
Polymers are essential components of modern-day materials and are widely used in various fields. The dielectric constant, a key physical parameter, plays a fundamental role in the light-, electricity-, and magnetism-related applications of polymers, such as dielectric and electrical insulation, battery and photovoltaic fabrication, sensing and electrical contact, and signal transmission and communication. Over the past few decades, numerous efforts have been devoted to engineering the intrinsic dielectric constant of polymers, particularly by tailoring the induced and orientational polarization modes and ferroelectric domain engineering. Investigations into these methods have guided the rational design and on-demand preparation of polymers with desired dielectric constants. This review article exhaustively summarizes the dielectric constant engineering of polymers from molecular to mesoscopic scales, with emphasis on application-driven design and on-demand polymer synthesis rooted in polymer chemistry principles. Additionally, it explores the key polymer applications that can benefit from dielectric constant regulation and outlines the future prospects of this field.
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Affiliation(s)
- Jie Chen
- Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Zhantao Pei
- Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Bin Chai
- Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Pingkai Jiang
- Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Lin Ma
- State Key Laboratory of Advanced Optical Communication Systems and Networks, Shanghai Jiao Tong University, Minhang, Shanghai, 200240, China
| | - Lei Zhu
- Department of Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, OH, 44106-7202, USA
| | - Xingyi Huang
- Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
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Zhang T, Zhang W, Ding Z, Jiao J, Wang J, Zhang W. A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability. Polymers (Basel) 2023; 15:4487. [PMID: 38231900 PMCID: PMC10707784 DOI: 10.3390/polym15234487] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/08/2023] [Revised: 10/29/2023] [Accepted: 11/07/2023] [Indexed: 01/19/2024] Open
Abstract
A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td5 of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.
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Affiliation(s)
- Tinghao Zhang
- Shenyang Special Rubber Basic Research Key Laboratory, Shenyang University of Chemical Technology, 11th Street, Shenyang Economic and Technological Development Zone, Shenyang 110142, China;
| | - Wenzheng Zhang
- Shenyang Special Rubber Basic Research Key Laboratory, Shenyang University of Chemical Technology, 11th Street, Shenyang Economic and Technological Development Zone, Shenyang 110142, China;
| | - Zichun Ding
- State Key Laboratory of Fine Chemicals, Liaoning High Performance Resin Engineering Research Center, Department of Polymer Science and Engineering, Dalian University of Technology, Dalian 116024, China; (Z.D.); (J.W.)
| | - Jianjian Jiao
- China-Spain Joint Laboratory on Material Science, Shenyang University of Chemical Technology, Shenyang Economic and Technological Development Zone, Shenyang 110142, China;
| | - Jinyan Wang
- State Key Laboratory of Fine Chemicals, Liaoning High Performance Resin Engineering Research Center, Department of Polymer Science and Engineering, Dalian University of Technology, Dalian 116024, China; (Z.D.); (J.W.)
| | - Wei Zhang
- Department of Technoloy, Xi’an Aibang Electromagnetic Technology Co., Ltd., Building B4, Biyuan Second Road Artificial Intelligence Industrial Park, Chang’an District, Xi’an 710199, China;
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Wang R, Zhang X, Guo S. Comb Polybutadiene with Long Polystyrene Side Chains: A Solution for Tunable Flowability and Enhancing Dielectric Properties in High-Frequency Printed Board Adhesive Films. ACS APPLIED MATERIALS & INTERFACES 2023; 15:41019-41030. [PMID: 37582186 DOI: 10.1021/acsami.3c09622] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/17/2023]
Abstract
Liquid high-vinyl polybutadiene (PB) possessed excellent dielectric properties, rendering them suitable candidates for adhesive films of high-frequency printed boards. However, their inherent low molecular weights resulted in chain slippage and overflow during processing, thereby diminishing the performance of the adhesive films. To address this challenge, we synthesized comb PB with long polystyrene side chains via reversible addition-fragmentation chain transfer (RAFT) polymerization, effectively immobilizing the PB backbone and restricting relative chain slippage. Controlling the length and number of "comb teeth" (styrene side chains) efficiently regulated the flowability of comb PB, achieving distinct flow states. Simultaneously, molecular dynamics simulations revealed that the elongated and inflexible polystyrene side chains of comb PB could create minuscule cavities, which impeded close packing of molecules and led to low dielectric constants (2.39/2.01, 1 MHz/10 GHz) and ultralow dielectric losses (0.0071/0.0016, 1 MHz/10 GHz). Furthermore, a series of printed circuit boards were fabricated using a comb PB adhesive film, and the signal loss was significantly reduced to 48.8% (19 GHz) in comparison with a commercial epoxy adhesive. This study demonstrated the potential of comb PB with polystyrene side chains to achieve desirable flow and dielectric properties by introducing tangles, large volume potential resistance, and microporosity compared with block structures.
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Affiliation(s)
- Ruikun Wang
- State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu 610065, China
| | - Xianlong Zhang
- State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu 610065, China
| | - Shaoyun Guo
- State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu 610065, China
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Lu J, Zhang S, Zhang L, Wang C, Min C. Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials. MATERIALS (BASEL, SWITZERLAND) 2023; 16:ma16103768. [PMID: 37241395 DOI: 10.3390/ma16103768] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/19/2023] [Revised: 05/07/2023] [Accepted: 05/15/2023] [Indexed: 05/28/2023]
Abstract
With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO2 hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm-1 k-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.
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Affiliation(s)
- Jiadong Lu
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Songli Zhang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Leizhi Zhang
- School of Civil Engineering, Southeast University, Nanjing 211189, China
| | - Chenxi Wang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Chunying Min
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
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Dong J, Sang X, Yin W, Chen X. Preparation of fluorinated epoxy‐phthalonitrile resins with excellent thermal stability and low dielectric constant. J Appl Polym Sci 2023. [DOI: 10.1002/app.53641] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/20/2023]
Affiliation(s)
- Jinghui Dong
- College of Materials Science and Engineering North China University of Science and Technology Tangshan China
| | - Xiaoming Sang
- College of Materials Science and Engineering North China University of Science and Technology Tangshan China
| | - Weihao Yin
- College of Materials Science and Engineering North China University of Science and Technology Tangshan China
| | - Xinggang Chen
- College of Materials Science and Engineering North China University of Science and Technology Tangshan China
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Methyl-substitution affects dielectric, thermal, mechanical properties, and shrinkage of fluorinated epoxy. POLYMER 2022. [DOI: 10.1016/j.polymer.2022.125012] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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