Preparation and properties of a fluorinated epoxy resin with low dielectric constant

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

Polymer materials with a low dielectric constant and low dielectric loss have the potential to be applied to high-frequency signal transmissions, such as mobile phone antennas and millimeter wave radars. Two types of diamines, 4,4'-diamino-p-tetraphenyl (DPT) and crown ether diamine (CED), were prepared for ternary copolymerization with BPDA in this study. Cross-links with molecular chains were formed, increasing molecular chain distance by utilizing rings of CED. The MPI films exhibit a good thermal performance with the increase in CED addition, with Tg > 380 °C and CTE from -4 × 10-6 K-1 to 5 × 10-6 K-1. The Young's modulus can reach 8.6 GPa, and the tensile strength is above 200 MPa when 5% and 7% CED are introduced. These MPI films exhibit good mechanical performances. The dielectric constant of PI-10% film can go as low as 3.17. Meanwhile, the relationship between dielectric properties and molecular structure has been demonstrated by Molecular Simulation (MS). PI molecules are separated by low dielectric groups, resulting in a decrease in the dielectric constant.

Synthesis of Biaryl Carboxylic Acids through a Cascade Suzuki-Miyaura Coupling/Friedel-Crafts Alkylation/Lewis-Acid-Catalyzed Rearrangement/Aromatization Process

In this study, we present a series of 1,3-dicarbonyls that can undergo a cascade Suzuki coupling, followed by a Friedel-Crafts reaction to produce molecules containing polycyclic alcohols. These polycyclic alcohols can then be converted into biaryl carboxylic acids through ring-opening rearrangement reactions catalyzed by a Lewis acid. The Friedel-Crafts reaction exhibits selective para-positioning of the hydroxyl group and demonstrates good compatibility with functional groups with a yield of up to 82%. Substrates with substituted hydroxyl groups can also be converted into biaryl carboxylic acids through a Lewis-acid-catalyzed ring-opening rearrangement.

Engineering the Dielectric Constants of Polymers: From Molecular to Mesoscopic Scales

Polymers are essential components of modern-day materials and are widely used in various fields. The dielectric constant, a key physical parameter, plays a fundamental role in the light-, electricity-, and magnetism-related applications of polymers, such as dielectric and electrical insulation, battery and photovoltaic fabrication, sensing and electrical contact, and signal transmission and communication. Over the past few decades, numerous efforts have been devoted to engineering the intrinsic dielectric constant of polymers, particularly by tailoring the induced and orientational polarization modes and ferroelectric domain engineering. Investigations into these methods have guided the rational design and on-demand preparation of polymers with desired dielectric constants. This review article exhaustively summarizes the dielectric constant engineering of polymers from molecular to mesoscopic scales, with emphasis on application-driven design and on-demand polymer synthesis rooted in polymer chemistry principles. Additionally, it explores the key polymer applications that can benefit from dielectric constant regulation and outlines the future prospects of this field.

A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability

A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td5 of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.

Comb Polybutadiene with Long Polystyrene Side Chains: A Solution for Tunable Flowability and Enhancing Dielectric Properties in High-Frequency Printed Board Adhesive Films

Liquid high-vinyl polybutadiene (PB) possessed excellent dielectric properties, rendering them suitable candidates for adhesive films of high-frequency printed boards. However, their inherent low molecular weights resulted in chain slippage and overflow during processing, thereby diminishing the performance of the adhesive films. To address this challenge, we synthesized comb PB with long polystyrene side chains via reversible addition-fragmentation chain transfer (RAFT) polymerization, effectively immobilizing the PB backbone and restricting relative chain slippage. Controlling the length and number of "comb teeth" (styrene side chains) efficiently regulated the flowability of comb PB, achieving distinct flow states. Simultaneously, molecular dynamics simulations revealed that the elongated and inflexible polystyrene side chains of comb PB could create minuscule cavities, which impeded close packing of molecules and led to low dielectric constants (2.39/2.01, 1 MHz/10 GHz) and ultralow dielectric losses (0.0071/0.0016, 1 MHz/10 GHz). Furthermore, a series of printed circuit boards were fabricated using a comb PB adhesive film, and the signal loss was significantly reduced to 48.8% (19 GHz) in comparison with a commercial epoxy adhesive. This study demonstrated the potential of comb PB with polystyrene side chains to achieve desirable flow and dielectric properties by introducing tangles, large volume potential resistance, and microporosity compared with block structures.

Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO₂ hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm^-1 k^-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.