Effects of Three Different Injection-Molding Methods on the Mechanical Properties and Electrical Conductivity of Carbon Nanotube/Polyethylene/Polyamide 6 Nanocomposite.
Polymers (Basel) 2019;
11:polym11111779. [PMID:
31671568 PMCID:
PMC6918180 DOI:
10.3390/polym11111779]
[Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/30/2019] [Revised: 10/25/2019] [Accepted: 10/28/2019] [Indexed: 11/17/2022] Open
Abstract
Morphological evolution under shear, during different injection processes, is an important issue in the phase morphology control, electrical conductivity, and physical properties of immiscible polymer blends. In the current work, conductive nanocomposites were produced through three different injection-molding methods, namely, conventional injection molding, multi-flow vibration injection molding (MFVIM), and pressure vibration injection molding (PVIM). Carbon nanotubes in the polyamide (PA) phase and the morphology of the PA phase were controlled by various injection methods. For MFVIM, multi-flows provided consistently stable shear forces, and mechanical properties were considerably improved after the application of high shear stress. Shear forces improved electrical property along the flow direction by forming an oriented conductive path. However, shear does not always promote the formation of conductive paths. Oscillatory shear stress from a vibration system of PVIM can tear a conductive path, thereby reducing electrical conductivity by six orders of magnitude. Although unstable high shear forces can greatly improve mechanical properties compared with the conventional injection molding (CIM) sample, oscillatory shear stress increases the dispersion of the PA phase. These interesting results provide insights into the production of nanocomposites with high mechanical properties and suitable electrical conductivity by efficient injection molding.
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