Electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1-vinylimidazole and 4-vinylpyridine

Progress of research on the bonding-strength improvement of two-layer adhesive-free flexible copper-clad laminates

The arrival of the 5G era has placed high demands on the electronic products. Developing thin, light, and portable electronic products capable of simultaneously improving the transmission rate and reducing the signal delay and transmission loss is necessary to meet such demands. The traditional three-layer, adhesive, flexible copper-clad laminate (3L-FCCL) cannot satisfy these demands because of its adhesive component. The large thickness and poor heat resistance disadvantages of 3L-FCCL can be avoided with a two-layer, adhesive-free, flexible copper-clad laminate (2L-FCCL). However, 2L-FCCL has low bonding strength. This work introduces the selection of conductor materials and insulating base films for flexible copper-clad laminates. Modification studies aimed at increasing the bonding performance of 2L-FCCL are summarized based on three aspects. These modification techniques include the surface treatment of copper foils, modification and surface treatment of polyimide films, and surface treatment of liquid-crystal polymers. Prospects are further provided.

Polymer Interface Molecular Engineering for E-Textiles

Wearable electronics, regarded as the next generation of conventional textiles, have been an important concept in the study of e-textiles. Conductive fibres are the upstreaming of e-textiles and have witnessed the booming development in recent years. However, little work has focused on improving the wash ability and durability of conductive fibres. As a new approach to manufacturing conductive fibres, Polymer Interface Molecular Engineering (PIME) is starting to be employed recently, to build up an interfacial layer on polymeric fibre surfaces; this interfacial layer services as a platform to anchor catalysts for the following metal Electroless Deposition (ELD). The designed interfacial layer significantly increases adhesion between polymeric substrates and coating metal layers, to improve the durability of e-textiles. This review highlights recent research into different molecular and architectural design strategies, and its potential application for wearable electronics. Further challenges and opportunities in this field are also discussed critically.

Comparison with adsorption of Re (VII) by two different γ-radiation synthesized silica-grafting of vinylimidazole/4-vinylpyridine adsorbents

Two silica gel based adsorbents for Re (VII), i.e. SS-MPTS-VIMH and SS-MPTS-VPQ, were synthesised. Silica gel was used as the matrix for γ-radiation grafting, and the monomer of 1-vinyl imidazole (VIM) and 4-vinylpyridine (4-VP) was grafted onto the silica silanized by methacryloxy propyl trimethoxyl silane, respectively. A VIM concentration of 2molL^-1 and an absorbed dose of 30kGy were the optimal grafting conditions for adsorbent SS-MPTS-VIM, and a 4-VP concentration of 4molL^-1 and an absorbed dose of 40kGy were the optimal grafting conditions for adsorbent SS-MPTS-VP. At the certain condition, the grafting yield of SS-MPTS-VIM was 30.1% and that of SS-MPTS-VP was 21.0%. The adsorption capacity of adsorbent SS-MPTS-VIMH was 145.99mgg^-1 and that of SS-MPTS-VPQ was 71.08mgg^-1 according to the Langmuir model. The adsorbent SS-MPTS-VPQ had better adsorption properties of acid resistance and anti-interference than SS-MPTS-VIMH. Dynamic column experiments showed that protonated adsorbent SS-MTPS-VIMH could be recycled with good performance while quaternized adsorbent SS-MPTS-VPQ could not. The adsorbent SS-MPTS-VIMH belongs to weak anion exchange adsorbent and SS-MPTS-VPQ belongs to strong anion exchange adsorbent. This study paves a way to the synthesis and application of a novel silica base adsorbents for Re (VII).

Improved adhesion properties of poly-p-phenyleneterephthamide fibers with a rubber matrix via UV-initiated grafting modification

Ultraviolet (UV) irradiation induced graft polymerization of glycidyl methacrylate (GMA) was performed to modify the surface properties of poly-p-phenyleneterephthamide (PPTA) fibers and the adhesion with rubber matrix was studied.

Highly conductive one-dimensional nanofibers: silvered electrospun silica nanofibers via poly(dopamine) functionalization

Using tetraethyl orthosilicate as a main raw material, silica nanofibers (SiNFs) were prepared through the combination of a sol-gel process and an electrospinning technique followed by pyrolysis. Surface modified electrospun SiNFs developed by self-polymerization of polydopamine on the surface (SiNFs-PDA) served as templates for the electroless plating of silver nanoparticles (Ag NPs), using glucose as a reducing agent. The electrical resistivity of silver coated SiNPs-PDA (SiNFs-PDA/Ag) was measured by the four-point probe method and was found to be as low as 0.02 mΩ·cm at room temperature. The morphology of SiNFs-PDA/Ag before and after the blending with silicon rubber indicated a strong interaction between the silver layer and the SiNFs-PDA. The electrical and mechanical properties of the silicon rubber filled with SiNFs-PDA/Ag were studied to demonstrate the conductive performance application of SiNFs-PDA/Ag.

A vapor-phase deposited polymer film to improve the adhesion of electroless-deposited copper layer onto various kinds of substrates

The adhesion of electrodeposited metal film to polymeric circuit board substrate is one of the key elements to successful miniaturization of electronic devices. However, as the size of the circuit pattern continuously decreases, a novel method is urgently required to increase the adhesion of the metal film on the substrate, especially on the smooth surface, which is critical to decrease the minimum feature size of the metal pattern. In this research, we developed an adhesion promoter layer by depositing metal chelating poly(4-vinylpyridine) (P4VP) film onto various organic and inorganic substrates via initiated chemical vapor deposition process (iCVD) to enhance the adhesion between the electroless deposited copper (Cu) layer and the substrate. The highest peel strength obtained between the electroless deposited Cu layer and P4VP coated substrate was 1.22 kgf/cm. Many advantageous characteristics of the adhesion promoter layer, including extreme thinness, the improved adhesion strength, conformal coverage, scalability of the deposition process, and short process time, will prompt the applicability of this adhesion promoter layer to industrial scale production.