Application of microencapsulation technology in silk fibers

Enhanced antifouling and antibacterial performances of novel UV-curable polysiloxane/microcapsules/Ag composite coatings for marine applications

Marine biological fouling is a widespread phenomenon encountered by various oceanic ships and naval vessels, resulting in enormous economic losses. Herein, novel 4,5-dichloro-2-octyl-isothiazolone@sodium alginate/chitosan microcapsules (DCOIT@ALG/CS) were prepared through composite gel method using DCOIT as core materials, ALG and CS as shells, and CaCl2 as the cross-linking agent. The formed microcapsules (MCs) with Ag nanoparticles (AgNPs) were then filled in UV-curable polysiloxane (UV-PDMS), followed by UV irradiation to yield UV-PDMS/microcapsules/AgNPs (UV-PDMS/MCs/Ag) composite coatings. The constructed micro-nano dual-scale surface using the MCs and AgNPs improved the antifouling and antibacterial properties of UV-PDMS/MCs/Ag coatings. The as-obtained UV-PDMS/MCs/Ag coatings exhibited a static contact angle of about 160°, shear strength of 2.24 MPa, tensile strength of 3.32 MPa and elongation at break of 212%. The synergistic bacteriostatic effects of DCOIT and AgNPs in UV-PDMS/MCs/Ag coatings resulted in a bactericidal rate of 200 μg ml-1 towards Escherichia coli and Staphylococcus aureus with saturation at 100% within 10 min. In sum, the proposed composite coatings look promising for future marine transportation, pipeline networks and undersea facilities.

Research progress of starch as microencapsulated wall material

Starch is non-toxic, low cost, and possesses good biocompatibility and biodegradability. As a natural polymer material, starch is an ideal choice for microcapsule wall materials. Starch-based microcapsules have a wide range of applications and application prospects in fields such as food, pharmaceuticals, cosmetics, and others. This paper firstly reviews the commonly used wall materials and preparation methods of starch-based microcapsules. Then the effect of starch wall materials on microcapsule properties is introduced in detail. It is expected to provide researchers with design inspiration and ideas for the development of starch-based microcapsules. Next the applications of starch-based microcapsules in various fields are presented. Finally, the future trends of starch-based microcapsules are discussed. Molecular simulation, green chemistry, and solutions to the main problems faced by resistant starch microcapsules may be the future research trends of starch-based microcapsules.

Promoting Silk Fibroin Adhesion to Stainless Steel Surfaces by Interface Tailoring

Bonding dissimilar materials has been a persistent challenge for decades. This paper presents a method to modify a stainless steel surface (316 L), routinely used in medical applications to enable the significant adhesion of a biopolymer (silk fibroin). The metallic surface was first covalently grafting with polyacrylamide, to enable a hydrogen bonding compatible surface. The polymerisation was initiated via the irreversible electrochemical reduction of a 4-nitrobenzene diazonium salt (20 mM), in the presence of an acrylamide monomer (1 M) at progressively faster scan rates (0.01 V/s to 1 V/s). Examination of the modified samples by FT-IR was consistent with successful surface modification, via observations of the acrylamide carbonyl (1600-1650 cm^-1 ) was observed, with more intense peaks correlating to slower scan rates. Similar observations were made with respect to increasing surface polarity, assessed by water contact angle. Reductions of >60° were observed for the grafted surfaces, relative to the unmodified control materials, indicating a surface able to undergo significant hydrogen bonding. The adhesion of silk to the metallic surface was quantified using a lap shear test, effectively using silk fibroin as an adhesive. Adhesion improvements of 5-7-fold, from 4.1 MPa to 29.3 MPa per gram of silk fibroin, were observed for the treated samples, highlighting the beneficial effect of this surface treatment. The methods developed in this work can be transferred to any metallic (or conductive) surface and can be tailored to complement any desired interface.